with tubes having a capillary structure

Industry

CPC
F28D15/04

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

FMECHANICAL ENGINEERING LIGHTING HEATING WEAPONS BLASTING ENGINES OR PUMPS F28Heat exchange F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies

Current Industry

F28D15/04with tubes having a capillary structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Vapor-phase/liquid-phase fluid heat exchange unit
- Patent number 12,241,688
- Issue date Mar 4, 2025
- Asia Vital Components Co., Ltd.
- Chih-Peng Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Copper paste, wick formation method, and heat pipe
- Patent number 12,233,460
- Issue date Feb 25, 2025
- Resonac Corporation
- Hideo Nakako
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat-transfer member and cooling system
- Patent number 12,222,166
- Issue date Feb 11, 2025
- Kyushu University, National University Corporation
- Yasuyuki Takata
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat pipe for submerged combustion burner
- Patent number 12,215,861
- Issue date Feb 4, 2025
- Owens-Brockway Glass Container Inc.
- Liming Shi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Evaporation device for cooling
- Patent number 12,215,927
- Issue date Feb 4, 2025
- HYOSUNG HEAVY INDUSTRIES CORPORATION
- Chang Woo Han
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat exchanger for tempering of a fluid
- Patent number 12,209,812
- Issue date Jan 28, 2025
- Promix Solutions AG
- Rolf Heusser
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device
- Patent number 12,196,497
- Issue date Jan 14, 2025
- ABB Schweiz AG
- Daniele Torresin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Loop heat pipe
- Patent number 12,196,498
- Issue date Jan 14, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink with opposed elements providing temperature gradient
- Patent number 12,188,726
- Issue date Jan 7, 2025
- United Arab Emirates University
- Salah Addin Burhan Al Omari
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Single and multi-layer mesh structures for enhanced thermal transport
- Patent number 12,188,732
- Issue date Jan 7, 2025
- The Regents of the University of Colorado
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management device and system
- Patent number 12,188,692
- Issue date Jan 7, 2025
- BLUEXTHERMAL, INC.
- Reza Monazami
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,173,968
- Issue date Dec 24, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Separate capillary vapor chamber structure for dual heat sources
- Patent number 12,173,969
- Issue date Dec 24, 2024
- TAIWAN MICROLOOPS CORP.
- Chun-Hung Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Hybrid loop heat pipe with integrated magnetically levitating beari...
- Patent number 12,173,965
- Issue date Dec 24, 2024
- The Government of the United States of America, as represented by the Secreta...
- Gabriel Goodwin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat pipe with improved performance under diverse thermal load dist...
- Patent number 12,173,967
- Issue date Dec 24, 2024
- EURO HEAT PIPES
- Mikael Mohaupt
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber, electronic device, metallic sheet for vapor chamber...
- Patent number 12,167,571
- Issue date Dec 10, 2024
- Dai Nippon Printing Co., Ltd.
- Shinichiro Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for forming liquid filled heat transfer device
- Patent number 12,163,739
- Issue date Dec 10, 2024
- Aavid Thermalloy, LLC
- John R. Cennamo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device
- Patent number 12,158,308
- Issue date Dec 3, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Low-pressure heat pipes and heat transfer methods using low-pressur...
- Patent number 12,158,310
- Issue date Dec 3, 2024
- Honeywell International Inc.
- Tao Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat pipe with composite wick structure
- Patent number 12,158,309
- Issue date Dec 3, 2024
- VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
- Lei Lei Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid metal high-temperature oscillating heat pipe and testing method
- Patent number 12,153,005
- Issue date Nov 26, 2024
- DALIAN MARITIME UNIVERSITY
- Yulong Ji
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for using additive manufacturing for thermal ma...
- Patent number 12,150,279
- Issue date Nov 19, 2024
- General Electric Company
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High performance two-phase cooling apparatus for portable applications
- Patent number 12,140,385
- Issue date Nov 12, 2024
- PiMEMS, Inc.
- Payam Bozorgi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber
- Patent number 12,117,243
- Issue date Oct 15, 2024
- Furukawa Electric Co., Ltd.
- Yoshikatsu Inagaki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Coaxial phase change material heat sink for electric charging cable
- Patent number 12,119,146
- Issue date Oct 15, 2024
- The Board of Regents of the University of Oklahoma
- Hamidreza Shabgard
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,117,244
- Issue date Oct 15, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat transfer element, method for forming the same and semiconducto...
- Patent number 12,111,114
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Hung-Hsien Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat transfer component reinforcement structure
- Patent number 12,111,113
- Issue date Oct 8, 2024
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat pipe with in-plane heat spreader and loading mechanism
- Patent number 12,114,466
- Issue date Oct 8, 2024
- Intel Corporation
- Penchala Pratap Binni Boyina
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber
- Patent number 12,108,570
- Issue date Oct 1, 2024
- Furukawa Electric Co., Ltd.
- Yoshikatsu Inagaki
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
WICK AND HEAT TRANSPORT DEVICE
- Publication number 20250067521
- Publication date Feb 27, 2025
- Murata Manufacturing Co., Ltd.
- Hiroyuki MORITA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CAPILLARY STRUCTURE AND HEAT DISSIPATION DEVICE THEREOF
- Publication number 20250067520
- Publication date Feb 27, 2025
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- Zhiwei Li
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
UNIFORM TEMPERATURE PLATE AND ELECTRONIC EQUIPMENT EMPLOYING PLATE
- Publication number 20250071944
- Publication date Feb 27, 2025
- CHAMP TECH OPTICAL (FOSHAN) CORPORATION
- MING-YU XIAO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THREE-DIMENSIONAL HEAT TRANSFER DEVICE
- Publication number 20250067519
- Publication date Feb 27, 2025
- PURPLE CLOUD DEVELOPMENT PTE. LTD.
- Venkata Raman SAHOO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER, ELECTRONIC DEVICE, METALLIC SHEET FOR VAPOR CHAMBER...
- Publication number 20250071941
- Publication date Feb 27, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinichiro TAKAHASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEAT PIPE
- Publication number 20250052513
- Publication date Feb 13, 2025
- VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
- Lei Lei LIU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MULTI-SECTIONAL VAPOR CHAMBERS
- Publication number 20250052512
- Publication date Feb 13, 2025
- Intel Corporation
- Shantanu Kulkarni
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
TEMPERATURE CONTROL APPARATUS WITH HEAT EXCHANGING UNIT DIVIDED INT...
- Publication number 20250052515
- Publication date Feb 13, 2025
- Delta Electronics, Inc.
- Hsueh-Chi PAN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT PIPE
- Publication number 20250052514
- Publication date Feb 13, 2025
- VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
- Lei Lei LIU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...
- Publication number 20250048594
- Publication date Feb 6, 2025
- GENERAL ELECTRIC COMPANY
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER SUPPORTING CAPILLARY STRUCTURE
- Publication number 20250044038
- Publication date Feb 6, 2025
- Nidec Chaun-Choung Technology Corporation
- Abbas ALI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CONNECTOR APPARATUS FOR ELECTRIC CHARGING CABLE
- Publication number 20250037904
- Publication date Jan 30, 2025
- THE BOARD OF REGENTS OF THE UNIVERSITY OF OKLAHOMA
- Hamidreza Shabgard
- B60 - VEHICLES IN GENERAL
Information Patent Application
LOOP TYPE HEAT DISSIPATION STRUCTURE
- Publication number 20250027726
- Publication date Jan 23, 2025
- ASUSTek COMPUTER INC.
- Ing-Jer Chiou
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEATPIPE WITH GRADUATED CONDENSER PORTION AND CONSTANT RATIO BETWEE...
- Publication number 20250012514
- Publication date Jan 9, 2025
- Dell Products L.P.
- QINGHONG HE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID COOLING VAPOR CHAMBER HEAT DISSIPATION MODULE
- Publication number 20250003696
- Publication date Jan 2, 2025
- TOP RANK TECHNOLOGY LIMITED
- TIEN-LAI WANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250003693
- Publication date Jan 2, 2025
- Cooler Master Co., Ltd.
- Chi-Lung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKI...
- Publication number 20250003694
- Publication date Jan 2, 2025
- NVIDIA Corporation
- Ron CHAO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VARIABLE HEAT PIPE THICKNESS AND DIAMETER FOR DIRECT HEAT PIPE ATTA...
- Publication number 20250003695
- Publication date Jan 2, 2025
- Intel Corporation
- Juha Paavola
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DYNAMICALLY ENHANCING HEAT TRANSFER THROUGH HEAT PIPES
- Publication number 20240426558
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Kevin O'Connell
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SPREADER WITH VAPOR CHAMBERS AND MANUFACTURING METHOD THEREOF
- Publication number 20240418451
- Publication date Dec 19, 2024
- Raytech Precision Technologies (Shuyang) Co., Ltd.
- Shengliang Dai
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat Pipe for Preventing Icing Expansion
- Publication number 20240410658
- Publication date Dec 12, 2024
- Huawei Technologies Co., Ltd
- Xing Fu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT TRANSPORT DEVICE
- Publication number 20240410657
- Publication date Dec 12, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Yosuke WATANABE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER
- Publication number 20240401885
- Publication date Dec 5, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Takahiro BANZAI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MESH WOVEN STRUCTURE WITH CAPILLARY ACTION
- Publication number 20240393057
- Publication date Nov 28, 2024
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- Rong-Yuan Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CAPILLARY WOVEN MESH STRUCTURE
- Publication number 20240393060
- Publication date Nov 28, 2024
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- Hsiu-Wei Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CAPILLARY MESH WOVEN STRUCTURE
- Publication number 20240393058
- Publication date Nov 28, 2024
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- Rong-Yuan Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MESH CAPILLARY WOVEN STRUCTURE
- Publication number 20240393059
- Publication date Nov 28, 2024
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- Rong-Yuan Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL MANAGEMENT PLANES
- Publication number 20240369306
- Publication date Nov 7, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
GLASS FIBER HEAT PIPES AND WICKS FOR HEAT PIPES
- Publication number 20240361085
- Publication date Oct 31, 2024
- Meta Platforms Technologies, LLC
- Brian Toleno
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER
- Publication number 20240361082
- Publication date Oct 31, 2024
- VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
- Lei Lei LIU
- F28 - HEAT EXCHANGE IN GENERAL

with tubes having a capillary structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Vapor-phase/liquid-phase fluid heat exchange unit

Copper paste, wick formation method, and heat pipe

Heat-transfer member and cooling system

Heat pipe for submerged combustion burner

Evaporation device for cooling

Heat exchanger for tempering of a fluid

Heat dissipation device

Loop heat pipe

Heat sink with opposed elements providing temperature gradient

Single and multi-layer mesh structures for enhanced thermal transport

Thermal management device and system

Vapor chamber and manufacturing method of the same

Separate capillary vapor chamber structure for dual heat sources

Hybrid loop heat pipe with integrated magnetically levitating beari...

Heat pipe with improved performance under diverse thermal load dist...

Vapor chamber, electronic device, metallic sheet for vapor chamber...

Method and apparatus for forming liquid filled heat transfer device

Heat dissipation device

Low-pressure heat pipes and heat transfer methods using low-pressur...

Heat pipe with composite wick structure

Liquid metal high-temperature oscillating heat pipe and testing method

Systems and methods for using additive manufacturing for thermal ma...

High performance two-phase cooling apparatus for portable applications

Vapor chamber

Coaxial phase change material heat sink for electric charging cable

Vapor chamber and manufacturing method of the same

Heat transfer element, method for forming the same and semiconducto...

Heat transfer component reinforcement structure

Heat pipe with in-plane heat spreader and loading mechanism

Vapor chamber

Patents Applicationslast 30 patents

WICK AND HEAT TRANSPORT DEVICE

CAPILLARY STRUCTURE AND HEAT DISSIPATION DEVICE THEREOF

UNIFORM TEMPERATURE PLATE AND ELECTRONIC EQUIPMENT EMPLOYING PLATE

THREE-DIMENSIONAL HEAT TRANSFER DEVICE

VAPOR CHAMBER, ELECTRONIC DEVICE, METALLIC SHEET FOR VAPOR CHAMBER...

HEAT PIPE

MULTI-SECTIONAL VAPOR CHAMBERS

TEMPERATURE CONTROL APPARATUS WITH HEAT EXCHANGING UNIT DIVIDED INT...

HEAT PIPE

SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...

VAPOR CHAMBER SUPPORTING CAPILLARY STRUCTURE

CONNECTOR APPARATUS FOR ELECTRIC CHARGING CABLE

LOOP TYPE HEAT DISSIPATION STRUCTURE

HEATPIPE WITH GRADUATED CONDENSER PORTION AND CONSTANT RATIO BETWEE...

LIQUID COOLING VAPOR CHAMBER HEAT DISSIPATION MODULE

VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME

WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKI...

VARIABLE HEAT PIPE THICKNESS AND DIAMETER FOR DIRECT HEAT PIPE ATTA...

DYNAMICALLY ENHANCING HEAT TRANSFER THROUGH HEAT PIPES

HEAT SPREADER WITH VAPOR CHAMBERS AND MANUFACTURING METHOD THEREOF

Heat Pipe for Preventing Icing Expansion

HEAT TRANSPORT DEVICE

VAPOR CHAMBER

MESH WOVEN STRUCTURE WITH CAPILLARY ACTION

CAPILLARY WOVEN MESH STRUCTURE

CAPILLARY MESH WOVEN STRUCTURE

MESH CAPILLARY WOVEN STRUCTURE

THERMAL MANAGEMENT PLANES

GLASS FIBER HEAT PIPES AND WICKS FOR HEAT PIPES

VAPOR CHAMBER