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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8322with energy being in the form of electromagnetic radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and structure for die bonding using energy beam
- Patent number 12,154,885
- Issue date Nov 26, 2024
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Energy augmentation structures, energy emitters or energy collector...
- Patent number 12,121,746
- Issue date Oct 22, 2024
- Immunolight, LLC
- Frederic A Bourke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures in adhesive bonding compositions
- Patent number 12,076,579
- Issue date Sep 3, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures and their use in solar cells and oth...
- Patent number 11,998,760
- Issue date Jun 4, 2024
- Immunolight, LLC
- Frederic A. Bourke
- F21 - LIGHTING
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures, and their use in adhesive bonding
- Patent number 11,964,166
- Issue date Apr 23, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy augmentation structures for use with energy emitters and col...
- Patent number 11,964,167
- Issue date Apr 23, 2024
- Immunolight, LLC
- Frederic A Bourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing a light-emitting device and a method for manuf...
- Patent number 11,916,041
- Issue date Feb 27, 2024
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus, and method of manufacturing...
- Patent number 11,823,924
- Issue date Nov 21, 2023
- Kioxia Corporation
- Aoi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 11,776,942
- Issue date Oct 3, 2023
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for die bonding using energy beam
- Patent number 11,728,310
- Issue date Aug 15, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 11,652,081
- Issue date May 16, 2023
- Advanced Semiconductor Engineering, Inc.
- Yi Dao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor having double-sided substrate
- Patent number 11,631,627
- Issue date Apr 18, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
- Patent number 11,575,069
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
- Patent number 11,563,142
- Issue date Jan 24, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively bonding light-emitting devices via a pulsed laser
- Patent number 11,557,692
- Issue date Jan 17, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reel-to-reel laser reflow
- Patent number 11,515,287
- Issue date Nov 29, 2022
- LASERSSEL CO., LTD.
- Byung Rock Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display and manufacturing method with conductive film
- Patent number 11,417,627
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Jamyeong Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and its process for curing post-applied underfill ma...
- Patent number 11,404,600
- Issue date Aug 2, 2022
- Meta Platforms Technologies, LLC
- Jeb Wu
- G02 - OPTICS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,374,148
- Issue date Jun 28, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for die bonding using energy beam
- Patent number 11,362,060
- Issue date Jun 14, 2022
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER SOLDERING METHOD USING LASER
- Publication number 20240408687
- Publication date Dec 12, 2024
- S.S.P. INC.
- Heui Jong JU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404969
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...
- Publication number 20240376348
- Publication date Nov 14, 2024
- TORAY INDUSTRIES, INC.
- Yukari ARIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing an electronic device comprising a bonding...
- Publication number 20240290749
- Publication date Aug 29, 2024
- Aledia
- Christophe LINCHENEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274571
- Publication date Aug 15, 2024
- Tadatomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY AUGMENTATION STRUCTURES FOR USE WITH ENERGY EMITTERS AND COL...
- Publication number 20240216713
- Publication date Jul 4, 2024
- Immunolight, LLC
- Frederic A. BOURKE
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240162402
- Publication date May 16, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROMAGNETIC CONTROL OF WAFER BONDING
- Publication number 20240153910
- Publication date May 9, 2024
- MICRON TECHNOLGY, INC.
- Andrew M. BAYLESS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...
- Publication number 20240115878
- Publication date Apr 11, 2024
- Immunolight, LLC
- Frederic A. BOURKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230402442
- Publication date Dec 14, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230299247
- Publication date Sep 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230230953
- Publication date Jul 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Yi Dao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230117132
- Publication date Apr 20, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230040019
- Publication date Feb 9, 2023
- Fuji Electric Co., Ltd.
- Yuji IIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL
- Publication number 20220399317
- Publication date Dec 15, 2022
- Seoul Semiconductor Co., Ltd.
- Woo Gun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20220399304
- Publication date Dec 15, 2022
- Fuji Electric Co., Ltd.
- Narumi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRIC DEVICE
- Publication number 20220384674
- Publication date Dec 1, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE
- Publication number 20220375895
- Publication date Nov 24, 2022
- Japan Display Inc.
- Keisuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220336406
- Publication date Oct 20, 2022
- Advanced Semiconductor Engineering, Inc.
- Yi Dao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...
- Publication number 20220285181
- Publication date Sep 8, 2022
- KIOXIA Corporation
- Aoi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...
- Publication number 20220181293
- Publication date Jun 9, 2022
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...
- Publication number 20220157773
- Publication date May 19, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY AUGMENTATION STRUCTURES IN ADHESIVE BONDING COMPOSITIONS
- Publication number 20220148997
- Publication date May 12, 2022
- Immunolight, LLC
- Frederic A. BOURKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210375804
- Publication date Dec 2, 2021
- SAMSUNG DISPLAY CO., LTD.
- EUI JEONG KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...
- Publication number 20210358885
- Publication date Nov 18, 2021
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE
- Publication number 20210335691
- Publication date Oct 28, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECONSTRUCTED WAFER TO WAFER BONDING USING A PERMANENT BOND WITH LA...
- Publication number 20210183803
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD AND BONDING DEVICE
- Publication number 20210159208
- Publication date May 27, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Lili WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210090903
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Tatsuo Fukuda
- H01 - BASIC ELECTRIC ELEMENTS

with energy being in the form of electromagnetic radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and structure for die bonding using energy beam

Energy augmentation structures, energy emitters or energy collector...

Display device and method of manufacturing the same

Energy augmentation structures in adhesive bonding compositions

Pressure sintering device and method for manufacturing an electroni...

Energy augmentation structures and their use in solar cells and oth...

Substrate bonding apparatus and method of manufacturing a semicondu...

Energy augmentation structures, and their use in adhesive bonding

Energy augmentation structures for use with energy emitters and col...

Low warpage curing methodology by inducing curvature

Method for repairing a light-emitting device and a method for manuf...

Semiconductor manufacturing apparatus, and method of manufacturing...

Method for manufacturing display panel, display panel, and display...

Dielectric-dielectric and metallization bonding via plasma activati...

Method and structure for die bonding using energy beam

Method for manufacturing semiconductor package structure

Method of manufacturing semiconductor having double-sided substrate

Employing deformable contacts and pre-applied underfill for bonding...

Systems for direct transfer of semiconductor device die

Curing pre-applied and plasma-etched underfill via a laser

Selectively bonding light-emitting devices via a pulsed laser

Device and method for reel-to-reel laser reflow

Direct transfer of semiconductor devices from a substrate

Chip assembly

Method for transfer of semiconductor devices onto glass substrates

Micro LED display and manufacturing method with conductive film

Display device and its process for curing post-applied underfill ma...

Sintering materials and attachment methods using same

Dielectric-dielectric and metallization bonding via plasma activati...

Method and structure for die bonding using energy beam

Patents Applicationslast 30 patents

SOLDER SOLDERING METHOD USING LASER

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE...

Method for manufacturing an electronic device comprising a bonding...

SEMICONDUCTOR SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREFOR

ENERGY AUGMENTATION STRUCTURES FOR USE WITH ENERGY EMITTERS AND COL...

Semiconductor Device and Method of Making a Semiconductor Package w...

DISPLAY DEVICE

FERROMAGNETIC CONTROL OF WAFER BONDING

ENERGY AUGMENTATION STRUCTURES, ENERGY EMITTERS OR ENERGY COLLECTOR...

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL

ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS

METHOD OF MANUFACTURING ELECTRIC DEVICE

MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...

METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...

PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...

ENERGY AUGMENTATION STRUCTURES IN ADHESIVE BONDING COMPOSITIONS

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...

METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE

RECONSTRUCTED WAFER TO WAFER BONDING USING A PERMANENT BOND WITH LA...

CHIP BONDING METHOD AND BONDING DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE