Zinc [Zn] as principal constituent

Industry

CPC
H01L2224/29318

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29318Zinc [Zn] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radiation-hardened package for an electronic device
- Patent number 11,276,619
- Issue date Mar 15, 2022
- AMS International AG
- Jens Hofrichter
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Information handling system low form factor interface thermal manag...
- Patent number 10,985,086
- Issue date Apr 20, 2021
- Dell Products L.P.
- Travis C. North
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive composition
- Patent number 10,689,550
- Issue date Jun 23, 2020
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material with ion scavenger
- Patent number 10,428,257
- Issue date Oct 1, 2019
- Honeywell International Inc.
- Ya Qun Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition and semiconductor device using same
- Patent number 10,174,226
- Issue date Jan 8, 2019
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material with ion scavenger
- Patent number 10,155,894
- Issue date Dec 18, 2018
- Honeywell International Inc.
- Ya Qun Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill material, laminated sheet and method for producing semico...
- Patent number 10,014,235
- Issue date Jul 3, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal joining structure using metal nanoparticles and metal joining...
- Patent number 9,960,140
- Issue date May 1, 2018
- Nippon Steel & Sumitomo Metal Corporation
- Kohei Tatsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,859,248
- Issue date Jan 2, 2018
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste for joining components of electronic modules, system and meth...
- Patent number 9,815,146
- Issue date Nov 14, 2017
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hermann Oppermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,412,702
- Issue date Aug 9, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film and non-conductive paste including zinc particl...
- Patent number 9,376,541
- Issue date Jun 28, 2016
- Samsung Electronics Co., Ltd.
- Un-byoung Kang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive sheet for manufacturing semiconductor device, manufacturin...
- Patent number 9,153,556
- Issue date Oct 6, 2015
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a component comprising cutting a carrier
- Patent number 9,123,764
- Issue date Sep 1, 2015
- Infineon Technologies AG
- Thomas Behrens
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 8,872,315
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Integrated circuits and a method for manufacturing an integrated ci...
- Patent number 8,749,075
- Issue date Jun 10, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,691,377
- Issue date Apr 8, 2014
- Panasonic Corporation
- Taichi Nakamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process for producing a semiconductor device
- Patent number 8,592,260
- Issue date Nov 26, 2013
- Nitto Denko Corporation
- Masami Oikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing/die bonding film
- Patent number 7,998,552
- Issue date Aug 16, 2011
- Nittok Denko Corporation
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of interconnecting terminals and method of mounting semicond...
- Patent number 7,524,748
- Issue date Apr 28, 2009
- Senju Metal Industry Co., Ltd.
- Kozo Fujimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive agent with ultrafine particles
- Patent number 7,262,511
- Issue date Aug 28, 2007
- Harima Chemicals, Inc.
- Katsuhisa Osako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240347012
- Publication date Oct 17, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20240120254
- Publication date Apr 11, 2024
- DEXERIALS CORPORATION
- Keisuke ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
- Publication number 20240067855
- Publication date Feb 29, 2024
- COOLER MATERIALS TECHNOLOGY INC.
- Po-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
- Publication number 20230197565
- Publication date Jun 22, 2023
- Jerrod P. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL
- Publication number 20220399317
- Publication date Dec 15, 2022
- Seoul Semiconductor Co., Ltd.
- Woo Gun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE
- Publication number 20220375817
- Publication date Nov 24, 2022
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION HANDLING SYSTEM LOW FORM FACTOR INTERFACE THERMAL MANAG...
- Publication number 20210013125
- Publication date Jan 14, 2021
- Dell Products L.P.
- Travis C. North
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RADIATION-HARDENED PACKAGE FOR AN ELECTRONIC DEVICE
- Publication number 20200176343
- Publication date Jun 4, 2020
- Jens Hofrichter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL WITH ION SCAVENGER
- Publication number 20190048245
- Publication date Feb 14, 2019
- HONEYWELL INTERNATIONAL INC.
- Ya Qun Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140264951
- Publication date Sep 18, 2014
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS
- Publication number 20140205851
- Publication date Jul 24, 2014
- Ravindranath V. MAHAJAN
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140183715
- Publication date Jul 3, 2014
- SUMITOMO BAKELITE CO., LTD.
- Naoya Kanamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM ADHESIVE
- Publication number 20140120356
- Publication date May 1, 2014
- ORMET CIRCUITS, INC.
- Catherine Shearer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PASTE FOR JOINING COMPONENTS OF ELECTRONIC MODULES, SYSTEM AND METH...
- Publication number 20140079472
- Publication date Mar 20, 2014
- Fraunhofer Gesellschaft zur Foederung der Angewandten Forschung e.V.
- Hermann Oppermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUITS AND A METHOD FOR MANUFACTURING AN INTEGRATED CI...
- Publication number 20140061878
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Component Comprising Cutting a Carrier
- Publication number 20140057396
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method of Fabricating an Electronic Device
- Publication number 20140042603
- Publication date Feb 13, 2014
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130157415
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20120104134
- Publication date May 3, 2012
- NITTO DENKO CORPORATION
- Sadahilio Misumi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120018890
- Publication date Jan 26, 2012
- PANASONIC CORPORATION
- Taichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20110084413
- Publication date Apr 14, 2011
- Yuichiro Shishido
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20110084408
- Publication date Apr 14, 2011
- Yuichiro Shishido
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROCESS FOR PRODUCING A SEMICONDUCTOR DEVICE
- Publication number 20100330745
- Publication date Dec 30, 2010
- Masami Oikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...
- Publication number 20100270515
- Publication date Oct 28, 2010
- Yuusuke YASUDA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Zinc [Zn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alternative compositions for high temperature soldering applications

Radiation-hardened package for an electronic device

Information handling system low form factor interface thermal manag...

Sintering pastes with high metal loading for semiconductor die atta...

Electrically conductive composition

Low-temperature bonding with spaced nanorods and eutectic alloys

Thermal interface material with ion scavenger

Adhesive composition and semiconductor device using same

Conductive connecting member and manufacturing method of same

Thermal interface material with ion scavenger

Semiconductor arrangement, semiconductor system and method of formi...

Metallic particle paste, cured product using same, and semiconducto...

Underfill material, laminated sheet and method for producing semico...

Metal joining structure using metal nanoparticles and metal joining...

Laser die backside film removal for integrated circuit (IC) packaging

Paste for joining components of electronic modules, system and meth...

Semiconductor packaging containing sintering die-attach material

Joint material, and jointed body

Laser die backside film removal for integrated circuit (IC) packaging

Non-conductive film and non-conductive paste including zinc particl...

Adhesive sheet for manufacturing semiconductor device, manufacturin...

Method of manufacturing a component comprising cutting a carrier

Electronic device and method of fabricating an electronic device

Electrically conductive bonding material, method of bonding with th...

Integrated circuits and a method for manufacturing an integrated ci...

Semiconductor device

Process for producing a semiconductor device

Dicing/die bonding film

Method of interconnecting terminals and method of mounting semicond...

Conductive adhesive agent with ultrafine particles

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL

LIQUID METAL THERMAL INTERFACE

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

INFORMATION HANDLING SYSTEM LOW FORM FACTOR INTERFACE THERMAL MANAG...

RADIATION-HARDENED PACKAGE FOR AN ELECTRONIC DEVICE

THERMAL INTERFACE MATERIAL WITH ION SCAVENGER

Joint Material, and Jointed Body

ELECTRONIC COMPONENT BONDING METHOD

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

CONDUCTIVE FILM ADHESIVE

PASTE FOR JOINING COMPONENTS OF ELECTRONIC MODULES, SYSTEM AND METH...

INTEGRATED CIRCUITS AND A METHOD FOR MANUFACTURING AN INTEGRATED CI...

Method of Manufacturing a Component Comprising Cutting a Carrier

Electronic Device and Method of Fabricating an Electronic Device

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

THERMOSETTING DIE-BONDING FILM

THERMOSETTING DIE-BONDING FILM

PROCESS FOR PRODUCING A SEMICONDUCTOR DEVICE

ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...