with regions of different dielectrics in the same layer

Industry

CPC
H05K2201/0187

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0187with regions of different dielectrics in the same layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit signal enhancement method of circuit board and structure th...
- Patent number 11,937,366
- Issue date Mar 19, 2024
- Unimicron Technology Corp.
- Tzu Hsuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 11,765,827
- Issue date Sep 19, 2023
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable dielectric constant materials in same layer of a package
- Patent number 11,715,688
- Issue date Aug 1, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable substrate, method for manufacturing stretchable substra...
- Patent number 11,683,882
- Issue date Jun 20, 2023
- Korea University Research and Business Foundation, Sejong Campus
- Sang Il Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vibration-damped circuit arrangement, converter, and aircraft havin...
- Patent number 11,564,310
- Issue date Jan 24, 2023
- Rolls-Royce Deutschland Ltd & Co KG
- Rene Blank
- G11 - INFORMATION STORAGE
Information Patent Grant
Stretchable substrate, method for manufacturing stretchable substra...
- Patent number 11,477,882
- Issue date Oct 18, 2022
- Korea University Research and Business Foundation, Sejong Campus
- Sang Il Kim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 11,304,311
- Issue date Apr 12, 2022
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Leadframe substrate having modulator and crack inhibiting structure...
- Patent number 11,291,146
- Issue date Mar 29, 2022
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 11,277,922
- Issue date Mar 15, 2022
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board with improved bending reliability and manufa...
- Patent number 11,272,611
- Issue date Mar 8, 2022
- Gigalane Co., Ltd.
- Sang Pil Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device, system and method to promote the integrity of signal commun...
- Patent number 11,153,968
- Issue date Oct 19, 2021
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and package having the same
- Patent number 11,122,694
- Issue date Sep 14, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae-Hong Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable substrate, method for manufacturing stretchable substra...
- Patent number 11,076,481
- Issue date Jul 27, 2021
- Korea University Research and Business Foundation, Sejong Campus
- Sang Il Kim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multl-phase layered busbar for conducting electric energy wherein t...
- Patent number 11,070,036
- Issue date Jul 20, 2021
- ABB Schweiz AG
- Rudi Velthuis
- B32 - LAYERED PRODUCTS
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 11,049,819
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board for reducing transmitting loss and electronic device...
- Patent number 10,999,921
- Issue date May 4, 2021
- Samsung Electronics Co., Ltd.
- Chan-Gi Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, method for manufacturing circuit board, and electron...
- Patent number 10,896,871
- Issue date Jan 19, 2021
- Fujitsu Limited
- Tomoyuki Akahoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,820,427
- Issue date Oct 27, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a component embedded package carrier
- Patent number 10,798,822
- Issue date Oct 6, 2020
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase busbar for conducting electric energy and method of man...
- Patent number 10,790,643
- Issue date Sep 29, 2020
- ABB Schweiz AG
- Rudi Velthuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor path structure having a component received in a vibration...
- Patent number 10,779,399
- Issue date Sep 15, 2020
- POSSEHL ELECTRONICS DEUTSCHLAND GMBH
- Dietmar Kurzeja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication method of substrate structure
- Patent number 10,764,995
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Jin-Wei You
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrates for stretchable electronics and method of manufacture
- Patent number 10,736,212
- Issue date Aug 4, 2020
- ARES MATERIALS INC.
- Radu Reit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrate and methods for fabricating the same
- Patent number 10,716,214
- Issue date Jul 14, 2020
- Intel Corporation
- Robert Starkston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency electronic device and manufacturing method thereof
- Patent number 10,709,012
- Issue date Jul 7, 2020
- Innolux Corporation
- Yan-Syun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting assembly with a heatsink
- Patent number 10,681,801
- Issue date Jun 9, 2020
- CPT GROUP GMBH
- Aurelian Kotlar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,674,610
- Issue date Jun 2, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microwave generator for a microwave device and microwave device
- Patent number 10,667,338
- Issue date May 26, 2020
- E.G.O. Elektro-Geraetebau GmbH
- Marcus Frank
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simultaneous and selective wide gap partitioning of via structures...
- Patent number 10,667,390
- Issue date May 26, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,602,616
- Issue date Mar 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASI...
- Publication number 20230352384
- Publication date Nov 2, 2023
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20230262893
- Publication date Aug 17, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE
- Publication number 20230223200
- Publication date Jul 13, 2023
- Imagine TF, LLC
- Brian Edward Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD WITH THERMALLY CONDUCTIVE CONNECTION TO A HE...
- Publication number 20220225491
- Publication date Jul 14, 2022
- HELLA GmbH & Co. KGaA
- Dirk BÖSCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20220015221
- Publication date Jan 13, 2022
- SONY GROUP CORPORATION
- Takahiro SHINOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Boards with Embedded Planes
- Publication number 20210410273
- Publication date Dec 30, 2021
- Intel Corporation
- Jackson Chung Peng KONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...
- Publication number 20210368620
- Publication date Nov 25, 2021
- KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SEJONG CAMPUS
- Sang Il KIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLEXIBLE CIRCUIT BOARD WITH IMPROVED BENDING RELIABILITY AND MANUFA...
- Publication number 20210360780
- Publication date Nov 18, 2021
- GIGALANE CO., LTD.
- Sang Pil KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...
- Publication number 20210329780
- Publication date Oct 21, 2021
- KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SEJONG CAMPUS
- Sang Il KIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INTERCONNECT SUBSTRATE HAVING BUFFER MATERIAL AND CRACK STOPPER AND...
- Publication number 20210289678
- Publication date Sep 16, 2021
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIBRATION-DAMPED CIRCUIT ARRANGEMENT, CONVERTER, AND AIRCRAFT HAVIN...
- Publication number 20210161002
- Publication date May 27, 2021
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Rene Blank
- G11 - INFORMATION STORAGE
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20210153360
- Publication date May 20, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20200383204
- Publication date Dec 3, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...
- Publication number 20200362169
- Publication date Nov 19, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshihiro YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200281068
- Publication date Sep 3, 2020
- InnoLux Corporation
- Yan-Syun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...
- Publication number 20200229301
- Publication date Jul 16, 2020
- KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SEJONG CAMPUS
- Sang Il KIM
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED CIRCUIT BOARD AND PACKAGE HAVING THE SAME
- Publication number 20200178401
- Publication date Jun 4, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Tae-Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...
- Publication number 20200170105
- Publication date May 28, 2020
- Possehl Electronics Deutschland GmbH
- Dietmar Kurzeja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR ASSEMBLY HAVING DUAL WIRING STRUCTURES AND WARP BALANCER
- Publication number 20200146192
- Publication date May 7, 2020
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20200083177
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20200053864
- Publication date Feb 13, 2020
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Simon Sebanz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting Assembly With a Heatsink
- Publication number 20190254157
- Publication date Aug 15, 2019
- CPT GROUP GMBH
- AURELIAN KOTLAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH STRESS RELIEVING FEATURES
- Publication number 20190230788
- Publication date Jul 25, 2019
- Intel Corporation
- Mao GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEADFRAME SUBSTRATE HAVING MODULATOR AND CRACK INHIBITING STRUCTURE...
- Publication number 20190182997
- Publication date Jun 13, 2019
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...
- Publication number 20190075662
- Publication date Mar 7, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIN ARRAY INCLUDING SEGMENTED PINS FOR FORMING SELECTIVELY PLATED T...
- Publication number 20190045629
- Publication date Feb 7, 2019
- International Business Machines Corporation
- MATTHEW S. DOYLE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE...
- Publication number 20180343744
- Publication date Nov 29, 2018
- Intel Corporation
- Robert Starkston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE PARTITIONING OF VIA STRUCTURES IN PRINTED CIRCUIT BOARDS
- Publication number 20180310418
- Publication date Oct 25, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Stig KALLMAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STRAIN ISOLATION STRUCTURES FOR STRETCHABLE ELECTRONICS
- Publication number 20180302988
- Publication date Oct 18, 2018
- MC10, Inc.
- Yung-Yu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20180270949
- Publication date Sep 20, 2018
- Fujitsu Limited
- Taiga Fukumori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with regions of different dielectrics in the same layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit signal enhancement method of circuit board and structure th...

Simultaneous and selective wide gap partitioning of via structures...

Variable dielectric constant materials in same layer of a package

Stretchable substrate, method for manufacturing stretchable substra...

Vibration-damped circuit arrangement, converter, and aircraft havin...

Stretchable substrate, method for manufacturing stretchable substra...

Simultaneous and selective wide gap partitioning of via structures...

Leadframe substrate having modulator and crack inhibiting structure...

Circuit board with bridge chiplets

Flexible circuit board with improved bending reliability and manufa...

Device, system and method to promote the integrity of signal commun...

Printed circuit board and package having the same

Stretchable substrate, method for manufacturing stretchable substra...

Multl-phase layered busbar for conducting electric energy wherein t...

Shielded package assemblies with integrated capacitor

Circuit board for reducing transmitting loss and electronic device...

Circuit board, method for manufacturing circuit board, and electron...

Simultaneous and selective wide gap partitioning of via structures...

Method of manufacturing a component embedded package carrier

Multi-phase busbar for conducting electric energy and method of man...

Conductor path structure having a component received in a vibration...

Fabrication method of substrate structure

Substrates for stretchable electronics and method of manufacture

Hybrid microelectronic substrate and methods for fabricating the same

High-frequency electronic device and manufacturing method thereof

Mounting assembly with a heatsink

Multilayer rigid flexible printed circuit board and method for manu...

Microwave generator for a microwave device and microwave device

Simultaneous and selective wide gap partitioning of via structures...

Multilayer rigid flexible printed circuit board and method for manu...

Patents Applicationslast 30 patents

THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASI...

CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE

FLEXIBLE CIRCUIT BOARD WITH THERMALLY CONDUCTIVE CONNECTION TO A HE...

SUBSTRATE AND ELECTRONIC DEVICE

Hybrid Boards with Embedded Planes

STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...

FLEXIBLE CIRCUIT BOARD WITH IMPROVED BENDING RELIABILITY AND MANUFA...

STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...

INTERCONNECT SUBSTRATE HAVING BUFFER MATERIAL AND CRACK STOPPER AND...

VIBRATION-DAMPED CIRCUIT ARRANGEMENT, CONVERTER, AND AIRCRAFT HAVIN...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...

HIGH-FREQUENCY ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRA...

PRINTED CIRCUIT BOARD AND PACKAGE HAVING THE SAME

CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...

SEMICONDUCTOR ASSEMBLY HAVING DUAL WIRING STRUCTURES AND WARP BALANCER

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

Mounting Assembly With a Heatsink

SUBSTRATE WITH STRESS RELIEVING FEATURES

LEADFRAME SUBSTRATE HAVING MODULATOR AND CRACK INHIBITING STRUCTURE...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES...

PIN ARRAY INCLUDING SEGMENTED PINS FOR FORMING SELECTIVELY PLATED T...

A HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE...

SELECTIVE PARTITIONING OF VIA STRUCTURES IN PRINTED CIRCUIT BOARDS

STRAIN ISOLATION STRUCTURES FOR STRETCHABLE ELECTRONICS

CIRCUIT BOARD AND ELECTRONIC DEVICE