with reorientation means

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CPC
Y10S156/942

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S156/00Adhesive bonding and miscellaneous chemical manufacture

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Y10S156/942with reorientation means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for manufacturing element array and apparatus for removin...
- Patent number 11,167,541
- Issue date Nov 9, 2021
- TDK Corporation
- Toshinobu Miyagoshi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing element array and method of removing specif...
- Patent number 11,101,317
- Issue date Aug 24, 2021
- TDK Corporation
- Toshinobu Miyagoshi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for stripping a product substrate from a carrier substrate
- Patent number 9,381,732
- Issue date Jul 5, 2016
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for thermal-slide debonding of temporary bonded semiconducto...
- Patent number 9,281,229
- Issue date Mar 8, 2016
- Suss MicroTec Lithography GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for stripping a product substrate from a carrier substrate
- Patent number 9,186,877
- Issue date Nov 17, 2015
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Delamination system
- Patent number 8,997,821
- Issue date Apr 7, 2015
- Tokyo Electron Limited
- Osamu Hirakawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device and method for stripping a product substrate from a carrier...
- Patent number 8,986,496
- Issue date Mar 24, 2015
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for thermal-slide debonding of temporary bonded semicondu...
- Patent number 8,919,412
- Issue date Dec 30, 2014
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for centering wafers
- Patent number 8,764,026
- Issue date Jul 1, 2014
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for mechanically debonding temporary bonded semiconductor...
- Patent number 8,267,143
- Issue date Sep 18, 2012
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for temporary wafer bonding and debonding
- Patent number 8,181,688
- Issue date May 22, 2012
- Suss Microtec Lithography, GmbH
- Hale Johnson
- B32 - LAYERED PRODUCTS
Information Patent Grant
Protective tape removing apparatus and method of assembling semicon...
- Patent number 7,129,118
- Issue date Oct 31, 2006
- Samsung Electronics Co., Ltd.
- Cheol-Joon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring a substantially disc-shaped workpiece, and d...
- Patent number 6,827,809
- Issue date Dec 7, 2004
- Koninklijke Philips Electronics N.V.
- Joachim Anker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor thin film and method of producing...
- Patent number 6,802,926
- Issue date Oct 12, 2004
- Canon Kabushiki Kaisha
- Masaki Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for the multiplexed acquisition of a bare die...
- Patent number 6,773,543
- Issue date Aug 10, 2004
- Delaware Capital Formation, Inc.
- Michael A. Summers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample processing apparatus and method
- Patent number 6,773,534
- Issue date Aug 10, 2004
- Canon Kabushiki Kaisha
- Kazutaka Yanagita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and system for removing carrier film from a singulated die
- Patent number 6,751,853
- Issue date Jun 22, 2004
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing carrier film from a singulated die
- Patent number 6,658,718
- Issue date Dec 9, 2003
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample processing apparatus and method
- Patent number 6,609,553
- Issue date Aug 26, 2003
- Canon Kabushiki Kaisha
- Kazutaka Yanagita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding method and apparatus
- Patent number 6,547,902
- Issue date Apr 15, 2003
- Kabushiki Kaisha Shinkawa
- Tsuneharu Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer table for die bonding apparatus
- Patent number 6,543,513
- Issue date Apr 8, 2003
- ASM Assembly Automation Ltd.
- Siu Wing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for removing carrier tape from a singulated die
- Patent number 6,505,395
- Issue date Jan 14, 2003
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample processing apparatus and method
- Patent number 6,427,748
- Issue date Aug 6, 2002
- Canon Kabushiki Kaisha
- Kazutaka Yanagita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an SOI wafer and SOI wafer fabricated by the...
- Patent number 6,284,629
- Issue date Sep 4, 2001
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for semiconductor chip handling
- Patent number 6,283,693
- Issue date Sep 4, 2001
- General Semiconductor, Inc.
- Salvatore Acello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor thin film and method of producing...
- Patent number 6,258,666
- Issue date Jul 10, 2001
- Canon Kabushiki Kaisha
- Masaki Mizutani
- C30 - CRYSTAL GROWTH
Information Patent Grant
Apparatus and method for chip processing
- Patent number 6,248,201
- Issue date Jun 19, 2001
- Lucent Technologies, Inc.
- John E. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for removing carrier film from a semiconductor die
- Patent number 6,202,292
- Issue date Mar 20, 2001
- Micron Technology, Inc.
- Warren M. Farnworth
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
System and method for processing ingots
- Patent number 6,182,729
- Issue date Feb 6, 2001
- Nippei Toyama Corporation
- Yoshiaki Banzawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for removing die from a wafer and conveying di...
- Patent number 6,173,750
- Issue date Jan 16, 2001
- Hover-Davis, Inc.
- Peter Davis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DELAMINATION SYSTEM
- Publication number 20140069588
- Publication date Mar 13, 2014
- TOKYO ELECTRON LIMITED
- Osamu HIRAKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...
- Publication number 20130340947
- Publication date Dec 26, 2013
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR DETACHING A SEMICONDUCTOR WAFER FROM A SUBSTRATE
- Publication number 20120152465
- Publication date Jun 21, 2012
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDU...
- Publication number 20110010908
- Publication date Jan 20, 2011
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING
- Publication number 20110014774
- Publication date Jan 20, 2011
- SUSS MICROTEC INC
- HALE JOHNSON
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR...
- Publication number 20100263794
- Publication date Oct 21, 2010
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE FOR CENTERING WAFERS
- Publication number 20100266373
- Publication date Oct 21, 2010
- SUSS MICROTEC INC
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
Protective tape removing apparatus and method of assembling semicon...
- Publication number 20040121514
- Publication date Jun 24, 2004
- Cheol-Joon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for the multiplexed acquisition of a bar die f...
- Publication number 20030211652
- Publication date Nov 13, 2003
- Michael Summers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of transferring a substiantially disc-shaped workpiece, and...
- Publication number 20030000635
- Publication date Jan 2, 2003
- Joachim Anker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for removing carrier film from a singulated die
- Publication number 20020178567
- Publication date Dec 5, 2002
- Warren M. Farnworth.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sample processing apparatus and method
- Publication number 20020157794
- Publication date Oct 31, 2002
- Kazutaka Yanagita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sample processing apparatus and method
- Publication number 20020157791
- Publication date Oct 31, 2002
- Kazutaka Yanagita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating an SOI wafer and SOI wafer fabricated by the...
- Publication number 20010046746
- Publication date Nov 29, 2001
- SHIN-ETSU HANDOTAI CO., LTD.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing semiconductor thin film and method of producing...
- Publication number 20010018949
- Publication date Sep 6, 2001
- Masaki Mizutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus and method for removing carrier film from a singulated die
- Publication number 20010010119
- Publication date Aug 2, 2001
- Warren M. Farnworth.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die bonding method and apparatus
- Publication number 20010004002
- Publication date Jun 21, 2001
- KABUSHIKI KAISHA SHINKAWA
- Tsuneharu Arai
- H01 - BASIC ELECTRIC ELEMENTS

with reorientation means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for manufacturing element array and apparatus for removin...

Method of manufacturing element array and method of removing specif...

Device for stripping a product substrate from a carrier substrate

Method for thermal-slide debonding of temporary bonded semiconducto...

Method for stripping a product substrate from a carrier substrate

Delamination system

Device and method for stripping a product substrate from a carrier...

Apparatus for thermal-slide debonding of temporary bonded semicondu...

Device for centering wafers

Apparatus for mechanically debonding temporary bonded semiconductor...

Apparatus for temporary wafer bonding and debonding

Protective tape removing apparatus and method of assembling semicon...

Method of transferring a substantially disc-shaped workpiece, and d...

Method of producing semiconductor thin film and method of producing...

Method and apparatus for the multiplexed acquisition of a bare die...

Sample processing apparatus and method

Apparatus and system for removing carrier film from a singulated die

Method for removing carrier film from a singulated die

Sample processing apparatus and method

Die bonding method and apparatus

Wafer table for die bonding apparatus

Apparatus and method for removing carrier tape from a singulated die

Sample processing apparatus and method

Method of fabricating an SOI wafer and SOI wafer fabricated by the...

Method and apparatus for semiconductor chip handling

Method of producing semiconductor thin film and method of producing...

Apparatus and method for chip processing

Apparatus for removing carrier film from a semiconductor die

System and method for processing ingots

Method and apparatus for removing die from a wafer and conveying di...

Patents Applicationslast 30 patents

DELAMINATION SYSTEM

DEVICE AND METHOD FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER...

DEVICE AND METHOD FOR DETACHING A SEMICONDUCTOR WAFER FROM A SUBSTRATE

APPARATUS FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDU...

APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING

APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR...

DEVICE FOR CENTERING WAFERS

Protective tape removing apparatus and method of assembling semicon...

Method and apparatus for the multiplexed acquisition of a bar die f...

Method of transferring a substiantially disc-shaped workpiece, and...

Apparatus and method for removing carrier film from a singulated die

Sample processing apparatus and method

Sample processing apparatus and method

Method of fabricating an SOI wafer and SOI wafer fabricated by the...

Method of producing semiconductor thin film and method of producing...

Apparatus and method for removing carrier film from a singulated die

Die bonding method and apparatus