with parts of the auxiliary support remaining in the finished device

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CPC
H01L2221/68377

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68377with parts of the auxiliary support remaining in the finished device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 12,159,823
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Displaying apparatus having light emitting device, method of manufa...
- Patent number 12,136,611
- Issue date Nov 5, 2024
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched trenches in bond materials for die singulation, and associat...
- Patent number 12,132,155
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier assisted substrate method of manufacturing an electronic de...
- Patent number 12,051,611
- Issue date Jul 30, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sinterable films and pastes and methods for use thereof
- Patent number 12,042,883
- Issue date Jul 23, 2024
- Henkel AG & Co. KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,823,913
- Issue date Nov 21, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,776,838
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sinterable films and pastes and methods for use thereof
- Patent number 11,745,294
- Issue date Sep 5, 2023
- Henkel AG & Co., KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 11,652,038
- Issue date May 16, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Displaying apparatus having light emitting device, method of manufa...
- Patent number 11,610,870
- Issue date Mar 21, 2023
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a template wafer
- Patent number 11,557,505
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Wolfgang Lehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
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- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
LTHC as charging barrier in InFO package formation
- Patent number 11,437,361
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating carrier-free semiconductor package
- Patent number 11,289,409
- Issue date Mar 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, manufacturing method of semiconductor device...
- Patent number 11,177,156
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,139,375
- Issue date Oct 5, 2021
- Infineon Technologies AG
- Carsten Schaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film-like adhesive and method for producing semiconductor package u...
- Patent number 11,139,261
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package structure and manufacturing method t...
- Patent number 11,062,969
- Issue date Jul 13, 2021
- Alpha and Omega Semiconductor (Cayman) LTD
- Cheow Khoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Displaying apparatus having light emitting device, method of manufa...
- Patent number 11,043,476
- Issue date Jun 22, 2021
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,031,259
- Issue date Jun 8, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier assisted substrate method of manufacturing an electronic de...
- Patent number 11,018,040
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide film for semiconductor package reflow process, and manufa...
- Patent number 11,015,089
- Issue date May 25, 2021
- IPI TECH INC.
- Kye-Ung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,943,858
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip arrangement, chip arrangement, method of f...
- Patent number 10,930,541
- Issue date Feb 23, 2021
- Infineon Technologies AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing comprising a semiconductor body and a method for producing...
- Patent number 10,903,406
- Issue date Jan 26, 2021
- OSRAM OLED GmbH
- Martin Unterburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched trenches in bond materials for die singulation, and associat...
- Patent number 10,892,384
- Issue date Jan 12, 2021
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet and composite sheet
- Patent number 10,888,929
- Issue date Jan 12, 2021
- Nitto Denko Corporation
- Nao Kamakura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Adhesive film for semiconductor
- Patent number 10,865,329
- Issue date Dec 15, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Sheet sticking method
- Patent number 10,847,404
- Issue date Nov 24, 2020
- Disco Corporation
- Masamitsu Agari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAYING APPARATUS HAVING LIGHT EMITTING DEVICE, METHOD OF MANUFA...
- Publication number 20250062293
- Publication date Feb 20, 2025
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...
- Publication number 20250056937
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20240387230
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20240274485
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKING TAPE FOR FORMING ELECTROMAGNETIC WAVE SHIELD
- Publication number 20240218213
- Publication date Jul 4, 2024
- Nitto Denko Corporation
- Yuji OKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETI...
- Publication number 20240222182
- Publication date Jul 4, 2024
- Intel Corporation
- Amey Anant Apte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20240087914
- Publication date Mar 14, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE AGENT, DICING/DIE-BONDING ALL-IN-ONE FILM, SEMIC...
- Publication number 20240043722
- Publication date Feb 8, 2024
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN FILM, FILM MATERIAL FOR SEMICONDUCTOR DEVICE PRODUCTI...
- Publication number 20240021443
- Publication date Jan 18, 2024
- Resonac Corporation
- Shogo SOBUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE SUBSTRATE, DISPLAY PANEL, PREPARATION METHOD, AND DISPL...
- Publication number 20240006220
- Publication date Jan 4, 2024
- TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.
- Sitao HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION
- Publication number 20230386954
- Publication date Nov 30, 2023
- MEDIATEK INC.
- Yu-Tung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230360949
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230282560
- Publication date Sep 7, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip transfer assembly and manufacturing method therefor, chip tran...
- Publication number 20220384236
- Publication date Dec 1, 2022
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220076982
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20220059387
- Publication date Feb 24, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20220051909
- Publication date Feb 17, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKING TAPE FOR FORMING ELECTROMAGNETIC WAVE SHIELD
- Publication number 20210269682
- Publication date Sep 2, 2021
- Nitto Denko Corporation
- Yuji OKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20210217692
- Publication date Jul 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING COMPRISING A SEMICONDUCTOR BODY AND A METHOD FOR PRODUCING...
- Publication number 20210104653
- Publication date Apr 8, 2021
- OSRAM OLED GmbH
- Martin Unterburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE...
- Publication number 20210057259
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20200402830
- Publication date Dec 24, 2020
- Amkor Technology, Inc.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20200251354
- Publication date Aug 6, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE
- Publication number 20200144167
- Publication date May 7, 2020
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Chip Arrangement, Chip Arrangement, Method of F...
- Publication number 20190221465
- Publication date Jul 18, 2019
- INFINEON TECHNOLOGIES AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE
- Publication number 20190206825
- Publication date Jul 4, 2019
- NITTO DENKO CORPORATION
- Yuki Sugo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Structure of printed circuit board and carrier and method of making...
- Publication number 20190189467
- Publication date Jun 20, 2019
- Chung-Pao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20190189552
- Publication date Jun 20, 2019
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20190157174
- Publication date May 23, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Cheow Khoon Oh
- H01 - BASIC ELECTRIC ELEMENTS

with parts of the auxiliary support remaining in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package with front side and back side redistribution...

Displaying apparatus having light emitting device, method of manufa...

Etched trenches in bond materials for die singulation, and associat...

Carrier assisted substrate method of manufacturing an electronic de...

Sinterable films and pastes and methods for use thereof

LTHC as charging barrier in info package formation

Method of manufacturing an electronic device and electronic device...

Semiconductor package and manufacturing method thereof

Sinterable films and pastes and methods for use thereof

Semiconductor package with front side and back side redistribution...

Displaying apparatus having light emitting device, method of manufa...

Method of manufacturing a template wafer

Apparatus and methods for micro-transfer-printing

LTHC as charging barrier in InFO package formation

Method for fabricating carrier-free semiconductor package

Semiconductor package, manufacturing method of semiconductor device...

Semiconductor device and method of manufacturing a semiconductor de...

Film-like adhesive and method for producing semiconductor package u...

Wafer level chip scale package structure and manufacturing method t...

Displaying apparatus having light emitting device, method of manufa...

Method of manufacturing an electronic device and electronic device...

Carrier assisted substrate method of manufacturing an electronic de...

Polyimide film for semiconductor package reflow process, and manufa...

Semiconductor package and fabricating method thereof

Method of forming a chip arrangement, chip arrangement, method of f...

Housing comprising a semiconductor body and a method for producing...

Etched trenches in bond materials for die singulation, and associat...

Sheet and composite sheet

Adhesive film for semiconductor

Sheet sticking method

Patents Applicationslast 30 patents

DISPLAYING APPARATUS HAVING LIGHT EMITTING DEVICE, METHOD OF MANUFA...

ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

MASKING TAPE FOR FORMING ELECTROMAGNETIC WAVE SHIELD

METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETI...

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

FILM-LIKE ADHESIVE AGENT, DICING/DIE-BONDING ALL-IN-ONE FILM, SEMIC...

CURABLE RESIN FILM, FILM MATERIAL FOR SEMICONDUCTOR DEVICE PRODUCTI...

MICRODEVICE SUBSTRATE, DISPLAY PANEL, PREPARATION METHOD, AND DISPL...

WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

Chip transfer assembly and manufacturing method therefor, chip tran...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

MASKING TAPE FOR FORMING ELECTROMAGNETIC WAVE SHIELD

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

HOUSING COMPRISING A SEMICONDUCTOR BODY AND A METHOD FOR PRODUCING...

SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE...

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE

Method of Forming a Chip Arrangement, Chip Arrangement, Method of F...

THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE

Structure of printed circuit board and carrier and method of making...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD T...