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with a staggered arrangement

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  • H01L2224/06153
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06153with a staggered arrangement
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250070063
    • Publication date Feb 27, 2025
    • NUVOTON TECHNOLOGY CORPORATION JAPAN
    • Hironao NAKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240395749
    • Publication date Nov 28, 2024
    • NUVOTON TECHNOLOGY CORPORATION JAPAN
    • Yusuke ITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device
    • Publication number 20240363622
    • Publication date Oct 31, 2024
    • Rohm Co., Ltd.
    • Naoki Takahashi
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR SEMICONDUCTOR DE...
    • Publication number 20240348046
    • Publication date Oct 17, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Mikito SAKAKIBARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DRIVE CHIP AND DISPLAY PANEL
    • Publication number 20240038700
    • Publication date Feb 1, 2024
    • WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Shuya Dong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE AND DRIVER
    • Publication number 20230411324
    • Publication date Dec 21, 2023
    • Sharp Display Technology Corporation
    • Shinzoh MURAKAMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20230015243
    • Publication date Jan 19, 2023
    • SAMSUNG DISPLAY CO., LTD.
    • Chungi You
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210175229
    • Publication date Jun 10, 2021
    • Rohm Co., Ltd.
    • Naoki Takahashi
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20190273108
    • Publication date Sep 5, 2019
    • RENESAS ELECTRONICS CORPORATION
    • Hidenori SATO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180269200
    • Publication date Sep 20, 2018
    • Rohm Co., Ltd.
    • Naoki Takahashi
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20180014405
    • Publication date Jan 11, 2018
    • SAMSUNG DISPLAY CO., LTD.
    • BYOUNG YONG KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20150287724
    • Publication date Oct 8, 2015
    • RENESAS ELECTRONICS CORPORATION
    • Takahiro HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Segmented Bond Pads and Methods of Fabrication Thereof
    • Publication number 20150035171
    • Publication date Feb 5, 2015
    • INFINEON TECHNOLOGIES AG
    • Albert Birner
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP AND MANUFACTURING METHOD THEREOF
    • Publication number 20140299984
    • Publication date Oct 9, 2014
    • Advanpack Solutions Pte Ltd
    • Hwee-Seng Jimmy Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device
    • Publication number 20130341728
    • Publication date Dec 26, 2013
    • RENESAS ELECTRONICS CORPORATION
    • Takahiro HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP-ON-FILM DEVICE
    • Publication number 20130292819
    • Publication date Nov 7, 2013
    • NOVATEK MICROELECTRONICS CORP.
    • Chiao-Ling Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE CAPABLE OF SWITCHING OPERATION MODES
    • Publication number 20130093070
    • Publication date Apr 18, 2013
    • Renesas Electronics Corporation
    • Hiroyoshi Fukuda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20130075727
    • Publication date Mar 28, 2013
    • PANASONIC CORPORATION
    • Masao TAKAHASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    • Publication number 20120309167
    • Publication date Dec 6, 2012
    • Sang-Wook PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20120241970
    • Publication date Sep 27, 2012
    • PANASONIC CORPORATION
    • Manabu OHNISHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MIXED WIRE BONDING PROFILE AND PAD-LAYOUT CONFIGURATIONS IN IC PACK...
    • Publication number 20120228783
    • Publication date Sep 13, 2012
    • Ng Kok SIANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP AND MANUFACTURING METHOD THEREOF
    • Publication number 20120220118
    • Publication date Aug 30, 2012
    • Advanpack Solutions Pte Ltd
    • Hwee-Seng Jimmy CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR
    • Publication number 20120194217
    • Publication date Aug 2, 2012
    • LSI Corporation
    • Mark F. Turner
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE AND PHYSICAL LAYER INTERFACE ARRANGEMENT
    • Publication number 20120126398
    • Publication date May 24, 2012
    • VIA TECHNOLOGIES, INC.
    • Wei-Chih Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR
    • Publication number 20120119785
    • Publication date May 17, 2012
    • LSI Corporation
    • Mark F. Turner
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20120083073
    • Publication date Apr 5, 2012
    • Renesas Electronics Corporation
    • Yusuke TANUMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20120007255
    • Publication date Jan 12, 2012
    • Renesas Electronics Corporation
    • Hiroshi SHIROTA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20110266540
    • Publication date Nov 3, 2011
    • PANASONIC CORPORATION
    • Masao TAKAHASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device capable of switching operation modes
    • Publication number 20110253438
    • Publication date Oct 20, 2011
    • RENESAS ELECTRONICS CORPORATION
    • Hiroyoshi Fukuda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20110193215
    • Publication date Aug 11, 2011
    • Renesas Electronics Corporation
    • Masahiro TOYAMA
    • H01 - BASIC ELECTRIC ELEMENTS