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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
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H01L2221/68377
with parts of the auxiliary support remaining in the finished device
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LTHC as charging barrier in info package formation
Patent number
11,923,353
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing an electronic device and electronic device...
Patent number
11,823,913
Issue date
Nov 21, 2023
Amkor Technology Singapore Holding Pte Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package and manufacturing method thereof
Patent number
11,776,838
Issue date
Oct 3, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
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Sinterable films and pastes and methods for use thereof
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11,745,294
Issue date
Sep 5, 2023
Henkel AG & Co., KGaA
Pukun Zhu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Semiconductor package with front side and back side redistribution...
Patent number
11,652,038
Issue date
May 16, 2023
Amkor Technology Singapore Holding Pte Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
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Displaying apparatus having light emitting device, method of manufa...
Patent number
11,610,870
Issue date
Mar 21, 2023
Seoul Semiconductor Co., Ltd.
Motonobu Takeya
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing a template wafer
Patent number
11,557,505
Issue date
Jan 17, 2023
Infineon Technologies AG
Wolfgang Lehnert
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Apparatus and methods for micro-transfer-printing
Patent number
11,472,171
Issue date
Oct 18, 2022
X Display Company Technology Limited
Christopher Bower
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
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LTHC as charging barrier in InFO package formation
Patent number
11,437,361
Issue date
Sep 6, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
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Method for fabricating carrier-free semiconductor package
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11,289,409
Issue date
Mar 29, 2022
Siliconware Precision Industries Co., Ltd.
Yueh-Ying Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package, manufacturing method of semiconductor device...
Patent number
11,177,156
Issue date
Nov 16, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of manufacturing a semiconductor de...
Patent number
11,139,375
Issue date
Oct 5, 2021
Infineon Technologies AG
Carsten Schaeffer
H01 - BASIC ELECTRIC ELEMENTS
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Film-like adhesive and method for producing semiconductor package u...
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11,139,261
Issue date
Oct 5, 2021
Furukawa Electric Co., Ltd.
Minoru Morita
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Wafer level chip scale package structure and manufacturing method t...
Patent number
11,062,969
Issue date
Jul 13, 2021
Alpha and Omega Semiconductor (Cayman) LTD
Cheow Khoon Oh
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Displaying apparatus having light emitting device, method of manufa...
Patent number
11,043,476
Issue date
Jun 22, 2021
Seoul Semiconductor Co., Ltd.
Motonobu Takeya
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing an electronic device and electronic device...
Patent number
11,031,259
Issue date
Jun 8, 2021
Amkor Technology Singapore Holding Pte Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
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Carrier assisted substrate method of manufacturing an electronic de...
Patent number
11,018,040
Issue date
May 25, 2021
Amkor Technology Singapore Holding Pte Ltd.
Roger St. Amand
H01 - BASIC ELECTRIC ELEMENTS
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Polyimide film for semiconductor package reflow process, and manufa...
Patent number
11,015,089
Issue date
May 25, 2021
IPI TECH INC.
Kye-Ung Lee
B32 - LAYERED PRODUCTS
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Semiconductor package and fabricating method thereof
Patent number
10,943,858
Issue date
Mar 9, 2021
Amkor Technology Singapore Holding Pte Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
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Method of forming a chip arrangement, chip arrangement, method of f...
Patent number
10,930,541
Issue date
Feb 23, 2021
Infineon Technologies AG
Thomas Kilger
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Housing comprising a semiconductor body and a method for producing...
Patent number
10,903,406
Issue date
Jan 26, 2021
OSRAM OLED GmbH
Martin Unterburger
H01 - BASIC ELECTRIC ELEMENTS
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Etched trenches in bond materials for die singulation, and associat...
Patent number
10,892,384
Issue date
Jan 12, 2021
Micron Technology, Inc.
Vladimir Odnoblyudov
H01 - BASIC ELECTRIC ELEMENTS
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Sheet and composite sheet
Patent number
10,888,929
Issue date
Jan 12, 2021
Nitto Denko Corporation
Nao Kamakura
B22 - CASTING POWDER METALLURGY
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Adhesive film for semiconductor
Patent number
10,865,329
Issue date
Dec 15, 2020
LG Chem, Ltd.
Hee Jung Kim
B32 - LAYERED PRODUCTS
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Sheet sticking method
Patent number
10,847,404
Issue date
Nov 24, 2020
Disco Corporation
Masamitsu Agari
H01 - BASIC ELECTRIC ELEMENTS
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Displaying apparatus having light emitting device, method of manufa...
Patent number
10,797,027
Issue date
Oct 6, 2020
Seoul Semiconductor Co., Ltd.
Motonobu Takeya
H01 - BASIC ELECTRIC ELEMENTS
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Wafer level flat no-lead semiconductor packages and methods of manu...
Patent number
10,770,333
Issue date
Sep 8, 2020
Semiconductor Components Industries, LLC
Darrell D. Truhitte
H01 - BASIC ELECTRIC ELEMENTS
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Wafer level flat no-lead semiconductor packages and methods of manu...
Patent number
10,770,332
Issue date
Sep 8, 2020
Semiconductor Components Industries, LLC
Darrell D. Truhitte
H01 - BASIC ELECTRIC ELEMENTS
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Adhesive composition for semiconductor, adhesive film for semicondu...
Patent number
10,759,971
Issue date
Sep 1, 2020
LG Chem, Ltd.
Hee Jung Kim
H01 - BASIC ELECTRIC ELEMENTS
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Wafer level flat no-lead semiconductor packages and methods of manu...
Patent number
10,707,111
Issue date
Jul 7, 2020
Semiconductor Components Industries, LLC
Darrell D. Truhitte
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
Publication number
20240087914
Publication date
Mar 14, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FILM-LIKE ADHESIVE AGENT, DICING/DIE-BONDING ALL-IN-ONE FILM, SEMIC...
Publication number
20240043722
Publication date
Feb 8, 2024
Takahiro KURODA
H01 - BASIC ELECTRIC ELEMENTS
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CURABLE RESIN FILM, FILM MATERIAL FOR SEMICONDUCTOR DEVICE PRODUCTI...
Publication number
20240021443
Publication date
Jan 18, 2024
Resonac Corporation
Shogo SOBUE
H01 - BASIC ELECTRIC ELEMENTS
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MICRODEVICE SUBSTRATE, DISPLAY PANEL, PREPARATION METHOD, AND DISPL...
Publication number
20240006220
Publication date
Jan 4, 2024
TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.
Sitao HUO
H01 - BASIC ELECTRIC ELEMENTS
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WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION
Publication number
20230386954
Publication date
Nov 30, 2023
MEDIATEK INC.
Yu-Tung Chen
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230360949
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
Publication number
20230282560
Publication date
Sep 7, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
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Chip transfer assembly and manufacturing method therefor, chip tran...
Publication number
20220384236
Publication date
Dec 1, 2022
CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
Feng ZHAI
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20220076982
Publication date
Mar 10, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
Publication number
20220059387
Publication date
Feb 24, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Roger St. Amand
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
Publication number
20220051909
Publication date
Feb 17, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
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MASKING TAPE FOR FORMING ELECTROMAGNETIC WAVE SHIELD
Publication number
20210269682
Publication date
Sep 2, 2021
Nitto Denko Corporation
Yuji OKAWA
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
Publication number
20210217692
Publication date
Jul 15, 2021
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
HOUSING COMPRISING A SEMICONDUCTOR BODY AND A METHOD FOR PRODUCING...
Publication number
20210104653
Publication date
Apr 8, 2021
OSRAM OLED GmbH
Martin Unterburger
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE...
Publication number
20210057259
Publication date
Feb 25, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Sheng-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
Publication number
20200402830
Publication date
Dec 24, 2020
Amkor Technology, Inc.
Roger St. Amand
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
Publication number
20200251354
Publication date
Aug 6, 2020
Amkor Technology, Inc.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE
Publication number
20200144167
Publication date
May 7, 2020
Siliconware Precision Industries Co., Ltd.
Yueh-Ying Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Method of Forming a Chip Arrangement, Chip Arrangement, Method of F...
Publication number
20190221465
Publication date
Jul 18, 2019
INFINEON TECHNOLOGIES AG
Thomas Kilger
H01 - BASIC ELECTRIC ELEMENTS
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THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE
Publication number
20190206825
Publication date
Jul 4, 2019
NITTO DENKO CORPORATION
Yuki Sugo
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Structure of printed circuit board and carrier and method of making...
Publication number
20190189467
Publication date
Jun 20, 2019
Chung-Pao Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
Publication number
20190189552
Publication date
Jun 20, 2019
Amkor Technology, Inc.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD T...
Publication number
20190157174
Publication date
May 23, 2019
Alpha and Omega Semiconductor (Cayman) Ltd.
Cheow Khoon Oh
H01 - BASIC ELECTRIC ELEMENTS
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Method of Manufacturing a Semiconductor Device Having Graphene Mate...
Publication number
20190081143
Publication date
Mar 14, 2019
INFINEON TECHNOLOGIES AG
Guenther Ruhl
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LTHC as Charging Barrier in InFO Package Formation
Publication number
20190035774
Publication date
Jan 31, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE WITH INDIVIDUALLY MOLDED LEADFRAME AND DIE CO...
Publication number
20190035669
Publication date
Jan 31, 2019
STMICROELECTRONICS, INC.
Jefferson TALLEDO
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Patent Application
EXPANSION METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AN...
Publication number
20180323097
Publication date
Nov 8, 2018
Hitachi Chemical Company, Ltd.
Yukihiro IWANAGA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE
Publication number
20180323353
Publication date
Nov 8, 2018
Lumileds LLC
Jipu Lei
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM
Publication number
20180294242
Publication date
Oct 11, 2018
FURUKAWA ELECTRIC CO., LTD.
Naoaki MIHARA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PROTECTIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20180286737
Publication date
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DEXERIALS CORPORATION
Hironobu Moriyama
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