with a principal constituent of the material being a polymer

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H01L2224/0519

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0519with a principal constituent of the material being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,955,444
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Manikandan Arumugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with graphene layers
- Patent number 11,908,816
- Issue date Feb 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure and manufacturing method thereof and driving s...
- Patent number 11,715,715
- Issue date Aug 1, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of metal pad corrosion due to exposure to halogen
- Patent number 11,670,608
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having alignment pads and method of manufactur...
- Patent number 11,616,032
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Daniel Maurer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly employing metal-semiconductor bonding and metal-met...
- Patent number 11,562,975
- Issue date Jan 24, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with graphene layers and method for fabricatin...
- Patent number 11,424,198
- Issue date Aug 23, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor design for integrated magnetic devices
- Patent number 11,393,787
- Issue date Jul 19, 2022
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 11,315,845
- Issue date Apr 26, 2022
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package utilizing trace bump trace interconnection
- Patent number 11,121,108
- Issue date Sep 14, 2021
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 10,804,175
- Issue date Oct 13, 2020
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for reducing volume of resource allocation inf...
- Patent number 10,770,419
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Hee-Kwun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for reducing volume of resource allocation inf...
- Patent number 10,763,233
- Issue date Sep 1, 2020
- Samsung Electronics Co., Ltd.
- Hee-Kwun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package utilizing trace bump trace interconnection
- Patent number 10,707,183
- Issue date Jul 7, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid-cloth-based method for making TSV substrates
- Patent number 10,685,851
- Issue date Jun 16, 2020
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect using embedded carbon nanofibers
- Patent number 10,658,349
- Issue date May 19, 2020
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 10,622,319
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate package of chip on carrier and in cavity
- Patent number 10,522,433
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Juergen Hoegerl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip package utilizing trace bump trace interconnection
- Patent number 10,354,970
- Issue date Jul 16, 2019
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Durable bond pad structure for electrical connection to extreme env...
- Patent number 10,256,202
- Issue date Apr 9, 2019
- The United States of America as Represented by the Administrator of National...
- David J. Spry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,211,178
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,020,279
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnect
- Patent number 9,960,130
- Issue date May 1, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 9,929,120
- Issue date Mar 27, 2018
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicone adhesive composition and solid-state imaging device
- Patent number 9,796,892
- Issue date Oct 24, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 9,754,905
- Issue date Sep 5, 2017
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,698,075
- Issue date Jul 4, 2017
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite-containing substrates for LED packages
- Patent number 9,634,214
- Issue date Apr 25, 2017
- LedEngin, Inc.
- Xiantao Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 9,620,428
- Issue date Apr 11, 2017
- MONOLITH SEMICONDUCTOR INC.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PREVENTION OF METAL PAD CORROSION DUE TO EXPOSURE TO HALOGEN
- Publication number 20230317651
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20230299023
- Publication date Sep 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20220372274
- Publication date Nov 24, 2022
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...
- Publication number 20220352104
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220293541
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Manikandan ARUMUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...
- Publication number 20220238471
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS
- Publication number 20220093541
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS AND METHOD FOR FABRICATIN...
- Publication number 20220068848
- Publication date Mar 3, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTUR...
- Publication number 20210242148
- Publication date Aug 5, 2021
- INFINEON TECHNOLOGIES AG
- Daniel Maurer
- G01 - MEASURING TESTING
Information Patent Application
Metal Pad Corrosion Prevention
- Publication number 20210098399
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION
- Publication number 20190295980
- Publication date Sep 26, 2019
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR REDUCING VOLUME OF RESOURCE ALLOCATION INF...
- Publication number 20190206826
- Publication date Jul 4, 2019
- Samsung Electronics Co., Ltd.
- Hee-Kwun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES
- Publication number 20190164934
- Publication date May 30, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE
- Publication number 20180226374
- Publication date Aug 9, 2018
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINAL PASSIVATION FOR WAFER LEVEL WARPAGE AND ULK STRESS REDUCTION
- Publication number 20180108626
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminate package of chip on carrier and in cavity
- Publication number 20170316994
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Juergen HOEGERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE USING POLYMER-SOLDER BALL STRUCTURES AND...
- Publication number 20170271285
- Publication date Sep 21, 2017
- GLOBALFOUNDRIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
- Publication number 20160064344
- Publication date Mar 3, 2016
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES
- Publication number 20150340338
- Publication date Nov 26, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-BASED METAL DIFFUSION BARRIER
- Publication number 20140339700
- Publication date Nov 20, 2014
- Fan Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INTERCONNECTS IN WAFERS
- Publication number 20140342503
- Publication date Nov 20, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING GETTER LAYERS AND METHODS OF MAKIN...
- Publication number 20140299887
- Publication date Oct 9, 2014
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING GETTER LAYERS AND METHODS OF MAKIN...
- Publication number 20140299890
- Publication date Oct 9, 2014
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140193971
- Publication date Jul 10, 2014
- Seiko Instruments Inc.
- Masaru AKINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INTERCONNECTS IN WAFERS
- Publication number 20140099754
- Publication date Apr 10, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Multi-Layered UBM with I...
- Publication number 20140070410
- Publication date Mar 13, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING
- Publication number 20130341804
- Publication date Dec 26, 2013
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION
- Publication number 20130140694
- Publication date Jun 6, 2013
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME
- Publication number 20130009286
- Publication date Jan 10, 2013
- Samsung Electronics Co., Ltd.
- Young-lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120248618
- Publication date Oct 4, 2012
- Masaru Akino
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Method for fabricating semiconductor device with graphene layers

Metal bump structure and manufacturing method thereof and driving s...

Prevention of metal pad corrosion due to exposure to halogen

Semiconductor device having alignment pads and method of manufactur...

Bonded assembly employing metal-semiconductor bonding and metal-met...

Semiconductor device with graphene layers and method for fabricatin...

Semiconductor apparatus

Conductor design for integrated magnetic devices

Semiconductor devices comprising getter layers and methods of makin...

Flip chip package utilizing trace bump trace interconnection

Semiconductor devices comprising getter layers and methods of makin...

Apparatus and method for reducing volume of resource allocation inf...

Apparatus and method for reducing volume of resource allocation inf...

Flip chip package utilizing trace bump trace interconnection

Hybrid-cloth-based method for making TSV substrates

Interconnect using embedded carbon nanofibers

Final passivation for wafer level warpage and ULK stress reduction

Laminate package of chip on carrier and in cavity

Flip chip package utilizing trace bump trace interconnection

Durable bond pad structure for electrical connection to extreme env...

Semiconductor device including built-in crack-arresting film structure

Semiconductor device including built-in crack-arresting film structure

Reliable interconnect

Semiconductor device and its manufacturing method

Silicone adhesive composition and solid-state imaging device

Final passivation for wafer level warpage and ULK stress reduction

Integration of backside heat spreader for thermal management

Graphite-containing substrates for LED packages

Semiconductor devices comprising getter layers and methods of makin...

Patents Applicationslast 30 patents

PREVENTION OF METAL PAD CORROSION DUE TO EXPOSURE TO HALOGEN

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS

SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS AND METHOD FOR FABRICATIN...

SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTUR...

Metal Pad Corrosion Prevention

FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION

APPARATUS AND METHOD FOR REDUCING VOLUME OF RESOURCE ALLOCATION INF...

CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES

SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE

FINAL PASSIVATION FOR WAFER LEVEL WARPAGE AND ULK STRESS REDUCTION

Laminate package of chip on carrier and in cavity

INTEGRATED CIRCUIT PACKAGE USING POLYMER-SOLDER BALL STRUCTURES AND...

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES

GRAPHENE-BASED METAL DIFFUSION BARRIER

COMPLIANT INTERCONNECTS IN WAFERS

SEMICONDUCTOR DEVICES COMPRISING GETTER LAYERS AND METHODS OF MAKIN...

SEMICONDUCTOR DEVICES COMPRISING GETTER LAYERS AND METHODS OF MAKIN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

COMPLIANT INTERCONNECTS IN WAFERS

Semiconductor Device and Method of Forming Multi-Layered UBM with I...

SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING

FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION

SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME