with deforming of lead or terminal

Industry

CPC
Y10T29/4914

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/4914with deforming of lead or terminal

Industries

Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-transferring system and chip-transferring method
- Patent number 12,125,719
- Issue date Oct 22, 2024
- Skilleux Electricity Inc.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feedthrough assembly with feature for controlling component position
- Patent number 12,121,735
- Issue date Oct 22, 2024
- Medtronic, Inc.
- Michael J. Nidelkoff
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 12,052,831
- Issue date Jul 30, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Textile blank with seamless knitted electrode system
- Patent number 11,943,866
- Issue date Mar 26, 2024
- HONEYWELL SAFETY PRODUCTS USA, INC.
- Joanna Berzowska
- A41 - WEARING APPAREL
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managed electrical connectivity systems
- Patent number 11,862,912
- Issue date Jan 2, 2024
- CommScope Technologies LLC
- Christopher Charles Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of mounting structure, and sheet therefor
- Patent number 11,848,659
- Issue date Dec 19, 2023
- Nagase Chemtex Corporation
- Takayuki Hashimoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 11,751,338
- Issue date Sep 5, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing wiring board that includes dual-layered insulat...
- Patent number 11,751,340
- Issue date Sep 5, 2023
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive devices in package-on-package structures and methods for fo...
- Patent number 11,742,217
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low footprint optical interconnects
- Patent number 11,726,274
- Issue date Aug 15, 2023
- WAVEFRONT RESEARCH, INC.
- Randall C. Veitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric actuator
- Patent number 11,711,981
- Issue date Jul 25, 2023
- Brother Kogyo Kabushiki Kaisha
- Hiroto Sugahara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for producing an electronic device
- Patent number 11,652,197
- Issue date May 16, 2023
- Nichia Corporation
- Masafumi Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Softening nerve cuff electrodes
- Patent number 11,638,816
- Issue date May 2, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 11,627,664
- Issue date Apr 11, 2023
- Cortigent, Inc.
- Robert Jay Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing piezoelectric actuator and method for producin...
- Patent number 11,571,897
- Issue date Feb 7, 2023
- Brother Kogyo Kabushiki Kaisha
- Hiroto Sugahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a lead for an active implantable medical de...
- Patent number 11,564,605
- Issue date Jan 31, 2023
- Sorin CRM SAS
- Jean-François Ollivier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method of forming the same
- Patent number 11,562,911
- Issue date Jan 24, 2023
- Hitachi Energy Switzerland AG
- Daniele Torresin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated assembly sensor cable
- Patent number 11,557,407
- Issue date Jan 17, 2023
- Masimo Corporation
- Ammar Al-Ali
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 11,528,809
- Issue date Dec 13, 2022
- Tahoe Research, LTD.
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Managed electrical connectivity systems
- Patent number 11,469,560
- Issue date Oct 11, 2022
- CommScope Technologies LLC
- Christopher Charles Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of gas sensor
- Patent number 11,467,121
- Issue date Oct 11, 2022
- NGK Spark Plug Co., Ltd.
- Takehiro Oba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Potted electronic module with improved adhesion of potting compound
- Patent number 11,470,736
- Issue date Oct 11, 2022
- Continental Automotive GmbH
- Henryk Frenzel
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
TEXTILE BLANK WITH SEAMLESS KNITTED ELECTRODE SYSTEM
- Publication number 20240196529
- Publication date Jun 13, 2024
- HONEYWELL SAFETY PRODUCTS USA, INC.
- Joanna BERZOWSKA
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Application
TEXTILE BLANK WITH SEAMLESS KNITTED ELECTRODE SYSTEM
- Publication number 20240188214
- Publication date Jun 6, 2024
- HONEYWELL SAFETY PRODUCTS USA, INC.
- Joanna BERZOWSKA
- A41 - WEARING APPAREL
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20240055393
- Publication date Feb 15, 2024
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED ASSEMBLY SENSOR CABLE
- Publication number 20230230726
- Publication date Jul 20, 2023
- MASIMO CORPORATION
- Ammar Al-Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGED ELECTRICAL CONNECTIVITY SYSTEMS
- Publication number 20230223726
- Publication date Jul 13, 2023
- CommScope Technologies LLC
- Christopher Charles Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING LIQUID TRANSPORT APPARATUS
- Publication number 20230182469
- Publication date Jun 15, 2023
- BROTHER KOGYO KABUSHIKI KAISHA
- Hiroto Sugahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20230112097
- Publication date Apr 13, 2023
- Tahoe Research, Ltd.
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20230008716
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGED CONNECTIVITY IN ELECTRICAL SYSTEMS AND METHODS THEREOF
- Publication number 20220201876
- Publication date Jun 23, 2022
- CommScope Technologies LLC
- Joseph C. Coffey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20220165703
- Publication date May 26, 2022
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED ASSEMBLY SENSOR CABLE
- Publication number 20210391099
- Publication date Dec 16, 2021
- MASIMO CORPORATION
- Ammar Al-Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
- Publication number 20210329788
- Publication date Oct 21, 2021
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210321520
- Publication date Oct 14, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGED ELECTRICAL CONNECTIVITY SYSTEMS
- Publication number 20210305760
- Publication date Sep 30, 2021
- CommScope Technologies LLC
- Christopher Charles Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOFTENING NERVE CUFF ELECTRODES
- Publication number 20210236810
- Publication date Aug 5, 2021
- Board of Regents, The University of Texas System
- Romil Modi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for Manufacturing Piezoelectric Actuator
- Publication number 20210217950
- Publication date Jul 15, 2021
- BROTHER KOGYO KABUSHIKI KAISHA
- Hiroto Sugahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20210195761
- Publication date Jun 24, 2021
- Unimicron Technology Corp.
- Kai-Ming YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20210185830
- Publication date Jun 17, 2021
- Intel Corporation
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC DEVICE
- Publication number 20210167264
- Publication date Jun 3, 2021
- Nichia Corporation.
- Masafumi KURAMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Passive Devices in Package-on-Package Structures and Methods for Fo...
- Publication number 20210125923
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-package Assembly With Wire Bond Vias
- Publication number 20210035948
- Publication date Feb 4, 2021
- Invensas Corporation
- Ellis Chau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
MANUFACTURING METHOD OF GAS SENSOR
- Publication number 20210018462
- Publication date Jan 21, 2021
- NGK SPARK PLUG CO., LTD.
- Takehiro OBA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOPILLAR ELECTRODE DEVICES AND METHODS OF RECORDING ACTION POTENT...
- Publication number 20210008363
- Publication date Jan 14, 2021
- Bianxiao Cui
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
APPARATUS FOR SPATIAL AND TEMPORAL CONTROL OF TEMPERATURE ON A SUBS...
- Publication number 20200251370
- Publication date Aug 6, 2020
- LAM RESEARCH CORPORATION
- Anthony J. Ricci
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...
- Publication number 20200154561
- Publication date May 14, 2020
- Apple Inc.
- Yanfeng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200068721
- Publication date Feb 27, 2020
- Unimicron Technology Corp.
- Kai-Ming YANG
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHI...
- Publication number 20190394912
- Publication date Dec 26, 2019
- SKYWORKS SOLUTIONS, INC.
- Philip H. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEURAL INTERFACE SYSTEM WITH EDGE ARRAY
- Publication number 20190374770
- Publication date Dec 12, 2019
- NEURONEXUS TECHNOLOGIES, INC.
- John P. Seymour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with deforming of lead or terminal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Chip-transferring system and chip-transferring method

Feedthrough assembly with feature for controlling component position

Panel molded electronic assemblies with multi-surface conductive co...

Wiring board

Solderless interconnection structure and method of forming same

Textile blank with seamless knitted electrode system

Manufacturing method of package structure

Printed circuit board and method of manufacturing the same

Stacked microfeature devices and associated methods

Managed electrical connectivity systems

Manufacturing method of mounting structure, and sheet therefor

Panel-molded electronic assemblies

Method of producing wiring board that includes dual-layered insulat...

Passive devices in package-on-package structures and methods for fo...

Package-on-package assembly with wire bond vias

Low footprint optical interconnects

Method for manufacturing an electronic module and electronic module

Piezoelectric actuator

Method for producing an electronic device

Softening nerve cuff electrodes

Flexible circuit electrode array and method of manufacturing the same

Method for producing piezoelectric actuator and method for producin...

Method of manufacturing a lead for an active implantable medical de...

Power semiconductor module and method of forming the same

Automated assembly sensor cable

Method for orienting solder balls on a BGA device

Managed electrical connectivity systems

Manufacturing method of gas sensor

Potted electronic module with improved adhesion of potting compound

Patents Applicationslast 30 patents

TEXTILE BLANK WITH SEAMLESS KNITTED ELECTRODE SYSTEM

TEXTILE BLANK WITH SEAMLESS KNITTED ELECTRODE SYSTEM

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

AUTOMATED ASSEMBLY SENSOR CABLE

MANAGED ELECTRICAL CONNECTIVITY SYSTEMS

METHOD FOR PRODUCING LIQUID TRANSPORT APPARATUS

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

Tools and Systems for Processing Semiconductor Devices, and Methods...

MANAGED CONNECTIVITY IN ELECTRICAL SYSTEMS AND METHODS THEREOF

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

AUTOMATED ASSEMBLY SENSOR CABLE

METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE

ELECTRONIC MODULE

Solderless Interconnection Structure and Method of Forming Same

MANAGED ELECTRICAL CONNECTIVITY SYSTEMS

SOFTENING NERVE CUFF ELECTRODES

Method for Manufacturing Piezoelectric Actuator

MANUFACTURING METHOD OF PACKAGE STRUCTURE

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

METHOD FOR PRODUCING AN ELECTRONIC DEVICE

Passive Devices in Package-on-Package Structures and Methods for Fo...

Package-on-package Assembly With Wire Bond Vias

MANUFACTURING METHOD OF GAS SENSOR

NANOPILLAR ELECTRODE DEVICES AND METHODS OF RECORDING ACTION POTENT...

APPARATUS FOR SPATIAL AND TEMPORAL CONTROL OF TEMPERATURE ON A SUBS...

MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

OVERMOLDED ELECTRONIC MODULE WITH AN INTEGRATED ELECTROMAGNETIC SHI...

NEURAL INTERFACE SYSTEM WITH EDGE ARRAY