with repetition of the same manufacturing step

Industry

CPC
H01L2224/11901

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11901with repetition of the same manufacturing step

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for forming conductive layer, and conductive structure and f...
- Patent number 12,040,292
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ming-Teng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric molded indium bump formation and INP planarization
- Patent number 11,694,981
- Issue date Jul 4, 2023
- Princeton Infrared Technologies, Inc.
- Martin H Ettenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,373,990
- Issue date Jun 28, 2022
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,244,917
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,171,102
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,094,657
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,063,009
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48408
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,797,024
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing solder bump by vacuum annealing
- Patent number 10,784,221
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaged die on leadframe with common contact
- Patent number 10,741,479
- Issue date Aug 11, 2020
- Great Wall Semiconductor Corporation
- Patrick M. Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
- Patent number 10,734,346
- Issue date Aug 4, 2020
- ELPIS TECHNOLOGIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple sized bump bonds
- Patent number 10,727,192
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48111
- Issue date Jul 21, 2020
- JCET Semiconductor (Shaoxing) Co. Ltd.
- Reza A. Pagaila
Information Patent Grant
Method of making fully molded peripheral package on package device
- Patent number 10,672,624
- Issue date Jun 2, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,636,765
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bump, method for forming composite bump, and substrate
- Patent number 10,629,556
- Issue date Apr 21, 2020
- Fujitsu Limited
- Takashi Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect substrate f...
- Patent number 10,607,946
- Issue date Mar 31, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra thin multi-die fac...
- Patent number 10,573,600
- Issue date Feb 25, 2020
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming 3D dual side die embedde...
- Patent number 10,510,703
- Issue date Dec 17, 2019
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper structures with intermetallic coating for integrated circuit...
- Patent number 10,461,052
- Issue date Oct 29, 2019
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
- Patent number 10,446,479
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ball and electronic device
- Patent number 10,446,512
- Issue date Oct 15, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming wire studs as vertical i...
- Patent number 10,446,523
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
REPAIR OF SOLDER BUMPS
- Publication number 20240222302
- Publication date Jul 4, 2024
- ORBOTECH LTD.
- Zvi KOTLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HETEROGENEOUS SOLDER BUMP STRUCTURE
- Publication number 20240113060
- Publication date Apr 4, 2024
- Societe de commercialisation des produits de la recherche appliquee SOCPRA Sc...
- Abderrahim EL AMRANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240071840
- Publication date Feb 29, 2024
- InnoLux Corporation
- Cheng-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...
- Publication number 20230260943
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Christopher Glancey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230089483
- Publication date Mar 23, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOKAZU ITOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die for S...
- Publication number 20220285334
- Publication date Sep 8, 2022
- SEMTECH CORPORATION
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE DIRECT COPPER-COPPER BONDING
- Publication number 20220018036
- Publication date Jan 20, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE LAYER, AND CONDUCTIVE STRUCTURE AND F...
- Publication number 20220013479
- Publication date Jan 13, 2022
- Changxin Memory Technologies, Inc.
- Ming-Teng HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC MOLDED INDIUM BUMP FORMATION AND INP PLANARIZATION
- Publication number 20200411463
- Publication date Dec 31, 2020
- PRINCETON INFRARED TECHNOLOGIES, INC.
- Martin H Ettenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326242
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326243
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
- Publication number 20190244926
- Publication date Aug 8, 2019
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190157230
- Publication date May 23, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BUMP, METHOD FOR FORMING COMPOSITE BUMP, AND SUBSTRATE
- Publication number 20180337156
- Publication date Nov 22, 2018
- Fujitsu Limited
- TAKASHI KUBOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20180330966
- Publication date Nov 15, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING
- Publication number 20180254216
- Publication date Sep 6, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
- Publication number 20180108606
- Publication date Apr 19, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20180068937
- Publication date Mar 8, 2018
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Device and Method of Forming Build-Up Interconnect St...
- Publication number 20180006008
- Publication date Jan 4, 2018
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS
- Publication number 20170372964
- Publication date Dec 28, 2017
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...
- Publication number 20170330853
- Publication date Nov 16, 2017
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...
- Publication number 20170309572
- Publication date Oct 26, 2017
- STATS ChipPAC Pte Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Low Profile Fan-Out Pack...
- Publication number 20170271241
- Publication date Sep 21, 2017
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF CONDUCTIVE CIRCUIT
- Publication number 20140374005
- Publication date Dec 25, 2014
- Shin-Etsu Chemical Co., Ltd.
- Yoshitaka Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Embedded Wafer Level B...
- Publication number 20140367848
- Publication date Dec 18, 2014
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...
- Publication number 20140363970
- Publication date Dec 11, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS
- Publication number 20140353162
- Publication date Dec 4, 2014
- Adolphe FOYET
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Over Se...
- Publication number 20140327145
- Publication date Nov 6, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS

with repetition of the same manufacturing step

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming conductive layer, and conductive structure and f...

Semiconductor device and method of stacking semiconductor die for s...

Dielectric molded indium bump formation and INP planarization

Semiconductor device and method of making wafer level chip scale pa...

System-in-package with double-sided molding

Semiconductor device and method of stacking semiconductor die for s...

Method of making a pillar structure having a non-metal sidewall pro...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Semiconductor device

Semiconductor device and method of forming interposer frame over se...

System-in-package with double-sided molding

Method of processing solder bump by vacuum annealing

Co-packaged die on leadframe with common contact

Method of manufacturing chip-on-chip structure comprising sinterted...

Multiple sized bump bonds

Semiconductor device and method of forming interposer frame over se...

Method of making fully molded peripheral package on package device

Expanded head pillar for bump bonds

System-in-package with double-sided molding

Composite bump, method for forming composite bump, and substrate

Semiconductor device and method of forming interconnect substrate f...

Semiconductor device and method of forming ultra thin multi-die fac...

Semiconductor device and method of forming 3D dual side die embedde...

Copper structures with intermetallic coating for integrated circuit...

Semiconductor device and method of forming a PoP device with embedd...

Conductive ball and electronic device

Semiconductor device and method of forming wire studs as vertical i...

Method for manufacturing semiconductor apparatus, method for manufa...

Patents Applicationslast 30 patents

REPAIR OF SOLDER BUMPS

HETEROGENEOUS SOLDER BUMP STRUCTURE

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Stacking Semiconductor Die for S...

LOW TEMPERATURE DIRECT COPPER-COPPER BONDING

METHOD FOR FORMING CONDUCTIVE LAYER, AND CONDUCTIVE STRUCTURE AND F...

DIELECTRIC MOLDED INDIUM BUMP FORMATION AND INP PLANARIZATION

EXPANDED HEAD PILLAR FOR BUMP BONDS

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

COMPOSITE BUMP, METHOD FOR FORMING COMPOSITE BUMP, AND SUBSTRATE

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING

FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE

Semiconductor Device and Method of Forming a POP Device with Embedd...

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

Semiconductor Device and Method of Forming Build-Up Interconnect St...

SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS

COPPER STRUCTURES WITH INTERMETALLIC COATING FOR INTEGRATED CIRCUIT...

Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...

Semiconductor Device and Method of Forming Low Profile Fan-Out Pack...

FORMATION OF CONDUCTIVE CIRCUIT

Semiconductor Device and Method of Making an Embedded Wafer Level B...

METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...

ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS

Semiconductor Device and Method of Forming Interposer Frame Over Se...