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H01J37/32715

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HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32715Workpiece holder

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plasma treatment apparatus, a method of monitoring a process of man...
- Patent number 12,170,233
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Meehyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating apparatus and coating method
- Patent number 12,170,189
- Issue date Dec 17, 2024
- Jiangsu Favored Nanotechnology Co., LTD
- Jian Zong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ceramic sintered body and member for plasma processing apparatus
- Patent number 12,165,853
- Issue date Dec 10, 2024
- Kyocera Corporation
- Manpei Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support and substrate processing apparatus
- Patent number 12,165,854
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Nobutaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for advanced ion control for etching processes
- Patent number 12,165,872
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder
- Patent number 12,162,110
- Issue date Dec 10, 2024
- Kyocera Corporation
- Hiromasa Takemori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate support and substrate processing apparatus
- Patent number 12,165,896
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Akira Nagayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and transfer method
- Patent number 12,165,893
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screwless semiconductor processing chambers
- Patent number 12,165,909
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Ru Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer adaptor for adapting different sized wafers
- Patent number 12,165,921
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Enrique Sarile
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching device and method of manufacturing display device using the...
- Patent number 12,161,041
- Issue date Dec 3, 2024
- Samsung Display Co., Ltd.
- Dae Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface processing equipment and surface processing method
- Patent number 12,154,768
- Issue date Nov 26, 2024
- Industrial Technology Research Institute
- Chih-Chieh Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Long-life extended temperature range embedded diode design for elec...
- Patent number 12,154,814
- Issue date Nov 26, 2024
- Lam Research Corporation
- Siyuan Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,154,767
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Naoki Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method for releasing sample
- Patent number 12,148,633
- Issue date Nov 19, 2024
- HITACHI HIGH-TECH CORPORATION
- Masaki Ishiguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating substrate and apparatus for treating substrate
- Patent number 12,142,492
- Issue date Nov 12, 2024
- Semes Co., Ltd.
- Ji-Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for substrate transport in vacuum processing systems
- Patent number 12,142,463
- Issue date Nov 12, 2024
- VON ARDENNE Asset GmbH & Co. KG
- Falk Milde
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing chambers configured for tunable substrate and edg...
- Patent number 12,142,469
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with seal surface
- Patent number 12,142,509
- Issue date Nov 12, 2024
- Lam Research Corporation
- Patrick G. Breiling
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck with multiple radio frequency meshes to control...
- Patent number 12,136,536
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Edward P. Hammond
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for conditioning semiconductor processing chamber components
- Patent number 12,129,569
- Issue date Oct 29, 2024
- Lam Research Corporation
- Lin Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plasma processing system and method using radio frequency and micro...
- Patent number 12,131,887
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Yunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface charge and power feedback and control using a switch mode b...
- Patent number 12,125,674
- Issue date Oct 22, 2024
- Advanced Energy Industries, Inc.
- Daniel Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
L-motion slit door for substrate processing chamber
- Patent number 12,125,688
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Hamid Noorbakhsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve wafer edge uniformity
- Patent number 12,125,683
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Mingle Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System of semiconductor process and control method thereof
- Patent number 12,125,687
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Youngdo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic processing chamber baffle
- Patent number 12,119,209
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Udit S. Kotagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method
- Patent number 12,112,927
- Issue date Oct 8, 2024
- Picosun Oy
- Väinö Kilpi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
PECVD apparatus
- Patent number 12,112,928
- Issue date Oct 8, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Rotating substrate support
- Patent number 12,106,944
- Issue date Oct 1, 2024
- ASM IP Holding B.V.
- Yukihiro Mori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ROTATING SUBSTRATE SUPPORT
- Publication number 20240420931
- Publication date Dec 19, 2024
- ASM IP HOLDING B.V.
- Yukihiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING METHOD
- Publication number 20240420914
- Publication date Dec 19, 2024
- Jiangsu Favored Nanotechnology Co., Ltd.
- Jian ZONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20240420930
- Publication date Dec 19, 2024
- Pusan National University Industry-University Cooperation Foundation
- Changho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC SUBSTRATE SUPPORT
- Publication number 20240420984
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Andrew Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ME...
- Publication number 20240420935
- Publication date Dec 19, 2024
- Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Tsunahiko NAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE
- Publication number 20240412951
- Publication date Dec 12, 2024
- SEMES CO., LTD.
- DONG-HUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS
- Publication number 20240404795
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Hitoshi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING DEVICE
- Publication number 20240404796
- Publication date Dec 5, 2024
- Niterra Co., Ltd.
- Yasuaki KIMIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD
- Publication number 20240404860
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Fu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE, METHOD OF MANUFACTURING THE SAME, ELECTROSTATIC...
- Publication number 20240404862
- Publication date Dec 5, 2024
- Shinko Electric Industries Co., Ltd.
- Ryosuke Hori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELEC...
- Publication number 20240400825
- Publication date Dec 5, 2024
- TORAY INDUSTRIES, INC.
- Akira Shimada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF SURFACE TREATMENT
- Publication number 20240392426
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Younseon WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD
- Publication number 20240395508
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20240395512
- Publication date Nov 28, 2024
- Disco Corporation
- Kazuma SEKIYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Bonding Apparatus and Method
- Publication number 20240387451
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER
- Publication number 20240387146
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING SYSTEM HAVING FOCUS RING WITH PROLONGED LIFETIME
- Publication number 20240387150
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH APPARATUS FOR COMPENSATING SHIFTED OVERLAYERS
- Publication number 20240387149
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DEVICE AND OPERATION METHOD THEREFOR
- Publication number 20240387153
- Publication date Nov 21, 2024
- INNOVATION FOR CREATIVE DEVICES CO., LTD.
- Pyung-Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SIMULTANEOUS SILICIDATION ON SOURCE AND DRAIN OF NMOS AND...
- Publication number 20240387290
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Xuebin LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VOLTAGE CONTROL FOR ETCHING SYSTEMS
- Publication number 20240387139
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chansyun David YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Semiconductor Structure
- Publication number 20240379354
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- David Eitan Barlaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS
- Publication number 20240379328
- Publication date Nov 14, 2024
- Timothy M. Ziemba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20240379332
- Publication date Nov 14, 2024
- PSK INC.
- Kwang-Sung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition Systems with Rotating Electrostatic Chuck and Methods Th...
- Publication number 20240376602
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- Melvin Verbaas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
JOINING TECHNIQUES FOR COMPOSITE CERAMIC BODIES
- Publication number 20240379316
- Publication date Nov 14, 2024
- LAM RESEARCH CORPORATION
- Karl Frederick LEESER
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
FOCUS RING AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING THE SAME
- Publication number 20240371610
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Hyungsik KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-THROUGHPUT PLASMA LID FOR SEMICONDUCTOR MANUFACTURING PROCESSI...
- Publication number 20240371613
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Muhannad Mustafa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CLOCKABLE SUBSTRATE PROCESSING PEDESTAL FOR USE IN SEMICONDUCTOR FA...
- Publication number 20240371679
- Publication date Nov 7, 2024
- LAM RESEARCH CORPORATION
- Sky MULLENAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SEAL METHOD AND APPARATUS
- Publication number 20240371607
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS

Workpiece holder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma treatment apparatus, a method of monitoring a process of man...

Coating apparatus and coating method

Ceramic sintered body and member for plasma processing apparatus

Substrate support and substrate processing apparatus

Methods and systems for advanced ion control for etching processes

Sample holder

Substrate support and substrate processing apparatus

Substrate processing system and transfer method

Screwless semiconductor processing chambers

Wafer adaptor for adapting different sized wafers

Etching device and method of manufacturing display device using the...

Surface processing equipment and surface processing method

Long-life extended temperature range embedded diode design for elec...

Substrate processing apparatus and substrate processing method

Plasma processing apparatus and method for releasing sample

Method for treating substrate and apparatus for treating substrate

Device and method for substrate transport in vacuum processing systems

Plasma processing chambers configured for tunable substrate and edg...

Electrostatic chuck with seal surface

Electrostatic chuck with multiple radio frequency meshes to control...

Method for conditioning semiconductor processing chamber components

Plasma processing system and method using radio frequency and micro...

Surface charge and power feedback and control using a switch mode b...

L-motion slit door for substrate processing chamber

Method to improve wafer edge uniformity

System of semiconductor process and control method thereof

Dynamic processing chamber baffle

Substrate processing apparatus and method

PECVD apparatus

Rotating substrate support

Patents Applicationslast 30 patents

ROTATING SUBSTRATE SUPPORT

COATING METHOD

SUBSTRATE PROCESSING APPARATUS

ELECTROSTATIC SUBSTRATE SUPPORT

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ME...

APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE

SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS

HOLDING DEVICE

PLASMA PROCESSING APPARATUS AND METHOD

CERAMIC SUBSTRATE, METHOD OF MANUFACTURING THE SAME, ELECTROSTATIC...

RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELEC...

METHOD OF SURFACE TREATMENT

PLASMA PROCESSING APPARATUS AND METHOD

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

Wafer Bonding Apparatus and Method

WAFER TREATMENT SYSTEM AND METHOD OF TREATING WAFER

PLASMA ETCHING SYSTEM HAVING FOCUS RING WITH PROLONGED LIFETIME

ETCH APPARATUS FOR COMPENSATING SHIFTED OVERLAYERS

ELECTROSTATIC DEVICE AND OPERATION METHOD THEREFOR

METHOD OF SIMULTANEOUS SILICIDATION ON SOURCE AND DRAIN OF NMOS AND...

VOLTAGE CONTROL FOR ETCHING SYSTEMS

System and Method for Semiconductor Structure

PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS

APPARATUS FOR PROCESSING SUBSTRATE

Deposition Systems with Rotating Electrostatic Chuck and Methods Th...

JOINING TECHNIQUES FOR COMPOSITE CERAMIC BODIES

FOCUS RING AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING THE SAME

HIGH-THROUGHPUT PLASMA LID FOR SEMICONDUCTOR MANUFACTURING PROCESSI...

CLOCKABLE SUBSTRATE PROCESSING PEDESTAL FOR USE IN SEMICONDUCTOR FA...

PRESSURE SEAL METHOD AND APPARATUS