with repetition of the same manufacturing step

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H01L2224/03901

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03901with repetition of the same manufacturing step

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 12,148,721
- Issue date Nov 19, 2024
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 11,430,753
- Issue date Aug 30, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method of processing a semiconductor chip
- Patent number 11,164,830
- Issue date Nov 2, 2021
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,056,451
- Issue date Jul 6, 2021
- Sumitomo Electric Device Innovations, Inc.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor chips to a landing wafer
- Patent number 10,797,016
- Issue date Oct 6, 2020
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method for manufacturing semiconductor chip, in...
- Patent number 10,658,321
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hidekazu Inoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for forming a chip pad
- Patent number 10,636,754
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for forming a chip pad
- Patent number 10,236,265
- Issue date Mar 19, 2019
- Infineon Technologies AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method of processing a semiconductor chip
- Patent number 10,134,697
- Issue date Nov 20, 2018
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with under bump metallization a...
- Patent number 9,865,554
- Issue date Jan 9, 2018
- STATS ChipPAC Ptc. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Environmental hardened packaged integrated circuit
- Patent number 9,711,480
- Issue date Jul 18, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment for semiconductor devices
- Patent number 9,418,955
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 9,136,167
- Issue date Sep 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating structure for wafer level packages
- Patent number 9,070,675
- Issue date Jun 30, 2015
- Amkor Technology, Inc.
- Kwang Sup So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having under-bump metallization (UBM) structur...
- Patent number 9,059,158
- Issue date Jun 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 8,866,293
- Issue date Oct 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with non-metal sidewall protection structure
- Patent number 8,841,766
- Issue date Sep 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device having under-bump metallization (UBM) structur...
- Patent number 8,803,338
- Issue date Aug 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment for semiconductor devices
- Patent number 8,629,053
- Issue date Jan 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming conductive THV and RDL o...
- Patent number 8,623,702
- Issue date Jan 7, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump metallization (UBM) structure and method of forming the...
- Patent number 8,581,420
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device, and mounting structur...
- Patent number 8,426,303
- Issue date Apr 23, 2013
- Renesas Electronics Corporation
- Zenzo Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for efficiently patterning an underbump metallization lay...
- Patent number 7,585,759
- Issue date Sep 8, 2009
- Advanced Micro Devices, Inc.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
- Publication number 20230114550
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Yongbum KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS
- Publication number 20220359437
- Publication date Nov 10, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20220223554
- Publication date Jul 14, 2022
- ams AG
- Jens Hofrichter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS
- Publication number 20220013478
- Publication date Jan 13, 2022
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210091023
- Publication date Mar 25, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20200091098
- Publication date Mar 19, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip and Method for Forming a Chip Pad
- Publication number 20190189574
- Publication date Jun 20, 2019
- INFINEON TECHNOLOGIES AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip and method of processing a semiconductor chip
- Publication number 20190043818
- Publication date Feb 7, 2019
- INFINEON TECHNOLOGIES AG
- Dietrich BONART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...
- Publication number 20140363970
- Publication date Dec 11, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...
- Publication number 20140327136
- Publication date Nov 6, 2014
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Treatment for Semiconductor Devices
- Publication number 20140131861
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive THV and RDL o...
- Publication number 20140070427
- Publication date Mar 13, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating Structure For Wafer Level Packages
- Publication number 20140070408
- Publication date Mar 13, 2014
- Kwang Sup So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...
- Publication number 20140042619
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120280384
- Publication date Nov 8, 2012
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive THV and RDL o...
- Publication number 20120217644
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD
- Publication number 20120178189
- Publication date Jul 12, 2012
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120129335
- Publication date May 24, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Masamitsu IKUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...
- Publication number 20120098124
- Publication date Apr 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE...
- Publication number 20120091576
- Publication date Apr 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Treatment for Semiconductor Devices
- Publication number 20110309490
- Publication date Dec 22, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTUR...
- Publication number 20110291270
- Publication date Dec 1, 2011
- Renesas Electronics Corporation
- Zenzo SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20110233761
- Publication date Sep 29, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching solution for etching metal layer, etching method using the...
- Publication number 20080045035
- Publication date Feb 21, 2008
- Ji-Sung Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TECHNIQUE FOR EFFICIENTLY PATTERNING AN UNDERBUMP METALLIZATION LAY...
- Publication number 20070023928
- Publication date Feb 1, 2007
- FRANK KUECHENMEISTER
- H01 - BASIC ELECTRIC ELEMENTS

with repetition of the same manufacturing step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Iterative formation of damascene interconnects

Iterative formation of damascene interconnects

Method of making a pillar structure having a non-metal sidewall pro...

Semiconductor chip and method of processing a semiconductor chip

Semiconductor device manufacturing method and semiconductor device

Method for bonding semiconductor chips to a landing wafer

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Semiconductor chip, method for manufacturing semiconductor chip, in...

Semiconductor chip and method for forming a chip pad

Semiconductor chip and method for forming a chip pad

Semiconductor chip and method of processing a semiconductor chip

Integrated circuit packaging system with under bump metallization a...

Conductive connections, structures with such connections, and metho...

Environmental hardened packaged integrated circuit

Plasma treatment for semiconductor devices

Method of making a pillar structure having a non-metal sidewall pro...

Plating structure for wafer level packages

Semiconductor device having under-bump metallization (UBM) structur...

Semiconductor structure and fabrication method thereof

Cu pillar bump with non-metal sidewall protection structure

Semiconductor device having under-bump metallization (UBM) structur...

Plasma treatment for semiconductor devices

Semiconductor device and method of forming conductive THV and RDL o...

Under-bump metallization (UBM) structure and method of forming the...

Manufacturing method of semiconductor device, and mounting structur...

Technique for efficiently patterning an underbump metallization lay...

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

ITERATIVE FORMATION OF DAMASCENE INTERCONNECTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

Semiconductor Chip and Method for Forming a Chip Pad

Semiconductor chip and method of processing a semiconductor chip

METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...

Plasma Treatment for Semiconductor Devices

Semiconductor Device and Method of Forming Conductive THV and RDL o...

Plating Structure For Wafer Level Packages

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor Device and Method of Forming Conductive THV and RDL o...

METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTUR...

UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE...

Plasma Treatment for Semiconductor Devices

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTUR...

CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE

Etching solution for etching metal layer, etching method using the...

TECHNIQUE FOR EFFICIENTLY PATTERNING AN UNDERBUMP METALLIZATION LAY...