with a principal constituent of the material being a polymer

Industry

CPC
H01L2224/0579

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0579with a principal constituent of the material being a polymer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,734,353
- Issue date Aug 4, 2020
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods and apparatus for wafer-level die bridge
- Patent number 10,651,126
- Issue date May 12, 2020
- Applied Materials, Inc.
- Chien-Kang Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,410,991
- Issue date Sep 10, 2019
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging sensing device and method for forming the same
- Patent number 10,140,498
- Issue date Nov 27, 2018
- Xintec Inc.
- Tsang-Yu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid low metal loading flux
- Patent number 9,950,393
- Issue date Apr 24, 2018
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging and manufacturing method thereof
- Patent number 9,935,044
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing a semiconductor substrate and a method for pr...
- Patent number 9,673,096
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for flexible substrates
- Patent number 9,502,271
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging and manufacturing method thereof
- Patent number 9,355,927
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiu-Jen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method
- Patent number 9,123,544
- Issue date Sep 1, 2015
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless die attach to a direct bonded aluminum substrate
- Patent number 9,111,782
- Issue date Aug 18, 2015
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless die attach to a direct bonded aluminum substrate
- Patent number 8,716,864
- Issue date May 6, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with coupling features and meth...
- Patent number 8,710,670
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,653,667
- Issue date Feb 18, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,586,480
- Issue date Nov 19, 2013
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging ultra-thin chip with solder ball thermo-compre...
- Patent number 8,563,417
- Issue date Oct 22, 2013
- Alpha & Omega Semiconductor, Inc.
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging and interconnection of integrated circuits
- Patent number 7,964,964
- Issue date Jun 21, 2011
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic element that includes multilayered bonding interface bet...
- Patent number 7,960,834
- Issue date Jun 14, 2011
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of packaging and interconnection of integrated circuits
- Patent number 7,618,844
- Issue date Nov 17, 2009
- Intelleflex Corporation
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIES INCLUDING RECESSES FOR FACILITATING MECHANICAL D...
- Publication number 20240047424
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20230411317
- Publication date Dec 21, 2023
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL AND CONNECTION METHOD
- Publication number 20230075929
- Publication date Mar 9, 2023
- SONY GROUP CORPORATION
- JO UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20230066395
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING DISPLAY APPARATUS, DISPLAY APPARATUS, AND E...
- Publication number 20190319221
- Publication date Oct 17, 2019
- Sony Semiconductor Solutions Corporation
- Tomokazu Ohchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
Warpage Control for Flexible Substrates
- Publication number 20140302642
- Publication date Oct 9, 2014
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20140225267
- Publication date Aug 14, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EX...
- Publication number 20140183716
- Publication date Jul 3, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140145343
- Publication date May 29, 2014
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control for Flexible Substrates
- Publication number 20140131897
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...
- Publication number 20140042624
- Publication date Feb 13, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20130341379
- Publication date Dec 26, 2013
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20130328204
- Publication date Dec 12, 2013
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COUPLING FEATURES AND METH...
- Publication number 20130154107
- Publication date Jun 20, 2013
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRE...
- Publication number 20130130443
- Publication date May 23, 2013
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20130099383
- Publication date Apr 25, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION
- Publication number 20130087371
- Publication date Apr 11, 2013
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20100164090
- Publication date Jul 1, 2010
- Sang-Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging and interconnection of integrated circuits
- Publication number 20100038770
- Publication date Feb 18, 2010
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090166859
- Publication date Jul 2, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Jingli Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Element, Electronic Element Device Using the Same, and M...
- Publication number 20090039507
- Publication date Feb 12, 2009
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging and interconnection of integrated circuits
- Publication number 20070040272
- Publication date Feb 22, 2007
- INTELLEFLEX CORPORATION
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with a principal constituent of the material being a polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adhesive bonding composition and method of use

Adhesive bonding composition and method of use

Methods and apparatus for wafer-level die bridge

Adhesive bonding composition and method of use

Wafer-level packaging sensing device and method for forming the same

Conductive connections, structures with such connections, and metho...

Hybrid low metal loading flux

Semiconductor packaging and manufacturing method thereof

Electronic devices with semiconductor die attached with sintered me...

Conductive connections, structures with such connections, and metho...

Method for processing a semiconductor substrate and a method for pr...

Electronic devices with semiconductor die coupled to a thermally co...

Warpage control for flexible substrates

Semiconductor packaging and manufacturing method thereof

Semiconductor device and method

Solderless die attach to a direct bonded aluminum substrate

Solderless die attach to a direct bonded aluminum substrate

Integrated circuit packaging system with coupling features and meth...

Power MOSFET having selectively silvered pads for clip and bond wir...

Power MOSFET having selectively silvered pads for clip and bond wir...

Method for packaging ultra-thin chip with solder ball thermo-compre...

Method of packaging and interconnection of integrated circuits

Electronic element that includes multilayered bonding interface bet...

Method of packaging and interconnection of integrated circuits

Patents Applicationslast 30 patents

SEMICONDUCTOR DIES INCLUDING RECESSES FOR FACILITATING MECHANICAL D...

CHIP PACKAGE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

TERMINAL AND CONNECTION METHOD

SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

METHOD OF MANUFACTURING DISPLAY APPARATUS, DISPLAY APPARATUS, AND E...

HYBRID LOW METAL LOADING FLUX

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

Warpage Control for Flexible Substrates

Solderless Die Attach to a Direct Bonded Aluminum Substrate

SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EX...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Warpage Control for Flexible Substrates

Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...

HYBRID LOW METAL LOADING FLUX

Solderless Die Attach to a Direct Bonded Aluminum Substrate

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COUPLING FEATURES AND METH...

METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRE...

Semiconductor Device and Method

ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION

SEMICONDUCTOR PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF

Method of packaging and interconnection of integrated circuits

Semiconductor device and method of manufacturing the same

Electronic Element, Electronic Element Device Using the Same, and M...

Method of packaging and interconnection of integrated circuits