with a staggered arrangement

Industry

CPC
H01L2224/06153

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06153with a staggered arrangement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,074,158
- Issue date Aug 27, 2024
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 12,040,349
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,698
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 11,469,224
- Issue date Oct 11, 2022
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Solid-state imaging device including a sensor substrate and a logic...
- Patent number 10,978,505
- Issue date Apr 13, 2021
- Renesas Electronics Corporation
- Hidenori Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,964,688
- Issue date Mar 30, 2021
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 10,271,429
- Issue date Apr 23, 2019
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,262,962
- Issue date Apr 16, 2019
- TOSHIBA MEMORY CORPORATION
- Yoshihiro Monma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and manufacturing method thereof
- Patent number 9,362,206
- Issue date Jun 7, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with output circuit and pad arrangements
- Patent number 9,343,460
- Issue date May 17, 2016
- Renesas Electronics Corporation
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire bonding profile and pad-layout configurations in IC pack...
- Patent number 9,184,151
- Issue date Nov 10, 2015
- Cypress Semiconductor Corporation
- Ng Kok Siang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 9,159,680
- Issue date Oct 13, 2015
- Samsung Electronics Co., Ltd.
- Sang-Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and physical layer interface arrangement
- Patent number 8,912,656
- Issue date Dec 16, 2014
- Via Technologies, Inc.
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for fine pitch semiconductor devices and manufactu...
- Patent number 8,846,519
- Issue date Sep 30, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for stacking a memory chip above an integrated...
- Patent number 8,716,876
- Issue date May 6, 2014
- Altera Corporation
- Richard G. Smolen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,669,555
- Issue date Mar 11, 2014
- Panasonic Corporation
- Masao Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of switching operation modes
- Patent number 8,633,407
- Issue date Jan 21, 2014
- Renesas Electronics Corporation
- Hiroyoshi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with core region and bond pad a...
- Patent number 8,603,909
- Issue date Dec 10, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with output circuit arrangement
- Patent number 8,552,561
- Issue date Oct 8, 2013
- Renesas Electronics Corporation
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with I/O cell and external connection terminal...
- Patent number 8,519,551
- Issue date Aug 27, 2013
- Fujitsu Semiconductor Limited
- Toru Osajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a pad-disposition restriction area
- Patent number 8,456,024
- Issue date Jun 4, 2013
- Panasonic Corporation
- Manabu Ohnishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,389,339
- Issue date Mar 5, 2013
- Renesas Electronics Corporation
- Yusuke Tanuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of switching operation modes
- Patent number 8,344,269
- Issue date Jan 1, 2013
- Renesas Electronics Corporation
- Hiroyoshi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,338,829
- Issue date Dec 25, 2012
- Panasonic Corporation
- Masao Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and inspection method therefor
- Patent number 8,334,201
- Issue date Dec 18, 2012
- Renesas Electronics Corporation
- Tetsuya Katou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having wiring structure, solid image pickup elem...
- Patent number 8,334,578
- Issue date Dec 18, 2012
- Kinki University
- Takeharu Eto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input/output core design and method of manufacture therefor
- Patent number 8,289,051
- Issue date Oct 16, 2012
- LSI Corporation
- Mark F. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including offset bonding pad and inspection me...
- Patent number 8,264,090
- Issue date Sep 11, 2012
- Renesas Electronics Corporation
- Tetsuya Katou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,212,366
- Issue date Jul 3, 2012
- Panasonic Corporation
- Manabu Ohnishi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device
- Publication number 20240363622
- Publication date Oct 31, 2024
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Application
DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR SEMICONDUCTOR DE...
- Publication number 20240348046
- Publication date Oct 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mikito SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVE CHIP AND DISPLAY PANEL
- Publication number 20240038700
- Publication date Feb 1, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND DRIVER
- Publication number 20230411324
- Publication date Dec 21, 2023
- Sharp Display Technology Corporation
- Shinzoh MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210175229
- Publication date Jun 10, 2021
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Application
SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190273108
- Publication date Sep 5, 2019
- RENESAS ELECTRONICS CORPORATION
- Hidenori SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180269200
- Publication date Sep 20, 2018
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180014405
- Publication date Jan 11, 2018
- SAMSUNG DISPLAY CO., LTD.
- BYOUNG YONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150287724
- Publication date Oct 8, 2015
- RENESAS ELECTRONICS CORPORATION
- Takahiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Segmented Bond Pads and Methods of Fabrication Thereof
- Publication number 20150035171
- Publication date Feb 5, 2015
- INFINEON TECHNOLOGIES AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20140299984
- Publication date Oct 9, 2014
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130341728
- Publication date Dec 26, 2013
- RENESAS ELECTRONICS CORPORATION
- Takahiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM DEVICE
- Publication number 20130292819
- Publication date Nov 7, 2013
- NOVATEK MICROELECTRONICS CORP.
- Chiao-Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CAPABLE OF SWITCHING OPERATION MODES
- Publication number 20130093070
- Publication date Apr 18, 2013
- Renesas Electronics Corporation
- Hiroyoshi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130075727
- Publication date Mar 28, 2013
- PANASONIC CORPORATION
- Masao TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20120309167
- Publication date Dec 6, 2012
- Sang-Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120241970
- Publication date Sep 27, 2012
- PANASONIC CORPORATION
- Manabu OHNISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED WIRE BONDING PROFILE AND PAD-LAYOUT CONFIGURATIONS IN IC PACK...
- Publication number 20120228783
- Publication date Sep 13, 2012
- Ng Kok SIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20120220118
- Publication date Aug 30, 2012
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR
- Publication number 20120194217
- Publication date Aug 2, 2012
- LSI Corporation
- Mark F. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND PHYSICAL LAYER INTERFACE ARRANGEMENT
- Publication number 20120126398
- Publication date May 24, 2012
- VIA TECHNOLOGIES, INC.
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR
- Publication number 20120119785
- Publication date May 17, 2012
- LSI Corporation
- Mark F. Turner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120083073
- Publication date Apr 5, 2012
- Renesas Electronics Corporation
- Yusuke TANUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120007255
- Publication date Jan 12, 2012
- Renesas Electronics Corporation
- Hiroshi SHIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110266540
- Publication date Nov 3, 2011
- PANASONIC CORPORATION
- Masao TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device capable of switching operation modes
- Publication number 20110253438
- Publication date Oct 20, 2011
- RENESAS ELECTRONICS CORPORATION
- Hiroyoshi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110193215
- Publication date Aug 11, 2011
- Renesas Electronics Corporation
- Masahiro TOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and inspection method therefor
- Publication number 20110129993
- Publication date Jun 2, 2011
- RENESAS ELECTRONICS CORPORATION
- Tetsuya Katou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BOND PAD AND METHOD OF MAN...
- Publication number 20110101545
- Publication date May 5, 2011
- Chartered Semiconductor Manufacturing LTD.
- Alfred Yeo
- H01 - BASIC ELECTRIC ELEMENTS

with a staggered arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Light emitting device and method of manufacturing the same

Semiconductor device

Semiconductor device

Solid-state imaging device including a sensor substrate and a logic...

Semiconductor device

Display device and method for manufacturing the same

Semiconductor device

Segmented bond pads and methods of fabrication thereof

Chip and manufacturing method thereof

Semiconductor device with output circuit and pad arrangements

Mixed wire bonding profile and pad-layout configurations in IC pack...

Method of fabricating semiconductor device

Integrated circuit package and physical layer interface arrangement

Interconnections for fine pitch semiconductor devices and manufactu...

Systems and methods for stacking a memory chip above an integrated...

Semiconductor device

Semiconductor device capable of switching operation modes

Integrated circuit packaging system with core region and bond pad a...

Semiconductor device with output circuit arrangement

Semiconductor device with I/O cell and external connection terminal...

Semiconductor device having a pad-disposition restriction area

Method of manufacturing semiconductor device

Semiconductor device capable of switching operation modes

Semiconductor device

Semiconductor device and inspection method therefor

Integrated circuit having wiring structure, solid image pickup elem...

Input/output core design and method of manufacture therefor

Semiconductor device including offset bonding pad and inspection me...

Semiconductor device

Patents Applicationslast 30 patents

Semiconductor Device

DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR SEMICONDUCTOR DE...

DRIVE CHIP AND DISPLAY PANEL

DISPLAY DEVICE AND DRIVER

DISPLAY DEVICE

SEMICONDUCTOR DEVICE

SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Segmented Bond Pads and Methods of Fabrication Thereof

CHIP AND MANUFACTURING METHOD THEREOF

Semiconductor Device

CHIP-ON-FILM DEVICE

SEMICONDUCTOR DEVICE CAPABLE OF SWITCHING OPERATION MODES

SEMICONDUCTOR DEVICE

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MIXED WIRE BONDING PROFILE AND PAD-LAYOUT CONFIGURATIONS IN IC PACK...

CHIP AND MANUFACTURING METHOD THEREOF

INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR

INTEGRATED CIRCUIT PACKAGE AND PHYSICAL LAYER INTERFACE ARRANGEMENT

INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor device capable of switching operation modes

SEMICONDUCTOR PACKAGE

Semiconductor device and inspection method therefor

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BOND PAD AND METHOD OF MAN...