Zinc (Zn) as principal constituent

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H01L2224/45118

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45118Zinc (Zn) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring method and device
- Patent number 8,439,251
- Issue date May 14, 2013
- Google Inc.
- Giovanni Delrosso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring method and device
- Patent number 8,096,463
- Issue date Jan 17, 2012
- MOSAID Technologies Incorporated
- Giovanni Delrosso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component unit
- Patent number 7,683,482
- Issue date Mar 23, 2010
- Panasonic Corporation
- Kazuto Nishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating board on chip (BOC) semiconductor package wi...
- Patent number 7,537,966
- Issue date May 26, 2009
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package with circuit side poly...
- Patent number 7,479,413
- Issue date Jan 20, 2009
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with circuit side polymer layer and wafer lev...
- Patent number 6,995,041
- Issue date Feb 7, 2006
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package with circuit side polymer layer
- Patent number 6,949,834
- Issue date Sep 27, 2005
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,903,440
- Issue date Jun 7, 2005
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with circuit side polymer layer and wafer lev...
- Patent number 6,791,168
- Issue date Sep 14, 2004
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,635,961
- Issue date Oct 21, 2003
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite lightweight copper plated aluminum wire
- Patent number 6,178,623
- Issue date Jan 30, 2001
- Totoku Electric Co., Ltd.
- hiroshi Kitazawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3474307
- Patent number 3,474,307
- Issue date Oct 21, 1969
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230148306
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Motoki ETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230018430
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20200312808
- Publication date Oct 1, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180133843
- Publication date May 17, 2018
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170216974
- Publication date Aug 3, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING METHOD AND DEVICE
- Publication number 20120118938
- Publication date May 17, 2012
- MOSAID TECHNOLOGIES INCORPORATED
- Giovanni DELROSSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring Method and Device
- Publication number 20080302858
- Publication date Dec 11, 2008
- Giovanni Delrosso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component mounting method and apparatus
- Publication number 20070013067
- Publication date Jan 18, 2007
- Kazuto Nishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating board on chip (BOC) semiconductor package wi...
- Publication number 20060292752
- Publication date Dec 28, 2006
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor package with circuit side poly...
- Publication number 20060030081
- Publication date Feb 9, 2006
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20040188833
- Publication date Sep 30, 2004
- Shigeyoshi Yoshida
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Stacked semiconductor package with circuit side polymer layer
- Publication number 20040171191
- Publication date Sep 2, 2004
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with circuit side polymer layer and wafer lev...
- Publication number 20040009631
- Publication date Jan 15, 2004
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20010026016
- Publication date Oct 4, 2001
- Shigeyoshi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Zinc (Zn) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Chip package and a method for manufacturing a chip package

Wiring method and device

Wiring method and device

Electronic component unit

Method for fabricating board on chip (BOC) semiconductor package wi...

Method for fabricating semiconductor package with circuit side poly...

Semiconductor package with circuit side polymer layer and wafer lev...

Stacked semiconductor package with circuit side polymer layer

Electronic component of a high frequency current suppression type a...

Semiconductor package with circuit side polymer layer and wafer lev...

Electronic component of a high frequency current suppression type a...

Composite lightweight copper plated aluminum wire

3474307

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

WIRING METHOD AND DEVICE

Wiring Method and Device

Electronic component mounting method and apparatus

Method for fabricating board on chip (BOC) semiconductor package wi...

Method for fabricating semiconductor package with circuit side poly...

Electronic component of a high frequency current suppression type a...

Stacked semiconductor package with circuit side polymer layer

Semiconductor package with circuit side polymer layer and wafer lev...

Electronic component of a high frequency current suppression type a...