with thermo electric cooling

Industry

CPC
G02B6/4271

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4271with thermo electric cooling

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Compact micro bench for optical transceiver sub-assembly
- Patent number 12,169,313
- Issue date Dec 17, 2024
- CLOUD LIGHT TECHNOLOGY LIMITED
- Wing Keung Mark Mak
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module
- Patent number 11,990,725
- Issue date May 21, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Dan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and optical signal transmitter
- Patent number 11,860,428
- Issue date Jan 2, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small form factor transmitting device
- Patent number 11,817,676
- Issue date Nov 14, 2023
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for device cooling in an optical sub-assembly
- Patent number 11,789,221
- Issue date Oct 17, 2023
- Aeva, Inc.
- Zhizhong Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical subassembly
- Patent number 11,740,419
- Issue date Aug 29, 2023
- CIG PHOTONICS JAPAN LIMITED
- Daisuke Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QSFP-DD (quad small form factor pluggable-double density) modules a...
- Patent number 11,573,384
- Issue date Feb 7, 2023
- Cisco Technology, Inc.
- Michael Tittenhofer
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 11,567,274
- Issue date Jan 31, 2023
- Molex, LLC
- Sung-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management system for multi-chip-module and associated methods
- Patent number 11,493,708
- Issue date Nov 8, 2022
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device mass transfer tool
- Patent number 11,480,742
- Issue date Oct 25, 2022
- Apple Inc.
- Patrick J. Czarnota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical transceiver module and optical cable module
- Patent number 11,474,314
- Issue date Oct 18, 2022
- USENLIGHT CORPORATION
- Chun-Yang Chang
- G02 - OPTICS
Information Patent Grant
Small form factor transmitting device
- Patent number 11,355,900
- Issue date Jun 7, 2022
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with transmit optical subassembly and receive optical subass...
- Patent number 11,262,498
- Issue date Mar 1, 2022
- Rockley Photonics Limited
- Gerald Cois Byrd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical transceiver module and optical cable module
- Patent number 11,105,990
- Issue date Aug 31, 2021
- USENLIGHT CORPORATION
- Chun-Yang Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
QSFP-DD (quad small form factor pluggable—double density) modules a...
- Patent number 11,036,017
- Issue date Jun 15, 2021
- Cisco Technology, Inc.
- Michael Tittenhofer
- G02 - OPTICS
Information Patent Grant
Frame lid for in-package optics
- Patent number 11,029,475
- Issue date Jun 8, 2021
- Cisco Technology, Inc.
- Vipulkumar K. Patel
- G02 - OPTICS
Information Patent Grant
Packaging of a directly modulated laser chip in photonics module
- Patent number 11,011,886
- Issue date May 18, 2021
- INPHI CORPORATION
- Frank Gelhausen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electro-optical hot-pluggable module with a dual-purpose heat trans...
- Patent number 10,983,293
- Issue date Apr 20, 2021
- Hewlett Packard Enterprise Development LP
- Kevin B. Leigh
- G02 - OPTICS
Information Patent Grant
Transmitter optical subassembly (TOSA) with laser diode driver (LDD...
- Patent number 10,948,671
- Issue date Mar 16, 2021
- Applied Optoelectronics, Inc.
- Kai-Sheng Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Light emitting module
- Patent number 10,928,597
- Issue date Feb 23, 2021
- Sumitomo Electric Device Innovations, Inc.
- Toshiaki Kihara
- G02 - OPTICS
Information Patent Grant
Transmitter optical subassembly (TOSA) with laser diode driver (LDD...
- Patent number 10,928,600
- Issue date Feb 23, 2021
- Applied Optoelectronics, Inc.
- Kevin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector system
- Patent number 10,910,766
- Issue date Feb 2, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Claudio D'Inca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small form factor transmitting device
- Patent number 10,892,598
- Issue date Jan 12, 2021
- INPHI CORPORATION
- Radhakrishnan L. Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management system for multi-chip-module and associated methods
- Patent number 10,775,576
- Issue date Sep 15, 2020
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with transmit and receive optical subassemblies with specifi...
- Patent number 10,761,262
- Issue date Sep 1, 2020
- Rockley Photonics Limited
- Gerald Cois Byrd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling and heating structure for fiber optic transceiver
- Patent number 10,746,948
- Issue date Aug 18, 2020
- MOXA Inc.
- Kuo-An Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly for connecting a plug to an electronic device housing pane...
- Patent number 10,739,540
- Issue date Aug 11, 2020
- Radiall S.A.
- M. Benoît Dupeux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an optical communication device
- Patent number 10,735,101
- Issue date Aug 4, 2020
- Cisco Technology, Inc.
- Stefan Pfnuer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure of horizontal optical-communication sub-...
- Patent number 10,656,355
- Issue date May 19, 2020
- LUXNET CORPORATION
- Pi-Cheng Law
- G02 - OPTICS
Information Patent Grant
Optical transceiver and method for estimating temperature of same
- Patent number 10,594,403
- Issue date Mar 17, 2020
- Sumitomo Electric Industries, Ltd.
- Daisuke Kawase
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MANAGING RELATIVE THERMAL DRIFT OF CARRIER-MOUNTED INTEGRATED CIRCUITS
- Publication number 20240353634
- Publication date Oct 24, 2024
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- G02 - OPTICS
Information Patent Application
THERMAL MANAGEMENT IN AN OPTICAL SUB-ASSEMBLY
- Publication number 20240288643
- Publication date Aug 29, 2024
- Lumentum Technology UK Limited
- Andrew STRANGE
- G02 - OPTICS
Information Patent Application
400G SILICON PHOTONIC INTEGRATED OPTICAL MODULE WITH EMBEDDED THERM...
- Publication number 20240280771
- Publication date Aug 22, 2024
- SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited
- Jie Huang
- G02 - OPTICS
Information Patent Application
Optical Module
- Publication number 20240275115
- Publication date Aug 15, 2024
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Dan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL T...
- Publication number 20240231023
- Publication date Jul 11, 2024
- Formerica Optoelectronics, Inc.
- Yun-Cheng HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RoF COMMUNICATION DEVICE WITH INTEGRATION OF RF CIRCUIT BOARD AND O...
- Publication number 20240201459
- Publication date Jun 20, 2024
- Global Technology Inc.
- Na ZHANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMPROVED PHOTONIC PACKAGING
- Publication number 20240184067
- Publication date Jun 6, 2024
- Sentea NV
- Ronny BOCKSTAELE
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL T...
- Publication number 20240134136
- Publication date Apr 25, 2024
- Formerica Optoelectronics, Inc.
- Yun-Cheng HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING AN ELECTRONIC PACKAGE
- Publication number 20240053552
- Publication date Feb 15, 2024
- Kabushiki Kaisha Toshiba
- Joanna Krystyna SKIBA-SZYMANSKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIDIRECTIONAL OPTICAL MODULE WITH SEPARATED SUBASSEMBLIES
- Publication number 20230418007
- Publication date Dec 28, 2023
- Global Technology Inc.
- Jian-Hong LUO
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402441
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER
- Publication number 20230400649
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermo-Electric Cooler for Dissipating Heat of Optical Engine
- Publication number 20230384543
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- G02 - OPTICS
Information Patent Application
OPTICAL RECEIVING ASSEMBLY, METHOD FOR CONTROLLING THE SAME, AND OP...
- Publication number 20230333332
- Publication date Oct 19, 2023
- InnoLight Technology (Suzhou) LTD.
- Wenkai TU
- G02 - OPTICS
Information Patent Application
TECHNIQUES FOR OPTICAL SUB-ASSEMBLY AND PACKAGING
- Publication number 20230305245
- Publication date Sep 28, 2023
- Aeva, Inc.
- Zhizhong TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20230244047
- Publication date Aug 3, 2023
- FURUKAWA ELECTRIC CO., LTD.
- Kazuya NAGASHIMA
- G02 - OPTICS
Information Patent Application
Compact Micro Bench for Optical Transceiver Sub-Assembly
- Publication number 20230236371
- Publication date Jul 27, 2023
- Cloud Light Technology Limited
- Wing Keung Mark Mak
- G02 - OPTICS
Information Patent Application
A Connector System
- Publication number 20230213714
- Publication date Jul 6, 2023
- Telefonaktiebolaget LM Ericsson (publ)
- Marco ASSALE
- G02 - OPTICS
Information Patent Application
OPEN CAVITY PHOTONIC INTEGRATED CIRCUIT AND METHOD
- Publication number 20230185034
- Publication date Jun 15, 2023
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
Thermal Management System for Multi-Chip-Module and Associated Methods
- Publication number 20230068239
- Publication date Mar 2, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURES FOR OPTICAL COMMUNICATION DEVICES
- Publication number 20220397726
- Publication date Dec 15, 2022
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
Information Patent Application
OPTICAL COMMUNICATION MODULE WITH HEAT-DISSIPATION STRUCTURE
- Publication number 20220317394
- Publication date Oct 6, 2022
- SHUNYUN TECHNOLOGY (ZHONG SHAN) LIMITED
- JIE HUANG
- G02 - OPTICS
Information Patent Application
SMALL FORM FACTOR TRANSMITTING DEVICE
- Publication number 20220285913
- Publication date Sep 8, 2022
- Marwell Asia Pte., Ltd.
- Radhakrishnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC COMPUTING PLATFORM
- Publication number 20220179159
- Publication date Jun 9, 2022
- Lightelligence, Inc.
- Jianhua Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL MODULE
- Publication number 20220050248
- Publication date Feb 17, 2022
- Molex, LLC
- Sung-Ping HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20220006253
- Publication date Jan 6, 2022
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Dan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION ASSEMBLY AND COMMUNICATION MODULE
- Publication number 20210341692
- Publication date Nov 4, 2021
- Chengdu Superxon Communication Technology Co., Ltd.
- Lang LIU
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSCEIVER MODULE AND OPTICAL CABLE MODULE
- Publication number 20210333496
- Publication date Oct 28, 2021
- uSenlight Corporation
- Chun-Yang CHANG
- G02 - OPTICS
Information Patent Application
QSFP-DD (QUAD SMALL FORM FACTOR PLUGGABLE - DOUBLE DENSITY) MODULES...
- Publication number 20210231891
- Publication date Jul 29, 2021
- Cisco Technology, Inc.
- Michael Tittenhofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SUBASSEMBLY
- Publication number 20210132305
- Publication date May 6, 2021
- CIG Photonics Japan Limited
- Daisuke NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS

with thermo electric cooling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Compact micro bench for optical transceiver sub-assembly

Optical module

Package structure and optical signal transmitter

Small form factor transmitting device

Techniques for device cooling in an optical sub-assembly

Optical subassembly

QSFP-DD (quad small form factor pluggable-double density) modules a...

Optical module

Thermal management system for multi-chip-module and associated methods

Micro device mass transfer tool

Optical transceiver module and optical cable module

Small form factor transmitting device

Module with transmit optical subassembly and receive optical subass...

Optical transceiver module and optical cable module

QSFP-DD (quad small form factor pluggable—double density) modules a...

Frame lid for in-package optics

Packaging of a directly modulated laser chip in photonics module

Electro-optical hot-pluggable module with a dual-purpose heat trans...

Transmitter optical subassembly (TOSA) with laser diode driver (LDD...

Light emitting module

Transmitter optical subassembly (TOSA) with laser diode driver (LDD...

Connector system

Small form factor transmitting device

Thermal management system for multi-chip-module and associated methods

Module with transmit and receive optical subassemblies with specifi...

Cooling and heating structure for fiber optic transceiver

Assembly for connecting a plug to an electronic device housing pane...

Method for manufacturing an optical communication device

Heat dissipation structure of horizontal optical-communication sub-...

Optical transceiver and method for estimating temperature of same

Patents Applicationslast 30 patents

MANAGING RELATIVE THERMAL DRIFT OF CARRIER-MOUNTED INTEGRATED CIRCUITS

THERMAL MANAGEMENT IN AN OPTICAL SUB-ASSEMBLY

400G SILICON PHOTONIC INTEGRATED OPTICAL MODULE WITH EMBEDDED THERM...

Optical Module

OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL T...

RoF COMMUNICATION DEVICE WITH INTEGRATION OF RF CIRCUIT BOARD AND O...

IMPROVED PHOTONIC PACKAGING

OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL T...

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING AN ELECTRONIC PACKAGE

BIDIRECTIONAL OPTICAL MODULE WITH SEPARATED SUBASSEMBLIES

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER

Thermo-Electric Cooler for Dissipating Heat of Optical Engine

OPTICAL RECEIVING ASSEMBLY, METHOD FOR CONTROLLING THE SAME, AND OP...

TECHNIQUES FOR OPTICAL SUB-ASSEMBLY AND PACKAGING

OPTICAL MODULE

Compact Micro Bench for Optical Transceiver Sub-Assembly

A Connector System

OPEN CAVITY PHOTONIC INTEGRATED CIRCUIT AND METHOD

Thermal Management System for Multi-Chip-Module and Associated Methods

HEAT DISSIPATION STRUCTURES FOR OPTICAL COMMUNICATION DEVICES

OPTICAL COMMUNICATION MODULE WITH HEAT-DISSIPATION STRUCTURE

SMALL FORM FACTOR TRANSMITTING DEVICE

PHOTONIC COMPUTING PLATFORM

OPTICAL MODULE

OPTICAL MODULE

HEAT DISSIPATION ASSEMBLY AND COMMUNICATION MODULE

OPTICAL TRANSCEIVER MODULE AND OPTICAL CABLE MODULE

QSFP-DD (QUAD SMALL FORM FACTOR PLUGGABLE - DOUBLE DENSITY) MODULES...

OPTICAL SUBASSEMBLY