with a principal constituent of the material being a solid not provided for in groups H01L2224/131 - H01L2224/13191

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13193with a principal constituent of the material being a solid not provided for in groups H01L2224/131 - H01L2224/13191

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Patents Grantslast 30 patents

Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for integrated circuits packaging with increas...
- Patent number 10,381,326
- Issue date Aug 13, 2019
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-joining of microelectronic components with conductively self-adj...
- Patent number 10,297,570
- Issue date May 21, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper nanorod-based thermal interface material (TIM)
- Patent number 9,865,521
- Issue date Jan 9, 2018
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with socket plug interconnection structures
- Patent number 9,842,822
- Issue date Dec 12, 2017
- SK hynix Inc.
- Hyeong Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer structure for a semiconductor device and a method of for...
- Patent number 9,806,013
- Issue date Oct 31, 2017
- Institute of Technical Education
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with liquid molding compound and post-passivation interconnect
- Patent number 9,754,908
- Issue date Sep 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising a nanotube-based interface connection...
- Patent number 9,145,294
- Issue date Sep 29, 2015
- STMicroelectronics S.R.L.
- Davide Giuseppe Patti
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Bundle of long thin carbon structures, manufacturing method therefo...
- Patent number 9,085,831
- Issue date Jul 21, 2015
- Fujitsu Limited
- Daiyu Kondo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for obtaining three-dimensional actin structures and uses th...
- Patent number 9,070,702
- Issue date Jun 30, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Christophe Gabriel
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Carbon nanotube structures for enhancement of thermal dissipation f...
- Patent number 8,933,559
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Bump for semiconductor package, semiconductor package having bump,...
- Patent number 8,823,183
- Issue date Sep 2, 2014
- SK Hynix Inc.
- Ki Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly and semiconductor package including a solder...
- Patent number 8,710,657
- Issue date Apr 29, 2014
- Samsung Electronics Co., Ltd.
- Jeong-woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for relieving stress and improving heat management in a 3D c...
- Patent number 8,653,671
- Issue date Feb 18, 2014
- STMicroelectronics, Inc.
- John Hongguang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bundle of long thin carbon structures, manufacturing method thereof...
- Patent number 8,632,885
- Issue date Jan 21, 2014
- Fujitsu Limited
- Daiyu Kondo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Bundle of long thin carbon structures, manufacturing method thereof...
- Patent number 8,501,321
- Issue date Aug 6, 2013
- Fujitsu Limited
- Daiyu Kondo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Structure, electronic device, and method for fabricating a structure
- Patent number 8,350,160
- Issue date Jan 8, 2013
- Kabushiki Kaisha Toshiba
- Tadashi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Carbon nanotube structures for enhancement of thermal dissipation f...
- Patent number 8,299,605
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Veeraraghavan S Basker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,293,577
- Issue date Oct 23, 2012
- Fujitsu Limited
- Yuji Awano
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for electrically connecting to a contact of a microelectroni...
- Patent number 8,042,724
- Issue date Oct 25, 2011
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Andreas Ostmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive nanowires for electrical interconnect
- Patent number 7,960,653
- Issue date Jun 14, 2011
- Hewlett-Packard Development Company, L.P.
- Shih-Yuan Wang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 7,830,009
- Issue date Nov 9, 2010
- Fujitsu Limited
- Yuji Awano
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Composite interconnect
- Patent number 7,791,194
- Issue date Sep 7, 2010
- Oracle America, Inc.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package interconnect and method of fabrication thereof
- Patent number 7,727,814
- Issue date Jun 1, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package interconnect and method of fabrication thereof
- Patent number 7,402,909
- Issue date Jul 22, 2008
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic chip and electronic chip assembly
- Patent number 7,301,779
- Issue date Nov 27, 2007
- Infineon Technologies AG
- Wolfgang Hönlein
- G01 - MEASURING TESTING
Information Patent Grant
Self-assembled nanometer conductive bumps and method for fabricating
- Patent number 6,989,325
- Issue date Jan 24, 2006
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
- Publication number 20240063165
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Ramesh NALLAVELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230154877
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20220102603
- Publication date Mar 31, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...
- Publication number 20220093549
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method for Fabricating a Semiconductor Device...
- Publication number 20180218992
- Publication date Aug 2, 2018
- INFINEON TECHNOLOGIES AG
- Valerie Vivares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)
- Publication number 20170133296
- Publication date May 11, 2017
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160190080
- Publication date Jun 30, 2016
- Siliconware Precision Industries Co., Ltd.
- Yi-Cheih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Directly Sawing Wafers Covered with Liquid Molding Compound
- Publication number 20160056117
- Publication date Feb 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Directly Sawing Wafers Covered with Liquid Molding Compound
- Publication number 20140252597
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Peng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140239428
- Publication date Aug 28, 2014
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS
- Publication number 20140205851
- Publication date Jul 24, 2014
- Ravindranath V. MAHAJAN
- B32 - LAYERED PRODUCTS
Information Patent Application
BUMP WITH NANOLAMINATED STRUCTURE, PACKAGE STRUCTURE OF THE SAME, A...
- Publication number 20120305298
- Publication date Dec 6, 2012
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...
- Publication number 20120168931
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR RELIEVING STRESS AND IMPROVING HEAT MANAGEMEN...
- Publication number 20120112356
- Publication date May 10, 2012
- STMicroelectronics, Inc.
- John Hongguang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP,...
- Publication number 20120091584
- Publication date Apr 19, 2012
- Hynix Semiconductor Inc.
- Ki Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY AND SEMICONDUCTOR PACKAGE INCLUDING A SOLDER...
- Publication number 20120086123
- Publication date Apr 12, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- JEONG-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUNDLE OF LONG THIN CARBON STRUCTURES, MANUFACTURING METHOD THEREFO...
- Publication number 20120040523
- Publication date Feb 16, 2012
- Fujitsu Limited
- Daiyu KONDO
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
ELECTRONIC DEVICE COMPRISING A NANOTUBE-BASED INTERFACE CONNECTION...
- Publication number 20110316173
- Publication date Dec 29, 2011
- STMicroelectronics S.r.l.
- Davide Giuseppe PATTI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING A STRUCTURE
- Publication number 20110147177
- Publication date Jun 23, 2011
- Kabushiki Kaisha Toshiba
- Tadashi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20110021016
- Publication date Jan 27, 2011
- FUJITSU LIMITED
- Yuji Awano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Nanowires For Electrical Interconnect
- Publication number 20100018747
- Publication date Jan 28, 2010
- Shih-Yuan Wang
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITE INTERCONNECT
- Publication number 20090256255
- Publication date Oct 15, 2009
- SUN MICROSYSTEMS, INC.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...
- Publication number 20090121343
- Publication date May 14, 2009
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Application
Microelectronic package interconnect and method of fabrication thereof
- Publication number 20090068830
- Publication date Mar 12, 2009
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20080169563
- Publication date Jul 17, 2008
- FUJITSU LIMITED
- Yuji Awano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUNDLE OF LONG THIN CARBON STRUCTURES, MANUFACTURING METHOD THEREOF...
- Publication number 20080131352
- Publication date Jun 5, 2008
- Fujitsu Limited
- Daiyu KONDO
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
Method for electrically connecting to a contact of a microelectroni...
- Publication number 20080061115
- Publication date Mar 13, 2008
- Andreas Ostmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Nanoscale probes for electrophysiological applications
- Publication number 20070187840
- Publication date Aug 16, 2007
- Ludovico M. Dell'Acqua-Bellavitis
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Microelectronic package interconnect and method of fabrication thereof
- Publication number 20060243958
- Publication date Nov 2, 2006
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with a principal constituent of the material being a solid not provided for in groups H01L2224/131 - H01L2224/13191

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Expanded head pillar for bump bonds

Structure and method for integrated circuits packaging with increas...

3D-joining of microelectronic components with conductively self-adj...

Copper nanorod-based thermal interface material (TIM)

Semiconductor packages with socket plug interconnection structures

Multilayer structure for a semiconductor device and a method of for...

Wafer with liquid molding compound and post-passivation interconnect

Electronic device comprising a nanotube-based interface connection...

Bundle of long thin carbon structures, manufacturing method therefo...

Method for obtaining three-dimensional actin structures and uses th...

Carbon nanotube structures for enhancement of thermal dissipation f...

Bump for semiconductor package, semiconductor package having bump,...

Semiconductor assembly and semiconductor package including a solder...

System for relieving stress and improving heat management in a 3D c...

Bundle of long thin carbon structures, manufacturing method thereof...

Bundle of long thin carbon structures, manufacturing method thereof...

Structure, electronic device, and method for fabricating a structure

Carbon nanotube structures for enhancement of thermal dissipation f...

Semiconductor package and method of manufacturing the same

Method for electrically connecting to a contact of a microelectroni...

Conductive nanowires for electrical interconnect

Semiconductor package and method of manufacturing the same

Composite interconnect

Microelectronic package interconnect and method of fabrication thereof

Microelectronic package interconnect and method of fabrication thereof

Electronic chip and electronic chip assembly

Self-assembled nanometer conductive bumps and method for fabricating

Patents Applicationslast 30 patents

CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...

EXPANDED HEAD PILLAR FOR BUMP BONDS

Semiconductor Device, Method for Fabricating a Semiconductor Device...

COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

Directly Sawing Wafers Covered with Liquid Molding Compound

Directly Sawing Wafers Covered with Liquid Molding Compound

CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS

BUMP WITH NANOLAMINATED STRUCTURE, PACKAGE STRUCTURE OF THE SAME, A...

CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...

SYSTEM AND METHOD FOR RELIEVING STRESS AND IMPROVING HEAT MANAGEMEN...

BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP,...

SEMICONDUCTOR ASSEMBLY AND SEMICONDUCTOR PACKAGE INCLUDING A SOLDER...

BUNDLE OF LONG THIN CARBON STRUCTURES, MANUFACTURING METHOD THEREFO...

ELECTRONIC DEVICE COMPRISING A NANOTUBE-BASED INTERFACE CONNECTION...

STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING A STRUCTURE

Semiconductor package and method of manufacturing the same

Conductive Nanowires For Electrical Interconnect

COMPOSITE INTERCONNECT

CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...

Microelectronic package interconnect and method of fabrication thereof

Semiconductor package and method of manufacturing the same

BUNDLE OF LONG THIN CARBON STRUCTURES, MANUFACTURING METHOD THEREOF...

Method for electrically connecting to a contact of a microelectroni...

Nanoscale probes for electrophysiological applications

Microelectronic package interconnect and method of fabrication thereof