with a principal constituent of the material being a polymer

Industry

CPC
H01L2224/8349

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8349with a principal constituent of the material being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Jointing material, fabrication method for semiconductor device usin...
- Patent number 11,476,399
- Issue date Oct 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dismantling a stack of at least three substrates
- Patent number 11,335,584
- Issue date May 17, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding scheme
- Patent number 11,328,972
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,075,186
- Issue date Jul 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Illumination device
- Patent number 10,989,396
- Issue date Apr 27, 2021
- Epistar Corporation
- Chih-Ping Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination device
- Patent number 10,655,826
- Issue date May 19, 2020
- Epistar Corporation
- Chih-Ping Ho
- F21 - LIGHTING
Information Patent Grant
Bonding method of fixing an object to a rough surface
- Patent number 10,483,231
- Issue date Nov 19, 2019
- Tsinghua University
- Xiang Jin
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Light emitting die (LED) packages and related methods
- Patent number 10,256,385
- Issue date Apr 9, 2019
- Cree, Inc.
- Jeffrey Carl Britt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having an underfill barrier
- Patent number 10,217,649
- Issue date Feb 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Jin-Yuan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding scheme
- Patent number 10,170,387
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,157,772
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate with alternating pattern of diamond and metal o...
- Patent number 9,812,375
- Issue date Nov 7, 2017
- II-VI Incorporated
- Wen-Qing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 9,735,043
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection body
- Patent number 9,673,168
- Issue date Jun 6, 2017
- Dexerials Corporation
- Kenichi Saruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination device capable of decreasing shadow of lighting effect
- Patent number 9,368,483
- Issue date Jun 14, 2016
- Formosa Epitaxy Incorporation
- Chi-Chih Pu
- F21 - LIGHTING
Information Patent Grant
Package carrier and manufacturing method thereof
- Patent number 9,236,364
- Issue date Jan 12, 2016
- Subtron Technology Co., Ltd.
- Shih-Hao Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary bonding scheme
- Patent number 9,202,799
- Issue date Dec 1, 2015
- Taiwan Semiconductor Manufactruing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow underfill for microelectronic packages
- Patent number 9,196,581
- Issue date Nov 24, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No flow underfill
- Patent number 8,697,492
- Issue date Apr 15, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic component, and electronic compo...
- Patent number 8,531,028
- Issue date Sep 10, 2013
- Sumitomo Bakelite Co., Ltd.
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic apparatus manufacturing method
- Patent number 7,687,314
- Issue date Mar 30, 2010
- Fujitsu Limited
- Shuichi Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for joining a silicon plate to a second plate
- Patent number 6,955,975
- Issue date Oct 18, 2005
- Robert Bosch GmbH
- Frank Reichenbach
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
HEIGHT ADAPTABLE MULTILAYER SPACER
- Publication number 20230197665
- Publication date Jun 22, 2023
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-COATED HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES
- Publication number 20230197555
- Publication date Jun 22, 2023
- ADVANCED MICRO DEVICES, INC.
- XIAOYANG JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING...
- Publication number 20230064442
- Publication date Mar 2, 2023
- INFINEON TECHNOLOGIES AG
- Chan Whai Augustine KAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR MANUFAC...
- Publication number 20220157802
- Publication date May 19, 2022
- Showa Denko Materials Co., Ltd.
- Shintaro HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF FIXING AN OBJECT TO A ROUGH SURFACE
- Publication number 20190206830
- Publication date Jul 4, 2019
- TSINGHUA UNIVERSITY
- XIANG JIN
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Temporary Bonding Scheme
- Publication number 20190139850
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER
- Publication number 20180358238
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Jin-Yuan LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20180012861
- Publication date Jan 11, 2018
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ji-Young OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Process
- Publication number 20170345708
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Bonding Scheme
- Publication number 20150155260
- Publication date Jun 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR...
- Publication number 20150035175
- Publication date Feb 5, 2015
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE DIE ATTACHMENT
- Publication number 20140284806
- Publication date Sep 25, 2014
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW UNDERFILL FOR MICROELECTRONIC PACKAGES
- Publication number 20140217584
- Publication date Aug 7, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ILLUMINATION DEVICE
- Publication number 20140103369
- Publication date Apr 17, 2014
- Formosa Epitaxy Incorporation
- Chi-Chih Pu
- F21 - LIGHTING
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20130324641
- Publication date Dec 5, 2013
- SUMITOMO BAKELITE CO., LTD.
- Kenzou MAEJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIGHT EMITTING DIE (LED) PACKAGES AND RELATED METHODS
- Publication number 20120187862
- Publication date Jul 26, 2012
- Jeffrey Carl Britt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO FLOW UNDERFILL
- Publication number 20120104595
- Publication date May 3, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20120061820
- Publication date Mar 15, 2012
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD FOR ENCAPSUL...
- Publication number 20120040499
- Publication date Feb 16, 2012
- Nagase Chemtex Corporation
- Kazuhiro Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Flip-chip underfill
- Publication number 20110115099
- Publication date May 19, 2011
- Vertical Circuits, Inc.
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS MANUFACTURING METHOD
- Publication number 20090170245
- Publication date Jul 2, 2009
- FUJITSU LIMITED
- Shuichi TAKEUCHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for joining a silicon plate to a second plate
- Publication number 20040082145
- Publication date Apr 29, 2004
- Frank Reichenbach
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Jointing material, fabrication method for semiconductor device usin...

Soldering a conductor to an aluminum layer

Method of dismantling a stack of at least three substrates

Temporary bonding scheme

Semiconductor package

Method for electrically contacting a component by galvanic connecti...

Illumination device

Semiconductor packaging structure and process

Illumination device

Bonding method of fixing an object to a rough surface

Light emitting die (LED) packages and related methods

Semiconductor device package having an underfill barrier

Temporary bonding scheme

Semiconductor packaging structure and process

Composite substrate with alternating pattern of diamond and metal o...

Semiconductor packaging structure and process

Connection body

Component built-in board and method of manufacturing the same, and...

Illumination device capable of decreasing shadow of lighting effect

Package carrier and manufacturing method thereof

Temporary bonding scheme

Flow underfill for microelectronic packages

No flow underfill

Method for manufacturing electronic component, and electronic compo...

Electronic apparatus manufacturing method

Method for joining a silicon plate to a second plate

Patents Applicationslast 30 patents

HEIGHT ADAPTABLE MULTILAYER SPACER

GRAPHENE-COATED HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES

CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING...

SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND METHOD FOR MANUFAC...

BONDING METHOD OF FIXING AN OBJECT TO A ROUGH SURFACE

Temporary Bonding Scheme

SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

Semiconductor Packaging Structure and Process

Temporary Bonding Scheme

ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR...

SEMICONDUCTOR DEVICE DIE ATTACHMENT

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

FLOW UNDERFILL FOR MICROELECTRONIC PACKAGES

ILLUMINATION DEVICE

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

LIGHT EMITTING DIE (LED) PACKAGES AND RELATED METHODS

NO FLOW UNDERFILL

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD FOR ENCAPSUL...

Flip-chip underfill

ELECTRONIC APPARATUS MANUFACTURING METHOD

Method for joining a silicon plate to a second plate