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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2021/6006with temporary supporting member not part of an apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Fabricating active-bridge-coupled GPU chiplets
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- Issue date Dec 17, 2024
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming solder bumps
- Patent number 11,990,437
- Issue date May 21, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 11,837,550
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,817,388
- Issue date Nov 14, 2023
- INNOLUX CORPORATION
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 11,715,681
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out light-emitting diode (LED) device substrate with embedded b...
- Patent number 11,626,448
- Issue date Apr 11, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out light-emitting diode (LED) device substrate with embedded b...
- Patent number 11,610,935
- Issue date Mar 21, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out light-emitting diode (LED) device substrate with embedded b...
- Patent number 11,574,951
- Issue date Feb 7, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for prefixing of substrates
- Patent number 11,328,939
- Issue date May 10, 2022
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and manufacturing method thereof
- Patent number 11,302,635
- Issue date Apr 12, 2022
- Innolux Corporation
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuits stacking approach
- Patent number 11,201,135
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out device
- Patent number 11,133,283
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit stacking approach
- Patent number 11,121,118
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 11,107,758
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED array transfer method, manufacturing method and display d...
- Patent number 11,024,611
- Issue date Jun 1, 2021
- GOERTEK, INC.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 10,964,641
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming solder bumps
- Patent number 10,879,202
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of micro light emitting diodes (LEDs) using probe pads
- Patent number 10,580,352
- Issue date Mar 3, 2020
- Facebook Technologies, LLC
- Ilias Pappas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 10,510,648
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for prefixing of substrates
- Patent number 10,438,822
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 10,424,526
- Issue date Sep 24, 2019
- Powertech Technology Inc.
- Chi-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for prefixing of substrates
- Patent number 10,340,161
- Issue date Jul 2, 2019
- EV Group E. Thallner GmbH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin-FET devices and fabrication methods thereof
- Patent number 10,269,972
- Issue date Apr 23, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 10,163,770
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 9,953,911
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuits stacking approach
- Patent number 9,502,380
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number RE45932
- Issue date Mar 15, 2016
- PS4 Luxco S.A.R.L.
- Seiya Fujii
- 001 -
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,178,971
- Issue date May 15, 2012
- Elpida Memory, Inc.
- Seiya Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT
- Publication number 20240347369
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Frank SINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT-MOUNTING-SUBSTRATE MANUFACTURING METHOD
- Publication number 20240282594
- Publication date Aug 22, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tadashi MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING METHOD AND MULTI-CHIP PACKAGING STRUCTURE
- Publication number 20240128141
- Publication date Apr 18, 2024
- Luxis Precision Intelligent Manufacturing (Kunshan) Co., Ltd.
- Yijun YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240006222
- Publication date Jan 4, 2024
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20230387101
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
- Publication number 20230378075
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT LIGHT-EMITTING DIODE (LED) DEVICE SUBSTRATE WITH EMBEDDED B...
- Publication number 20230163155
- Publication date May 25, 2023
- Lumileds LLC
- Tze Yang HIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
- Publication number 20210233854
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT LIGHT-EMITTING DIODE (LED) DEVICE SUBSTRATE WITH EMBEDDED B...
- Publication number 20200312903
- Publication date Oct 1, 2020
- Lumileds LLC
- Tze Yang HIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREFIXING OF SUBSTRATES
- Publication number 20190385870
- Publication date Dec 19, 2019
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREFIXING OF SUBSTRATES
- Publication number 20190198362
- Publication date Jun 27, 2019
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Structure and Method
- Publication number 20190148277
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL INTEGRATED CIRCUIT STACKING APPROACH
- Publication number 20190088620
- Publication date Mar 21, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Structure and Method
- Publication number 20180190578
- Publication date Jul 5, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN-FET DEVICES AND FABRICATION METHODS THEREOF
- Publication number 20180102437
- Publication date Apr 12, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- FEI ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND METHOD
- Publication number 20180005930
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PREFIXING OF SUBSTRATES
- Publication number 20170345690
- Publication date Nov 30, 2017
- EV GROUP E. THALLNER GMBH
- Friedrich Paul Lindner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL THREE DIMENSIONAL INTEGRATED CIRCUITS STACKING APPROACH
- Publication number 20160086918
- Publication date Mar 24, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL THREE DIMENSIONAL INTEGRATED CIRCUITS STACKING APPROACH
- Publication number 20140091473
- Publication date Apr 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090224403
- Publication date Sep 10, 2009
- ELPIDA MEMORY, INC.
- Seiya Fujii
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

with temporary supporting member not part of an apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fabricating active-bridge-coupled GPU chiplets

Method of forming semiconductor packages having through package vias

System and method for forming solder bumps

Method of forming semiconductor packages having through package vias

Electronic apparatus

Fan-out package structure and method

Fan-out light-emitting diode (LED) device substrate with embedded b...

Fan-out light-emitting diode (LED) device substrate with embedded b...

Fan-out light-emitting diode (LED) device substrate with embedded b...

Method for prefixing of substrates

Electronic apparatus and manufacturing method thereof

Three dimensional integrated circuits stacking approach

Integrated fan-out device

Integrated circuit stacking approach

Fan-out package structure and method

Micro-LED array transfer method, manufacturing method and display d...

Method of forming semiconductor packages having through package vias

System and method for forming solder bumps

Testing of micro light emitting diodes (LEDs) using probe pads

Fan-out package structure and method

Method for prefixing of substrates

Chip package structure and manufacturing method thereof

Device for prefixing of substrates

Fin-FET devices and fabrication methods thereof

Fan-out package structure and method

Fan-out package structure and method

Three dimensional integrated circuits stacking approach

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT

ELECTRONIC-COMPONENT-MOUNTING-SUBSTRATE MANUFACTURING METHOD

MULTI-CHIP PACKAGING METHOD AND MULTI-CHIP PACKAGING STRUCTURE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated Circuit Packages and Methods of Forming the Same

Method of Forming Semiconductor Packages Having Through Package Vias

FAN-OUT LIGHT-EMITTING DIODE (LED) DEVICE SUBSTRATE WITH EMBEDDED B...

Method of Forming Semiconductor Packages Having Through Package Vias

FAN-OUT LIGHT-EMITTING DIODE (LED) DEVICE SUBSTRATE WITH EMBEDDED B...

METHOD FOR PREFIXING OF SUBSTRATES

METHOD FOR PREFIXING OF SUBSTRATES

Fan-Out Package Structure and Method

NOVEL INTEGRATED CIRCUIT STACKING APPROACH

Fan-Out Package Structure and Method

FIN-FET DEVICES AND FABRICATION METHODS THEREOF

FAN-OUT PACKAGE STRUCTURE AND METHOD

METHOD AND DEVICE FOR PREFIXING OF SUBSTRATES

NOVEL THREE DIMENSIONAL INTEGRATED CIRCUITS STACKING APPROACH

NOVEL THREE DIMENSIONAL INTEGRATED CIRCUITS STACKING APPROACH

Semiconductor device and method of manufacturing the same