with a staggered arrangement

Industry

CPC
H01L2224/17153

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17153with a staggered arrangement

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 11,626,372
- Issue date Apr 11, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip interconnection and circuit board thereof
- Patent number 11,322,437
- Issue date May 3, 2022
- Chipbond Technology Corporation
- Yu-Chen Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 10,916,514
- Issue date Feb 9, 2021
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having wiring structure, solid image pickup elem...
- Patent number 8,334,578
- Issue date Dec 18, 2012
- Kinki University
- Takeharu Eto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240213166
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Se-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES
- Publication number 20240178119
- Publication date May 30, 2024
- Intel Corporation
- Mohammad Mamunur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230139657
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Hui Min YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP INTERCONNECTION AND CIRCUIT BOARD THEREOF
- Publication number 20210265255
- Publication date Aug 26, 2021
- Chipbond Technology Corporation
- Yu-Chen Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit having wiring structure, solid image pickup elem...
- Publication number 20100244176
- Publication date Sep 30, 2010
- Takeharu Eto
- H01 - BASIC ELECTRIC ELEMENTS

with a staggered arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-free frame design for silicon bridges for semiconductor packages

Metal-free frame design for silicon bridges for semiconductor packages

Metal-free frame design for silicon bridges for semiconductor packages

Flip chip interconnection and circuit board thereof

Metal-free frame design for silicon bridges for semiconductor packages

Integrated circuit having wiring structure, solid image pickup elem...

Patents Applicationslast 30 patents

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

FLIP CHIP INTERCONNECTION AND CIRCUIT BOARD THEREOF

Integrated circuit having wiring structure, solid image pickup elem...