with a principal constituent of the material being a polymer

Industry

CPC
H01L2224/1339

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1339with a principal constituent of the material being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Forming of bump structure
- Patent number 11,329,018
- Issue date May 10, 2022
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive particle, and connection material, connection structure,...
- Patent number 10,412,838
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Compounds for electronic devices
- Patent number 9,780,311
- Issue date Oct 3, 2017
- Merck Patent GmbH
- Amir Hossain Parham
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Solder-on-die using water-soluble resist system and method
- Patent number 9,659,889
- Issue date May 23, 2017
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in board and method of manufacturing the same, and...
- Patent number 9,591,767
- Issue date Mar 7, 2017
- Fujikura Ltd.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
LED package and manufacturing method
- Patent number 9,461,027
- Issue date Oct 4, 2016
- Koninklijke Philips N.V.
- Josef Andreas Schug
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector
- Patent number 9,397,021
- Issue date Jul 19, 2016
- Lotes Co., Ltd.
- Ted Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of semiconductor package, method for fabricating...
- Patent number 9,269,670
- Issue date Feb 23, 2016
- SK Hynix Inc.
- Seong Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of semiconductor package, method for fabricating...
- Patent number 8,766,457
- Issue date Jul 1, 2014
- SK Hynix Inc.
- Seong Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip QFN structure using etched lead frame
- Patent number 8,525,309
- Issue date Sep 3, 2013
- Tessera, Inc.
- Chok Chia
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metal nanoink and process for producing the metal nanoink, and die...
- Patent number 8,328,928
- Issue date Dec 11, 2012
- Shinkawa Ltd.
- Toru Maeda
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Carbon nanotubes solder composite for high performance interconnect
- Patent number 8,100,314
- Issue date Jan 24, 2012
- Intel Corporation
- Daewoong Suh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device, mounting circuit board, method of producing t...
- Patent number 6,909,180
- Issue date Jun 21, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump electrode for connecting electronic components
- Patent number 5,477,087
- Issue date Dec 19, 1995
- Matsushita Electric Industrial Co., Ltd.
- Tetsuo Kawakita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FORMING OF BUMP STRUCTURE
- Publication number 20210125950
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PARTICLE, AND CONNECTION MATERIAL, CONNECTION STRUCTURE,...
- Publication number 20170347463
- Publication date Nov 30, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- ARATA KISHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT
- Publication number 20140374005
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...
- Publication number 20140328032
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20140268574
- Publication date Sep 18, 2014
- FUJIKURA LTD.
- Kazuhisa Itoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20140252652
- Publication date Sep 11, 2014
- SK HYNIX INC.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUNDS FOR ELECTRONIC DEVICES
- Publication number 20140225040
- Publication date Aug 14, 2014
- Merck Patent GmbH Patents & Scientific Information
- Amir Hossain Parham
- C07 - ORGANIC CHEMISTRY
Information Patent Application
MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS
- Publication number 20140205851
- Publication date Jul 24, 2014
- Ravindranath V. MAHAJAN
- B32 - LAYERED PRODUCTS
Information Patent Application
GOLD BONDING IN SEMICONDUCTOR DEVICES USING POROUS GOLD
- Publication number 20140061921
- Publication date Mar 6, 2014
- Alcatel-Lucent USA, Incorporated
- Nagesh Basavanhally
- G02 - OPTICS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20130001280
- Publication date Jan 3, 2013
- SHINKAWA LTD.
- Toru MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME
- Publication number 20130001757
- Publication date Jan 3, 2013
- Tessera. Inc.
- Chok Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...
- Publication number 20120139126
- Publication date Jun 7, 2012
- Hynix Semiconductor Inc.
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20110114708
- Publication date May 19, 2011
- SHINKAWAL LTD
- Toru Maeda
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CARBON NANOTUBES SOLDER COMPOSITE FOR HIGH PERFORMANCE INTERCONNECT
- Publication number 20100126631
- Publication date May 27, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microstructure Apparatus and Method for Manufacturing Microstructur...
- Publication number 20100059244
- Publication date Mar 11, 2010
- KYOCERA CORPORATION
- Itaru Ishii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20090246474
- Publication date Oct 1, 2009
- Panasonic Corporation
- Daisuke Sakurai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Nanoscale probes for electrophysiological applications
- Publication number 20070187840
- Publication date Aug 16, 2007
- Ludovico M. Dell'Acqua-Bellavitis
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Carbon nanotubes solder composite for high performance interconnect
- Publication number 20070145097
- Publication date Jun 28, 2007
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
- Publication number 20050163982
- Publication date Jul 28, 2005
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, mounting circuit board, method of producing t...
- Publication number 20030049425
- Publication date Mar 13, 2003
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Sintering materials and attachment methods using same

Forming of bump structure

Low pressure sintering powder

Contact structures with porous networks for solder connections, and...

Engineered polymer-based electronic materials

Expanded head pillar for bump bonds

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Method for manufacturing semiconductor apparatus, method for manufa...

Conductive particle, and connection material, connection structure,...

Method for producing metal ball, joining material, and metal ball

Method for manufacturing metal powder

Compounds for electronic devices

Solder-on-die using water-soluble resist system and method

Component built-in board and method of manufacturing the same, and...

Electronic component-mounted structure, IC card and COF package

LED package and manufacturing method

Electrical connector

Bonding structure of semiconductor package, method for fabricating...

Bonding structure of semiconductor package, method for fabricating...

Flip-chip QFN structure using etched lead frame

Metal nanoink and process for producing the metal nanoink, and die...

Carbon nanotubes solder composite for high performance interconnect

Semiconductor device, mounting circuit board, method of producing t...

Bump electrode for connecting electronic components

Patents Applicationslast 30 patents

FORMING OF BUMP STRUCTURE

EXPANDED HEAD PILLAR FOR BUMP BONDS

CONDUCTIVE PARTICLE, AND CONNECTION MATERIAL, CONNECTION STRUCTURE,...

FORMATION OF CONDUCTIVE CIRCUIT

CHIP ARRANGEMENT, CHIP CARD ARRANGEMENT AND METHOD FOR MANUFACTURIN...

COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND...

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

COMPOUNDS FOR ELECTRONIC DEVICES

MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS

GOLD BONDING IN SEMICONDUCTOR DEVICES USING POROUS GOLD

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

FLIP-CHIP QFN STRUCTURE USING ETCHED LEAD FRAME

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE, METHOD FOR FABRICATING...

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

CARBON NANOTUBES SOLDER COMPOSITE FOR HIGH PERFORMANCE INTERCONNECT

Microstructure Apparatus and Method for Manufacturing Microstructur...

ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING...

Nanoscale probes for electrophysiological applications

Carbon nanotubes solder composite for high performance interconnect

Circuit substrate for packaging semiconductor device, method for pr...

Semiconductor device, mounting circuit board, method of producing t...