within server blades for removing heat from heat source

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CPC
H05K7/20809

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20809within server blades for removing heat from heat source

Industries

Patents Grantslast 30 patents

Information Patent Grant
Immersed cabinet and heat dissipation system thereof
- Patent number 12,150,276
- Issue date Nov 19, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- PengFei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data center rack system with integrated liquid and dielectric immer...
- Patent number 12,144,145
- Issue date Nov 12, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Pressure based phase immersion cooling system
- Patent number 12,144,148
- Issue date Nov 12, 2024
- Microsoft Technology Licensing, LLC
- Vaidehi Oruganti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Managing computational bursting on server nodes
- Patent number 12,135,998
- Issue date Nov 5, 2024
- Microsoft Technology Licensing, LLC
- Ioannis Manousakis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-availability liquid cooling system for chip and server
- Patent number 12,114,468
- Issue date Oct 8, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server and cooling system for enhanced immersion cooling
- Patent number 12,089,366
- Issue date Sep 10, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooling plate for CPU
- Patent number 12,089,367
- Issue date Sep 10, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiangjun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor chamber, heat sink, and terminal
- Patent number 12,082,381
- Issue date Sep 3, 2024
- Huawei Technologies Co., Ltd.
- Denis Yurchenko
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Distribution hardware for two phase system recirculation
- Patent number 12,048,127
- Issue date Jul 23, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip to server packaging design for immersion systems
- Patent number 12,010,815
- Issue date Jun 11, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for immersion-cooled datacenters
- Patent number 12,004,328
- Issue date Jun 4, 2024
- Microsoft Technology Licensing, LLC
- Eric C. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for cooling server boards in a data center
- Patent number 11,997,832
- Issue date May 28, 2024
- CALYOS SA
- Vincent Dupont
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system
- Patent number 11,997,835
- Issue date May 28, 2024
- BEIJING TUSEN ZHITU TECHNOLOGY CO., LTD.
- Zhihua Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for multiphase thermal management
- Patent number 11,985,800
- Issue date May 14, 2024
- Microsoft Tech nology Licensing, LLC
- Luke Thomas Gregory
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leak protection for cold plate liquid cooling
- Patent number 11,963,340
- Issue date Apr 16, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system providing cooling to an infrastructure having a plur...
- Patent number 11,937,406
- Issue date Mar 19, 2024
- OVH
- Ali Chehade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power density chips based two-phase loop recirculation
- Patent number 11,925,001
- Issue date Mar 5, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for modular liquid spray cooling of electronic devices
- Patent number 11,903,171
- Issue date Feb 13, 2024
- Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure relief valve and adsorbent chamber for two-phase immersion...
- Patent number 11,894,288
- Issue date Feb 6, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling system of electronic systems, in particular for data centre
- Patent number 11,871,546
- Issue date Jan 9, 2024
- WIELAND PROVIDES SRL
- Franco Provenziani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer cooling
- Patent number 11,812,587
- Issue date Nov 7, 2023
- Microsoft Technology Licensing, LLC
- Douglas Patrick Kelley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and devices for testing immersion cooling controllers
- Patent number 11,785,747
- Issue date Oct 10, 2023
- TMGCore. INC.
- Randall Coburn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fluid cooling system
- Patent number 11,778,790
- Issue date Oct 3, 2023
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooling system
- Patent number 11,737,247
- Issue date Aug 22, 2023
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disaggregated system architecture for immersion cooling
- Patent number 11,729,949
- Issue date Aug 15, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated immersion system for servers
- Patent number 11,700,714
- Issue date Jul 11, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redundant module and systems for high density servers
- Patent number 11,700,709
- Issue date Jul 11, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and heat dissipation assembly
- Patent number 11,683,914
- Issue date Jun 20, 2023
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Kai-Yang Tung
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling system
- Patent number 11,632,880
- Issue date Apr 18, 2023
- BEIJING TUSEN ZHITU TECHNOLOGY CO., LTD.
- Zhihua Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple phase multiple system architecture
- Patent number 11,627,687
- Issue date Apr 11, 2023
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240389277
- Publication date Nov 21, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Danny J. Lohan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING DEVICE
- Publication number 20240381587
- Publication date Nov 14, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- TSUNG-LIN LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION LIQUID COOLING DEVICE
- Publication number 20240334649
- Publication date Oct 3, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS
- Publication number 20240284641
- Publication date Aug 22, 2024
- Microsoft Technology Licensing, LLC
- Eric C. PETERSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SHORT...
- Publication number 20240276676
- Publication date Aug 15, 2024
- Amulaire thermal technology, INC.
- CHING-MING YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OU...
- Publication number 20240244800
- Publication date Jul 18, 2024
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANGLED AND STEPPED FACEPLATE FOR TELECOMMUNICATIONS AND NETWORKING...
- Publication number 20240179877
- Publication date May 30, 2024
- CIENA CORPORATION
- Daniel Rivaud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System for the Reuse of Heat in a Data Center
- Publication number 20240164065
- Publication date May 16, 2024
- Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER HEAT DISSIPATION SYSTEM BASED ON GRAVITY HEAT PIPE
- Publication number 20240130090
- Publication date Apr 18, 2024
- Shanghai Neogenint Technology Co., Ltd
- Lei NIE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
IMMERSED CABINET AND HEAT DISSIPATION SYSTEM THEREOF
- Publication number 20240107709
- Publication date Mar 28, 2024
- Luxshare Thermal Technologies (HuiZhou) Co., Ltd
- PengFei WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SERVER SYSTEM WITH AI ACCELERATOR APPARATUSES USI...
- Publication number 20240090181
- Publication date Mar 14, 2024
- d-MATRIX CORPORATION
- Jayaprakash BALACHANDRAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETIC SEALED ELECTRONIC ASSEMBLY FOR NON DIELECTRIC IMMERSION CO...
- Publication number 20240074108
- Publication date Feb 29, 2024
- OVH
- Ali CHEHADE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM
- Publication number 20240057296
- Publication date Feb 15, 2024
- Microsoft Technology Licensing, LLC
- Brandon Earl GARY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION LIQUID COOLING EQUIPMENT AND HEAT DISSIPATION METHOD FOR...
- Publication number 20240057291
- Publication date Feb 15, 2024
- Wiwynn Corporation
- Tai-Ying Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM WITH MULTIPLE COOLING LIQUIDS
- Publication number 20240032248
- Publication date Jan 25, 2024
- Intel Corporation
- Sandeep AHUJA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM
- Publication number 20240015929
- Publication date Jan 11, 2024
- Wiwynn Corporation
- Tai-Ying TU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pressure Based Phase Immersion Cooling System
- Publication number 20230403821
- Publication date Dec 14, 2023
- Microsoft Technology Licensing, LLC
- Vaidehi ORUGANTI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER AND COOLING SYSTEM FOR ENHANCED IMMERSION COOLING
- Publication number 20230389230
- Publication date Nov 30, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR, TWO-PHASE COOLING SYSTEMS
- Publication number 20230328927
- Publication date Oct 12, 2023
- COOLIT SYSTEMS, INC.
- Mohammad Reza Najjari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-AVAILABILITY LIQUID COOLING SYSTEM FOR CHIP AND SERVER
- Publication number 20230309270
- Publication date Sep 28, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP TO SERVER PACKAGING DESIGN FOR IMMERSION SYSTEMS
- Publication number 20230301020
- Publication date Sep 21, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR MULTIPHASE THERMAL MANAGEMENT
- Publication number 20230301036
- Publication date Sep 21, 2023
- Microsoft Technology Licensing, LLC
- Luke Thomas GREGORY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID-COOLING PLATE FOR CPU
- Publication number 20230292461
- Publication date Sep 14, 2023
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiangjun WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS OF IMPROVING THERMAL MANAGEMENT OF HEAT-GENERAT...
- Publication number 20230254997
- Publication date Aug 10, 2023
- Microsoft Technology Licensing, LLC
- Mark Edward SHAW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM
- Publication number 20230247805
- Publication date Aug 3, 2023
- BEIJING TUSEN ZHITU TECHNOLOGY CO., LTD.
- Zhihua MA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND DEVICES FOR TESTING IMMERSION COOLING CONTROLLERS
- Publication number 20230240050
- Publication date Jul 27, 2023
- TMGCore, Inc.
- Randall Coburn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL-STACKED MOTHERBOARDS FOR FLUID IMMERSION COOLING
- Publication number 20230232582
- Publication date Jul 20, 2023
- SUPER MICRO COMPUTER, INC.
- Yueh Ming LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR CENTRALIZED AND SCALABLE VAPOR MANAGEMENT S...
- Publication number 20230232584
- Publication date Jul 20, 2023
- Microsoft Technology Licensing, LLC
- Ioannis MANOUSAKIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEM FOR TWO-PHASE SERVER COOLING WITH SERIAL CONDE...
- Publication number 20230217630
- Publication date Jul 6, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED IMMERSION SYSTEM FOR SERVERS
- Publication number 20230068585
- Publication date Mar 2, 2023
- BAIDU USA LLC
- Tianyi GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

within server blades for removing heat from heat source

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Immersed cabinet and heat dissipation system thereof

Data center rack system with integrated liquid and dielectric immer...

Pressure based phase immersion cooling system

Managing computational bursting on server nodes

High-availability liquid cooling system for chip and server

Server and cooling system for enhanced immersion cooling

Liquid-cooling plate for CPU

Vapor chamber, heat sink, and terminal

Distribution hardware for two phase system recirculation

Chip to server packaging design for immersion systems

Systems and methods for immersion-cooled datacenters

System for cooling server boards in a data center

Cooling system

Systems and methods for multiphase thermal management

Leak protection for cold plate liquid cooling

Cooling system providing cooling to an infrastructure having a plur...

High power density chips based two-phase loop recirculation

System for modular liquid spray cooling of electronic devices

Pressure relief valve and adsorbent chamber for two-phase immersion...

Cooling system of electronic systems, in particular for data centre

Computer cooling

Methods and devices for testing immersion cooling controllers

Fluid cooling system

Fluid cooling system

Disaggregated system architecture for immersion cooling

Integrated immersion system for servers

Redundant module and systems for high density servers

Electronic device and heat dissipation assembly

Cooling system

Multiple phase multiple system architecture

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES

IMMERSION COOLING DEVICE

IMMERSION LIQUID COOLING DEVICE

SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS

TWO-PHASE IMMERSION-COOLING HEAT-DISSIPATION STRUCTURE HAVING SHORT...

HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OU...

ANGLED AND STEPPED FACEPLATE FOR TELECOMMUNICATIONS AND NETWORKING...

System for the Reuse of Heat in a Data Center

SERVER HEAT DISSIPATION SYSTEM BASED ON GRAVITY HEAT PIPE

IMMERSED CABINET AND HEAT DISSIPATION SYSTEM THEREOF

IMMERSION COOLING SERVER SYSTEM WITH AI ACCELERATOR APPARATUSES USI...

HERMETIC SEALED ELECTRONIC ASSEMBLY FOR NON DIELECTRIC IMMERSION CO...

DEVICES, SYSTEMS, AND METHODS FOR A HYBRID COOLING SYSTEM

IMMERSION LIQUID COOLING EQUIPMENT AND HEAT DISSIPATION METHOD FOR...

IMMERSION COOLING SYSTEM WITH MULTIPLE COOLING LIQUIDS

IMMERSION COOLING SYSTEM

Pressure Based Phase Immersion Cooling System

SERVER AND COOLING SYSTEM FOR ENHANCED IMMERSION COOLING

MODULAR, TWO-PHASE COOLING SYSTEMS

HIGH-AVAILABILITY LIQUID COOLING SYSTEM FOR CHIP AND SERVER

CHIP TO SERVER PACKAGING DESIGN FOR IMMERSION SYSTEMS

SYSTEMS AND METHODS FOR MULTIPHASE THERMAL MANAGEMENT

LIQUID-COOLING PLATE FOR CPU

SYSTEMS AND METHODS OF IMPROVING THERMAL MANAGEMENT OF HEAT-GENERAT...

COOLING SYSTEM

METHODS AND DEVICES FOR TESTING IMMERSION COOLING CONTROLLERS

DUAL-STACKED MOTHERBOARDS FOR FLUID IMMERSION COOLING

SYSTEMS AND METHODS FOR CENTRALIZED AND SCALABLE VAPOR MANAGEMENT S...

APPARATUS AND SYSTEM FOR TWO-PHASE SERVER COOLING WITH SERIAL CONDE...

INTEGRATED IMMERSION SYSTEM FOR SERVERS