with a principal constituent of the material being a polymer

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CPC
H01L2224/0529

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0529with a principal constituent of the material being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
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Information Patent Grant
Conductive connections, structures with such connections, and metho...
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- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliable interconnect
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- Issue date May 1, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
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Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,153,517
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Information Patent Grant
Low viscosity precursor compositions and methods for the deposition...
- Patent number 7,691,664
- Issue date Apr 6, 2010
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
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- HONG-CHI YU
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Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
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- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION
- Publication number 20130087371
- Publication date Apr 11, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connector Between Die Pad and Z-Interconnect for Stacked...
- Publication number 20120119385
- Publication date May 17, 2012
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
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Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20080108218
- Publication date May 8, 2008
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- Toivo T. Kodas
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Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20080093422
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- Cabot Corporation
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- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20080093423
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- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
- Publication number 20070221887
- Publication date Sep 27, 2007
- Cabot Corporation
- Toivo T. Kodas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSES FOR FORMING PHOTOVOLTAIC FEATURES
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- Publication date Sep 6, 2007
- Cabot Corporation
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- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION...
- Publication number 20070181844
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Low viscosity precursor compositions and methods for the deposition...
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Low viscosity precursor compositions and methods for the deposition...
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Information Patent Application
Low viscosity precursor compositions and methods for the deposition...
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Information Patent Application
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Low viscosity precursor compositions and methods for the deposition...
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Low viscosity precursor compositions and methods for the deposition...
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- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip package with resilient conductive paste post and...

Conductive connections, structures with such connections, and metho...

Reliable interconnect

Conductive connections, structures with such connections, and metho...

Electrical connector between die pad and z-interconnect for stacked...

Electrical connector between die pad and z-interconnect for stacked...

Low viscosity precursor compositions and methods for the deposition...

Patents Applicationslast 30 patents

METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD

CHIP PACKAGE

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION

Electrical Connector Between Die Pad and Z-Interconnect for Stacked...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

PROCESSES FOR FORMING PHOTOVOLTAIC FEATURES

LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...

Low viscosity precursor compositions and methods for the deposition...