with at least one step of making a connection between transistor and capacitor

Industry

CPC
H01L27/10855

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/10855with at least one step of making a connection between transistor and capacitor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Capacitor structure, method of forming the same, semiconductor devi...
- Patent number 11,695,034
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Seongyul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, DRAM circuitry
- Patent number 11,683,927
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Hitoshi Ishigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,678,478
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Youngjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,676,820
- Issue date Jun 13, 2023
- SK Hynix Inc.
- Oh-Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,670,707
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,673
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Hyun-suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having spacer capping pattern disposed...
- Patent number 11,665,883
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Inkyoung Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 11,646,225
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Myeong-Dong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 11,647,627
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM and manufacturing method therefore
- Patent number 11,641,731
- Issue date May 2, 2023
- Winbond Electronics Corp.
- Shu-Mei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,631,679
- Issue date Apr 18, 2023
- United Microelectronics Corp.
- Luo-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and forming method thereof
- Patent number 11,626,408
- Issue date Apr 11, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shuai Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device, method of manufacturing the same, and...
- Patent number 11,626,498
- Issue date Apr 11, 2023
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM with selective epitaxial cell transistor
- Patent number 11,626,407
- Issue date Apr 11, 2023
- Integrated Silicon Solution, (Cayman) Inc.
- Andrew J. Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a plurality of electrodes and suppor...
- Patent number 11,626,476
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Ha-young Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with self-aligned landi...
- Patent number 11,621,265
- Issue date Apr 4, 2023
- NANYA TECHNOLOGY CORPORATION
- Te-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods forming integrated assemblies
- Patent number 11,616,119
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- Che-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device using multipe photolitho...
- Patent number 11,610,898
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Hyun-Chul Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device with self-aligning l...
- Patent number 11,610,895
- Issue date Mar 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with metal plug having ro...
- Patent number 11,605,557
- Issue date Mar 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of fabricating the same
- Patent number 11,600,621
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Kyooho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of fabricating the same
- Patent number 11,600,570
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Hyo-Sub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,594,538
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Sang Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite dielectric structure and method...
- Patent number 11,594,539
- Issue date Feb 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with protruding contact
- Patent number 11,574,911
- Issue date Feb 7, 2023
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including wiring contact plugs
- Patent number 11,569,171
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Yonghyeok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,563,009
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jenn-Gwo Hwu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing thereof
- Patent number 11,563,006
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated memory with redistribution of capacitor connections, and...
- Patent number 11,563,008
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Guangjun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,563,010
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS
- Publication number 20240096698
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SUPPORTING LAYER AND METHOD FOR FABRICATI...
- Publication number 20240090198
- Publication date Mar 14, 2024
- NANYA TECHNOLOGY CORPORATION
- LIANG-PIN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE AND METHOD OF MANUFAC...
- Publication number 20240074145
- Publication date Feb 29, 2024
- NANYA TECHNOLOGY CORPORATION
- YI-JEN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240064960
- Publication date Feb 22, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20240040765
- Publication date Feb 1, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yue ZHUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED MICROEL...
- Publication number 20240038588
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Terrence B. McDaniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240032273
- Publication date Jan 25, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- XUANXUAN CHEN
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH ETCHED LANDING PAD SURFACE
- Publication number 20240023307
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- YEN-HO CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND FORMING METHOD THEREOF
- Publication number 20240023310
- Publication date Jan 18, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Min LI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240008246
- Publication date Jan 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- YI JIANG
- G11 - INFORMATION STORAGE
Information Patent Application
MANUFACTURING METHOD MEMORY DEVICE HAVING LATERALLY EXTENDING CAPAC...
- Publication number 20240006471
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING MEMORY DEVICE WITH MULTILAYERED CAPACITOR DIEL...
- Publication number 20230413509
- Publication date Dec 21, 2023
- NANYA TECHNOLOGY CORPORATION
- CHIH-HSIUNG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH VOID-FREE CONDUCTIV...
- Publication number 20230413533
- Publication date Dec 21, 2023
- NANYA TECHNOLOGY CORPORATION
- CHENG-YAN JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF
- Publication number 20230403840
- Publication date Dec 14, 2023
- Changxin Memory Technologies, Inc.
- Yi JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME
- Publication number 20230389293
- Publication date Nov 30, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Min LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROGRAMABLE FEATURE
- Publication number 20230389302
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- YIN-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING STORAGE CAPACITOR WITH MULTIPLE DIELECTRICS
- Publication number 20230389267
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- KAI-HUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230389281
- Publication date Nov 30, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- YOUMING LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230369145
- Publication date Nov 16, 2023
- WINBOND ELECTRONICS CORP.
- Ming-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONTACT STRUCTURE
- Publication number 20230335490
- Publication date Oct 19, 2023
- NANYA TECHNOLOGY CORPORATION
- CHIH-YING TSAI
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING CONTACT STRU...
- Publication number 20230337411
- Publication date Oct 19, 2023
- NANYA TECHNOLOGY CORPORATION
- CHIH-YING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH T-SHAPED LANDING PAD STRUCTURE
- Publication number 20230326853
- Publication date Oct 12, 2023
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH T-SHAPED LANDING PAD...
- Publication number 20230328953
- Publication date Oct 12, 2023
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND MEMORY
- Publication number 20230328954
- Publication date Oct 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xingsong SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF AND MEMORY
- Publication number 20230328959
- Publication date Oct 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Juanjuan Huang
- G11 - INFORMATION STORAGE
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY DEVICE
- Publication number 20230309291
- Publication date Sep 28, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Li-Wei Feng
- G11 - INFORMATION STORAGE
Information Patent Application
PUNCH-THROUGH INTERCONNECT FEATURE TO COUPLE UPPER ELECTRODES OF CA...
- Publication number 20230290722
- Publication date Sep 14, 2023
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR MEMORY
- Publication number 20230284438
- Publication date Sep 7, 2023
- NANYA TECHNOLOGY CORPORATION
- CHIANG-LIN SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY WITH A CONTACT BETWEEN A DATA STORAGE DEVICE AND A DATA PROC...
- Publication number 20230284440
- Publication date Sep 7, 2023
- NANYA TECHNOLOGY CORPORATION
- CHIANG-LIN SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR MANUFACTURING METHOD
- Publication number 20230276616
- Publication date Aug 31, 2023
- NANYA TECHNOLOGY CORPORATION
- Yu-Ying LIN
- H01 - BASIC ELECTRIC ELEMENTS

with at least one step of making a connection between transistor and capacitor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Capacitor structure, method of forming the same, semiconductor devi...

Integrated circuitry, DRAM circuitry

Semiconductor devices

Semiconductor device and method for fabricating the same

Integrated assemblies and methods of forming integrated assemblies

Semiconductor device

Semiconductor memory device having spacer capping pattern disposed...

Semiconductor devices and methods of fabricating the same

Integrated circuit device

DRAM and manufacturing method therefore

Semiconductor device

Memory device and forming method thereof

Semiconductor memory device, method of manufacturing the same, and...

DRAM with selective epitaxial cell transistor

Semiconductor device including a plurality of electrodes and suppor...

Method for fabricating semiconductor device with self-aligned landi...

Integrated assemblies and methods forming integrated assemblies

Method of fabricating semiconductor device using multipe photolitho...

Method of manufacturing a semiconductor device with self-aligning l...

Method for preparing semiconductor device with metal plug having ro...

Semiconductor memory device and method of fabricating the same

Semiconductor memory device and method of fabricating the same

Semiconductor device and method of fabricating the same

Semiconductor device with composite dielectric structure and method...

Method for fabricating semiconductor device with protruding contact

Semiconductor memory device including wiring contact plugs

Semiconductor memory device

Semiconductor structure and method for manufacturing thereof

Integrated memory with redistribution of capacitor connections, and...

Integrated assemblies, and methods of forming integrated assemblies

Patents Applicationslast 30 patents

SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS

SEMICONDUCTOR DEVICE WITH SUPPORTING LAYER AND METHOD FOR FABRICATI...

SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE AND METHOD OF MANUFAC...

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED MICROEL...

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH ETCHED LANDING PAD SURFACE

SEMICONDUCTOR MEMORY DEVICE AND FORMING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD MEMORY DEVICE HAVING LATERALLY EXTENDING CAPAC...

METHOD FOR PREPARING MEMORY DEVICE WITH MULTILAYERED CAPACITOR DIEL...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH VOID-FREE CONDUCTIV...

THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME

SEMICONDUCTOR DEVICE WITH PROGRAMABLE FEATURE

METHOD OF FABRICATING STORAGE CAPACITOR WITH MULTIPLE DIELECTRICS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR STRUCTURE HAVING CONTACT STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING CONTACT STRU...

SEMICONDUCTOR DEVICE WITH T-SHAPED LANDING PAD STRUCTURE

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH T-SHAPED LANDING PAD...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND MEMORY

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF AND MEMORY

DYNAMIC RANDOM ACCESS MEMORY DEVICE

PUNCH-THROUGH INTERCONNECT FEATURE TO COUPLE UPPER ELECTRODES OF CA...

METHOD FOR MANUFACTURING A SEMICONDUCTOR MEMORY

MEMORY WITH A CONTACT BETWEEN A DATA STORAGE DEVICE AND A DATA PROC...

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR MANUFACTURING METHOD