with a staggered arrangement

Industry

CPC
H01L2224/14153

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/14153with a staggered arrangement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,830,839
- Issue date Nov 28, 2023
- Murata Manufacturing Co., Ltd.
- Shingo Yanagihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 11,631,648
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,833,033
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,388,622
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Image pickup apparatus
- Patent number 10,249,676
- Issue date Apr 2, 2019
- Olympus Corporation
- Takashi Nakayama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,204,878
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driver IC, display device, and inspection system
- Patent number 9,875,674
- Issue date Jan 23, 2018
- Japan Display Inc.
- Chunhan Zhang
- G02 - OPTICS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 9,824,992
- Issue date Nov 21, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,818,678
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Jumpei Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,748,191
- Issue date Aug 29, 2017
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Method of forming bump structure having a side recess and semicondu...
- Patent number 9,520,379
- Issue date Dec 13, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,508,630
- Issue date Nov 29, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,484,287
- Issue date Nov 1, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,484,286
- Issue date Nov 1, 2016
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Contact test structure and method
- Patent number 9,368,417
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 9,318,458
- Issue date Apr 19, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Contact test structure and method
- Patent number 9,129,816
- Issue date Sep 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with means for preventing solder bridges, and...
- Patent number 8,829,688
- Issue date Sep 9, 2014
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having no adjacent bumps between two adjace...
- Patent number 8,786,082
- Issue date Jul 22, 2014
- ChipMOS Technologies Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,785,318
- Issue date Jul 22, 2014
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Package structure
- Patent number 8,766,438
- Issue date Jul 1, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,701,972
- Issue date Apr 22, 2014
- Renesas Electronics Corporation
- Takafumi Nishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive pads to prevent solder reflow
- Patent number 8,604,625
- Issue date Dec 10, 2013
- Amkor Technology, Inc.
- Byong Jin Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 8,552,552
- Issue date Oct 8, 2013
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20230253355
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR CONNECTION TOPOLOGIES FOR HETEROGENEOUS PACKAGING
- Publication number 20230075505
- Publication date Mar 9, 2023
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20210035938
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200402939
- Publication date Dec 24, 2020
- MURATA MANUFACTURING CO., LTD.
- Shingo Yanagihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20190326240
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20180053741
- Publication date Feb 22, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP APPARATUS
- Publication number 20180040659
- Publication date Feb 8, 2018
- OLYMPUS CORPORATION
- Takashi NAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170338197
- Publication date Nov 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
PACKAGE SUBSTRATES
- Publication number 20170077041
- Publication date Mar 16, 2017
- Samsung Electronics Co., Ltd.
- JinGyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20170062371
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND LAYOUT OF BALL GRID ARRAY PACKAGES
- Publication number 20170053884
- Publication date Feb 23, 2017
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140312493
- Publication date Oct 23, 2014
- Shinya Suzuki
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140203431
- Publication date Jul 24, 2014
- RENESAS ELECTRONICS CORPORATION
- Jumpei KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140004661
- Publication date Jan 2, 2014
- RENESAS ELECTRONICS CORPORATION
- Jumpei KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130344693
- Publication date Dec 26, 2013
- Renesas Electronics Corporation
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20130292821
- Publication date Nov 7, 2013
- CHIPMOS TECHNOLOGIES INC.
- Chung-Pang Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM DEVICE
- Publication number 20130292819
- Publication date Nov 7, 2013
- NOVATEK MICROELECTRONICS CORP.
- Chiao-Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Test Structure and Method
- Publication number 20130240883
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20130147037
- Publication date Jun 13, 2013
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFAC...
- Publication number 20130134594
- Publication date May 30, 2013
- Shinko Electric Industries Co., LTD.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130020701
- Publication date Jan 24, 2013
- Renesas Electronics Corporation
- Shinya SUZUKI
- G02 - OPTICS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130001274
- Publication date Jan 3, 2013
- Renesas Electronics Corporation
- Jumpei KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20120153465
- Publication date Jun 21, 2012
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)
- Publication number 20120080789
- Publication date Apr 5, 2012
- Sharp Kabushiki Kaisha
- Motoji Shiota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REINFORCING CHIP PACKAGES
- Publication number 20120032327
- Publication date Feb 9, 2012
- FUJITSU LIMITED
- Michael G. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Fanning Out Method and Chip-on-Film Device
- Publication number 20120007235
- Publication date Jan 12, 2012
- Chao-Chih Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH STRESS REDISTRIBUTION LAYER AND METH...
- Publication number 20110233763
- Publication date Sep 29, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20090121349
- Publication date May 14, 2009
- RENESAS TECHNOLOGY CORP.
- Shinya Suzuki
- G02 - OPTICS

with a staggered arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump structure having a side recess and semiconductor structure inc...

Method and system for packing optimization of semiconductor devices

Semiconductor device

Bump structure having a side recess and semiconductor structure inc...

Method and system for packing optimization of semiconductor devices

Semiconductor device and a method of manufacturing the same

Bump structure having a side recess and semiconductor structure inc...

Semiconductor device and a method of manufacturing the same

Method and system for packing optimization of semiconductor devices

Bump structure having a side recess and semiconductor structure inc...

Image pickup apparatus

Semiconductor device and a method of manufacturing the same

Driver IC, display device, and inspection system

Bump structure having a side recess and semiconductor structure inc...

Semiconductor device

Semiconductor device and a method of manufacturing the same

Method of forming bump structure having a side recess and semicondu...

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Contact test structure and method

Bump structure having a side recess and semiconductor structure inc...

Contact test structure and method

Semiconductor device with means for preventing solder bridges, and...

Semiconductor structure having no adjacent bumps between two adjace...

Semiconductor device and a method of manufacturing the same

Package structure

Method of manufacturing semiconductor device

Semiconductor device having conductive pads to prevent solder reflow

Semiconductor device and a method of manufacturing the same

Patents Applicationslast 30 patents

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

METAL PILLAR CONNECTION TOPOLOGIES FOR HETEROGENEOUS PACKAGING

Method and System for Packing Optimization of Semiconductor Devices

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

SEMICONDUCTOR DEVICE

Method and System for Packing Optimization of Semiconductor Devices

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

IMAGE PICKUP APPARATUS

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

PACKAGE SUBSTRATES

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

STRUCTURE AND LAYOUT OF BALL GRID ARRAY PACKAGES

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME

CHIP-ON-FILM DEVICE

Contact Test Structure and Method

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFAC...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)

SYSTEMS AND METHODS FOR REINFORCING CHIP PACKAGES

Chip Fanning Out Method and Chip-on-Film Device

INTEGRATED CIRCUIT SYSTEM WITH STRESS REDISTRIBUTION LAYER AND METH...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME