TREA

Zinc selenide [ZnSe]

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Industry

  • CPC
  • H01L2924/10375
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10375Zinc selenide [ZnSe]
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Method for applying a bonding layer
    • Patent number 10,438,925
    • Issue date Oct 8, 2019
    • EV Group E. Thallner GmbH
    • Markus Wimplinger
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Method for applying a bonding layer
    • Patent number 9,627,349
    • Issue date Apr 18, 2017
    • EV Group E. Thallner GmbH
    • Markus Wimplinger
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents