with an insulated gate

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CPC
H01L29/66954

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

Current Industry

H01L29/66954with an insulated gate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device and method of fabricating the same
- Patent number 9,356,116
- Issue date May 31, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jaehoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image capturing apparatus, driving method thereof and e...
- Patent number 8,451,359
- Issue date May 28, 2013
- Sony Corporation
- Hideo Kanbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CCD array with integrated high voltage protection circuit
- Patent number 8,102,456
- Issue date Jan 24, 2012
- BAE Systems Imaging Solutions, Inc.
- Boyd Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state imaging device and method for fabricating the same
- Patent number 7,964,451
- Issue date Jun 21, 2011
- Panasonic Corporation
- Naoto Niisoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped plug for CCD gaps
- Patent number 7,846,760
- Issue date Dec 7, 2010
- Kenet, Inc.
- William D. Washkurak
- G11 - INFORMATION STORAGE
Information Patent Grant
CCD array with integrated high voltage protection circuit
- Patent number 7,764,316
- Issue date Jul 27, 2010
- Fairchild Imaging, Inc.
- Boyd Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state imaging apparatus, imaging apparatus and solid state im...
- Patent number 7,759,151
- Issue date Jul 20, 2010
- FUJIFILM Corporation
- Jiro Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating solid state imaging device including filling...
- Patent number 7,348,204
- Issue date Mar 25, 2008
- FUJIFILM Corporation
- Hiroaki Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state imaging device and method of fabricating the same
- Patent number 7,265,432
- Issue date Sep 4, 2007
- FUJIFILM Corporation
- Hiroaki Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-yield single-level gate charge-coupled device design and fabri...
- Patent number 7,217,601
- Issue date May 15, 2007
- Massachusetts Institute of Technology
- Barry E. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing CCDs in a conventional CMOS process
- Patent number 7,179,676
- Issue date Feb 20, 2007
- Kenet, Inc.
- Gerhard Sollner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge coupled device producing method
- Patent number 7,098,066
- Issue date Aug 29, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge-coupled device and method of fabricating the same
- Patent number 6,987,294
- Issue date Jan 17, 2006
- Sanyo Electric Co., LTD
- Kazuhiro Sasada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge coupled device and production thereof
- Patent number 6,750,510
- Issue date Jun 15, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 6,580,105
- Issue date Jun 17, 2003
- NEC Electronic Corporation
- Keisuke Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing charge-coupled image sensors
- Patent number 6,489,246
- Issue date Dec 3, 2002
- Eastman Kodak Company
- Joseph R. Summa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge coupled device, and method of manufacturing such a device
- Patent number 6,448,592
- Issue date Sep 10, 2002
- Koninklijke Philips Electronics N.V.
- Hermanus L. Peek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium arsenide semiconductor devices fabricated with insulator layer
- Patent number 6,306,212
- Issue date Oct 23, 2001
- The United States of America as represented by the Secretary of the Navy
- Francisco Santiago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a CCD sensor with a deep well
- Patent number 6,274,401
- Issue date Aug 14, 2001
- Sony Corporation
- Masaharu Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium arsenide semiconductor devices fabricated with insulator layer
- Patent number 6,208,001
- Issue date Mar 27, 2001
- The United States of America as represented by the Secretary of the Navy
- Francisco Santiago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 6,190,911
- Issue date Feb 20, 2001
- Canon Kabushiki Kaisha
- Ihachiro Gofuku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state image pickup device with polygates
- Patent number 5,959,318
- Issue date Sep 28, 1999
- Lg Semicon Co., Ltd.
- Jin Seop Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electric charge transfer device
- Patent number 5,943,556
- Issue date Aug 24, 1999
- NEC Corporation
- Keisuke Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BaF.sub.2 /GaAs electronic components
- Patent number 5,932,006
- Issue date Aug 3, 1999
- The United States of America as represented by the Secretary of the Navy
- Francisco Santiago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a solid-state pick-up device
- Patent number 5,910,013
- Issue date Jun 8, 1999
- Sony Corporation
- Kazuhide Fujikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating charge coupled device (CCD) as semiconductor...
- Patent number 5,858,811
- Issue date Jan 12, 1999
- NEC Corporation
- Shigeru Tohyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-phase clock type charge coupled device having electrodes with t...
- Patent number 5,849,605
- Issue date Dec 15, 1998
- NEC Corporation
- Tohru Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned barrier process for small pixel virtual phase charged...
- Patent number 5,837,563
- Issue date Nov 17, 1998
- Texas Instruments Incorporated
- Jaroslav Hynecek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a charge transfer device
- Patent number 5,830,778
- Issue date Nov 3, 1998
- NEC Corporation
- Keisuke Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of trapping effects in charge transfer devices
- Patent number 5,793,070
- Issue date Aug 11, 1998
- Massachusetts Institute of Technology
- Barry E. Burke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20140239344
- Publication date Aug 28, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jaehoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CCD Array with Integrated High Voltage Protection Circuit
- Publication number 20100255642
- Publication date Oct 7, 2010
- Boyd Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state image capturing apparatus, driving method thereof and e...
- Publication number 20100188547
- Publication date Jul 29, 2010
- SONY CORPORATION
- Hideo Kanbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE IMAGING DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20090194795
- Publication date Aug 6, 2009
- Naoto Niisoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE IMAGING DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20090045442
- Publication date Feb 19, 2009
- Naoto Niisoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Solid Image Pick-Up Device and a Solid Im...
- Publication number 20080237652
- Publication date Oct 2, 2008
- Teiji Azumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CCD Array with Integrated High Voltage Protection Circuit
- Publication number 20080224179
- Publication date Sep 18, 2008
- Boyd Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE IMAGING APPARATUS, IMAGING APPARATUS AND SOLID STATE IM...
- Publication number 20080173902
- Publication date Jul 24, 2008
- Jiro MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doped plug for CCD gaps
- Publication number 20080042169
- Publication date Feb 21, 2008
- William D. Washkurak
- G11 - INFORMATION STORAGE
Information Patent Application
Manufacturing CCDS in a conventional CMOS process
- Publication number 20070161148
- Publication date Jul 12, 2007
- Gerhard Sollner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing CCDs in a conventional CMOS process
- Publication number 20060216871
- Publication date Sep 28, 2006
- Kenet, Inc.
- Gerhard Sollner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid state imaging device and method of fabricating the same
- Publication number 20050181528
- Publication date Aug 18, 2005
- Fuji Photo Film Co., Ltd.
- Hiroaki Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid state imaging device and method of fabricating the same
- Publication number 20040222448
- Publication date Nov 11, 2004
- Hiroaki Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Charge coupled device and production thereof
- Publication number 20040203182
- Publication date Oct 14, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Charge-coupled device and method of fabricating the same
- Publication number 20030178651
- Publication date Sep 25, 2003
- SANYO ELECTRIC CO., LTD.
- Kazuhiro Sasada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state imaging device and method for manufacturing same
- Publication number 20030173582
- Publication date Sep 18, 2003
- NEC Electronics Corp.
- Keisuke Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Charge coupled device and production thereof
- Publication number 20030146471
- Publication date Aug 7, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CHARGE-COUPLED IMAGE SENSORS
- Publication number 20020192970
- Publication date Dec 19, 2002
- Eastman Kodak Company
- Joseph R. Summa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a charge-coupled image sensor
- Publication number 20020022296
- Publication date Feb 21, 2002
- Hermanus Leonardus Peek
- H01 - BASIC ELECTRIC ELEMENTS

with an insulated gate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor device and method of fabricating the same

Solid-state image capturing apparatus, driving method thereof and e...

CCD array with integrated high voltage protection circuit

Solid state imaging device and method for fabricating the same

Doped plug for CCD gaps

CCD array with integrated high voltage protection circuit

Solid state imaging apparatus, imaging apparatus and solid state im...

Method of fabricating solid state imaging device including filling...

Solid state imaging device and method of fabricating the same

High-yield single-level gate charge-coupled device design and fabri...

Manufacturing CCDs in a conventional CMOS process

Charge coupled device producing method

Charge-coupled device and method of fabricating the same

Charge coupled device and production thereof

Solid-state imaging device

Method for manufacturing charge-coupled image sensors

Charge coupled device, and method of manufacturing such a device

Gallium arsenide semiconductor devices fabricated with insulator layer

Method of manufacturing a CCD sensor with a deep well

Gallium arsenide semiconductor devices fabricated with insulator layer

Semiconductor device and fabrication method thereof

Solid state image pickup device with polygates

Method for manufacturing an electric charge transfer device

BaF.sub.2 /GaAs electronic components

Process for manufacturing a solid-state pick-up device

Method for fabricating charge coupled device (CCD) as semiconductor...

Two-phase clock type charge coupled device having electrodes with t...

Self aligned barrier process for small pixel virtual phase charged...

Method of manufacturing a charge transfer device

Reduction of trapping effects in charge transfer devices

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CCD Array with Integrated High Voltage Protection Circuit

Solid-state image capturing apparatus, driving method thereof and e...

SOLID STATE IMAGING DEVICE AND METHOD FOR FABRICATING THE SAME

SOLID STATE IMAGING DEVICE AND METHOD FOR FABRICATING THE SAME

Method of Manufacturing a Solid Image Pick-Up Device and a Solid Im...

CCD Array with Integrated High Voltage Protection Circuit

SOLID STATE IMAGING APPARATUS, IMAGING APPARATUS AND SOLID STATE IM...

Doped plug for CCD gaps

Manufacturing CCDS in a conventional CMOS process

Manufacturing CCDs in a conventional CMOS process

Solid state imaging device and method of fabricating the same

Solid state imaging device and method of fabricating the same

Charge coupled device and production thereof

Charge-coupled device and method of fabricating the same

Solid-state imaging device and method for manufacturing same

Charge coupled device and production thereof

METHOD FOR MANUFACTURING CHARGE-COUPLED IMAGE SENSORS

Method of manufacturing a charge-coupled image sensor