Zirconium [Zr] as principal constituent

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H01L2224/2917

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2917Zirconium [Zr] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 11,488,922
- Issue date Nov 1, 2022
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon carbide devices and methods for manufacturing the same
- Patent number 11,282,805
- Issue date Mar 22, 2022
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 10,957,669
- Issue date Mar 23, 2021
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor apparatus
- Patent number 10,847,699
- Issue date Nov 24, 2020
- Nikkiso Co., Ltd.
- Shoichi Niizeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, and semiconductor device
- Patent number 10,818,610
- Issue date Oct 27, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 10,748,865
- Issue date Aug 18, 2020
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solid-state wafer bonding of functional materials on substrates and...
- Patent number 10,679,964
- Issue date Jun 9, 2020
- The Regents of the University of California
- Shadi A. Dayeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joining
- Patent number 10,504,868
- Issue date Dec 10, 2019
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Back side metallization
- Patent number 10,431,562
- Issue date Oct 1, 2019
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature high reliability alloy for solder hierarchy
- Patent number 10,322,471
- Issue date Jun 18, 2019
- Alpha Assembly Solutions Inc.
- Pritha Choudhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Back side metallization
- Patent number 10,242,962
- Issue date Mar 26, 2019
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor light emitting device including cap structure and met...
- Patent number 10,205,075
- Issue date Feb 12, 2019
- GLO AB
- Anusha Pokhriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing composite structure with metal/metal bonding
- Patent number 9,905,531
- Issue date Feb 27, 2018
- Soitec
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanomicrocrystallite paste for pressureless sintering
- Patent number 9,875,983
- Issue date Jan 23, 2018
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming semiconductor packages with an intermetallic lay...
- Patent number 9,564,409
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of sealing and contacting substrates using laser light and e...
- Patent number 9,171,822
- Issue date Oct 27, 2015
- Corelase Oy
- Jarno Kangastupa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding wafers and structure of bonding part
- Patent number 9,136,232
- Issue date Sep 15, 2015
- Omron Corporation
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20250105086
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU
- Publication number 20240243091
- Publication date Jul 18, 2024
- The Indium Corporation of America
- Richard McDonough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...
- Publication number 20240170434
- Publication date May 23, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Chien-Hsun CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240162109
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUT...
- Publication number 20240145421
- Publication date May 2, 2024
- SOLAR APPLIED MATERIALS TECHNOLOGY CORP.
- Kuan-Neng CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071847
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...
- Publication number 20230090030
- Publication date Mar 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200176411
- Publication date Jun 4, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING S...
- Publication number 20190371759
- Publication date Dec 5, 2019
- Hitachi Automotive Systems, Ltd.
- Takuya AOYAGI
- G01 - MEASURING TESTING
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE
- Publication number 20190326226
- Publication date Oct 24, 2019
- LG CHEM, LTD.
- Hee Jung KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Silicon Carbide Devices and Methods for Manufacturing the Same
- Publication number 20190295981
- Publication date Sep 26, 2019
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Film Solder Bond
- Publication number 20180226533
- Publication date Aug 9, 2018
- AMBERWAVE INC.
- Anthony Lochtefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING CAP STRUCTURE AND MET...
- Publication number 20180159005
- Publication date Jun 7, 2018
- GLO AB
- Anusha POKHRIYAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING
- Publication number 20170317046
- Publication date Nov 2, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE WAFER BONDING OF FUNCTIONAL MATERIALS ON SUBSTRATES AND...
- Publication number 20170317050
- Publication date Nov 2, 2017
- The Regents of the University of California
- Shadi A. Dayeh
- G02 - OPTICS
Information Patent Application
Electronic Device and Method for Producing an Electronic Device
- Publication number 20170271295
- Publication date Sep 21, 2017
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20170200693
- Publication date Jul 13, 2017
- Hamamatsu Photonics K.K.
- Yoshimaro FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact
- Publication number 20170025375
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING
- Publication number 20150179603
- Publication date Jun 25, 2015
- SOITEC
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
- Publication number 20140339710
- Publication date Nov 20, 2014
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...
- Publication number 20140273318
- Publication date Sep 18, 2014
- Samsung Electronics Co., Ltd.
- Yung Ho RYU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20140232015
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20140235016
- Publication date Aug 21, 2014
- SIGETRONICS Inc.
- Jong-Moon PARK
- H01 - BASIC ELECTRIC ELEMENTS

Zirconium [Zr] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Electronic device with multi-layer contact and system

Electronic device with multi-layer contact and system

Chip assembly

Back side metallization

Silicon carbide devices and methods for manufacturing the same

Bonded structure and method of manufacturing the same

Semiconductor packages with an intermetallic layer

Back side metallization

Optical semiconductor apparatus

Adhesive film for semiconductor, and semiconductor device

Copper paste for joining, method for manufacturing joined body, and...

Solid-state wafer bonding of functional materials on substrates and...

Chip assembly

Solder joining

Method for producing electronic device with multi-layer contact

Method for applying a bonding layer

Back side metallization

Low temperature high reliability alloy for solder hierarchy

Back side metallization

Semiconductor light emitting device including cap structure and met...

Electronic device and method for producing an electronic device

Method for producing composite structure with metal/metal bonding

Nanomicrocrystallite paste for pressureless sintering

Method of forming a chip assembly with a die attach liquid

Method for applying a bonding layer

Methods of forming semiconductor packages with an intermetallic lay...

Bump package and methods of formation thereof

Method of sealing and contacting substrates using laser light and e...

Method for bonding wafers and structure of bonding part

Patents Applicationslast 30 patents

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR DEVICE

PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU

BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...

Package with Improved Heat Dissipation Efficiency and Method for Fo...

PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUT...

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR PACKAGE AND METHOD

DISPLAY PANEL

NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

Electronic Device with Multi-Layer Contact and System

PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING S...

ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE

Silicon Carbide Devices and Methods for Manufacturing the Same

Method for Producing Electronic Device With Multi-Layer Contact

Thin Film Solder Bond

SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING CAP STRUCTURE AND MET...

NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING

SOLID-STATE WAFER BONDING OF FUNCTIONAL MATERIALS ON SUBSTRATES AND...

Electronic Device and Method for Producing an Electronic Device

ELECTRONIC COMPONENT

Electronic Device with Multi-Layer Contact

METHOD FOR APPLYING A BONDING LAYER

METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING

METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART

METHOD OF FORMING METALLIC BONDING LAYER AND METHOD OF MANUFACTURIN...

Semiconductor Modules and Methods of Formation Thereof

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE