with specially adapted redistribution layers [RDL]

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CPC
H01L2224/06137

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06137with specially adapted redistribution layers [RDL]

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a redistribution line
- Patent number 11,373,970
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including array power pads, and associated se...
- Patent number 11,251,148
- Issue date Feb 15, 2022
- Micron Technology, Inc.
- Hisamitsu Kimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method related to sensor die ESD protection
- Patent number 11,018,174
- Issue date May 25, 2021
- Semiconductor Components Industries, LLC
- Peter Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out structure and manufacture thereof
- Patent number 10,446,511
- Issue date Oct 15, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-D package having plurality of substrates
- Patent number 9,741,689
- Issue date Aug 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection for chip scale packaging
- Patent number 9,548,281
- Issue date Jan 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-D package having plurality of substrates
- Patent number 9,425,128
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor chip with each contact pad...
- Patent number 9,299,673
- Issue date Mar 29, 2016
- Infineon Technologies AG
- Peter Ossimitz
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip comprising a plurality of contact pads and a plu...
- Patent number 8,779,577
- Issue date Jul 15, 2014
- Infineon Technologies AG
- Peter Ossimitz
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus of fabricating a pad structure for a semicondu...
- Patent number 8,581,250
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
- Publication number 20220302060
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING ARRAY POWER PADS, AND ASSOCIATED SE...
- Publication number 20210233880
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Hisamitsu Kimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
- Publication number 20200152589
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT STRUCTURE AND MANUFACTURE THEREOF
- Publication number 20180337152
- Publication date Nov 22, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-Packages and Methods for Forming the Same
- Publication number 20150108659
- Publication date Apr 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING A SEMICONDUCTOR CHIP,...
- Publication number 20140264814
- Publication date Sep 18, 2014
- INFINEON TECHNOLOGIES AG
- Peter Ossimitz
- G11 - INFORMATION STORAGE
Information Patent Application
3D-Packages and Methods for Forming the Same
- Publication number 20140252579
- Publication date Sep 11, 2014
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING A SEMICONDUCTOR CHIP,...
- Publication number 20130207254
- Publication date Aug 15, 2013
- INFINEON TECHNOLOGIES AG
- Peter Ossimitz
- G11 - INFORMATION STORAGE
Information Patent Application
Electrical Connection for Chip Scale Packaging
- Publication number 20130087892
- Publication date Apr 11, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS OF FABRICATING A PAD STRUCTURE FOR A SEMICONDU...
- Publication number 20120161129
- Publication date Jun 28, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

with specially adapted redistribution layers [RDL]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having a redistribution line

Semiconductor devices including array power pads, and associated se...

Apparatus and method related to sensor die ESD protection

Fan-out structure and manufacture thereof

3-D package having plurality of substrates

Electrical connection for chip scale packaging

3-D package having plurality of substrates

Method for manufacturing a semiconductor chip with each contact pad...

Semiconductor chip comprising a plurality of contact pads and a plu...

Method and apparatus of fabricating a pad structure for a semicondu...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

SEMICONDUCTOR DEVICES INCLUDING ARRAY POWER PADS, AND ASSOCIATED SE...

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

FAN-OUT STRUCTURE AND MANUFACTURE THEREOF

3D-Packages and Methods for Forming the Same

SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING A SEMICONDUCTOR CHIP,...

3D-Packages and Methods for Forming the Same

SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING A SEMICONDUCTOR CHIP,...

Electrical Connection for Chip Scale Packaging

METHOD AND APPARATUS OF FABRICATING A PAD STRUCTURE FOR A SEMICONDU...