Zirconium [Zr] as principal constituent

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H01L2224/8147

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8147Zirconium [Zr] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
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- Intel Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
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- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bridge interconnection with layered interconnect structures
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- Issue date Jul 4, 2023
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 11,276,630
- Issue date Mar 15, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic...
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- Issue date Nov 23, 2021
- Seiko Epson Corporation
- Koji Ohashi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 11,133,257
- Issue date Sep 28, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,985,117
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 10,651,116
- Issue date May 12, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light-emitting diode display and method of manufacturing th...
- Patent number 10,529,790
- Issue date Jan 7, 2020
- Samsung Display Co., Ltd.
- Kyung Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,510,689
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 10,475,745
- Issue date Nov 12, 2019
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,446,455
- Issue date Oct 15, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,297,515
- Issue date May 21, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and method for producing an electronic device
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- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,049,990
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biocompatible bonding method and electronics package suitable for i...
- Patent number 9,849,297
- Issue date Dec 26, 2017
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 9,640,485
- Issue date May 2, 2017
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interposer, semiconductor device, and method for manufacturing...
- Patent number 9,263,376
- Issue date Feb 16, 2016
- INTEL DEUTSCHLAND GMBH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die packaging interposer structure and method
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- Issue date Dec 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die packaging interposer structure and method
- Patent number 8,884,412
- Issue date Nov 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die packaging interposer structure and method
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- Issue date Apr 22, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and thermal printing head using the same
- Patent number 4,806,725
- Issue date Feb 21, 1989
- Hitachi, Ltd.
- Yasunori Narizuka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421054
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seongho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20230009679
- Publication date Jan 12, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20210384129
- Publication date Dec 9, 2021
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20200219780
- Publication date Jul 9, 2020
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Solder Ball Protection in Packages
- Publication number 20200118947
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20200043852
- Publication date Feb 6, 2020
- Intel Corporation
- Yueli Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Ball Protection in Packages
- Publication number 20180337144
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Biocompatible Bonding Method and Electronics Package Suitable for I...
- Publication number 20170095671
- Publication date Apr 6, 2017
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20140353827
- Publication date Dec 4, 2014
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...
- Publication number 20140306355
- Publication date Oct 16, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Die Packaging Interposer Structure and Method
- Publication number 20140084459
- Publication date Mar 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Die Packaging Interposer Structure and Method
- Publication number 20140001612
- Publication date Jan 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS

Zirconium [Zr] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bridge interconnection with layered interconnect structures

Fingerprint sensor and manufacturing method thereof

Bridge interconnection with layered interconnect structures

Fingerprint sensor and manufacturing method thereof

Planar integrated circuit package interconnects

Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic...

Bridge interconnection with layered interconnect structures

Solder ball protection in packages

Planar integrated circuit package interconnects

Organic light-emitting diode display and method of manufacturing th...

Solder ball protection in packages

Bridge interconnection with layered interconnect structures

Fingerprint sensor and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Electronic device and method for producing an electronic device

Solder ball protection in packages

Bonding structure for semiconductor package and method of manufactu...

Biocompatible bonding method and electronics package suitable for i...

Bridge interconnection with layered interconnect structures

Electrode connection structure and electrode connection method

Chip interposer, semiconductor device, and method for manufacturing...

Multiple die packaging interposer structure and method

Multiple die packaging interposer structure and method

Multiple die packaging interposer structure and method

Integrated circuit device having die bonded to the polymer side of...

Circuit substrate and thermal printing head using the same

Patents Applicationslast 30 patents

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SEMICONDUCTOR PACKAGE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

Solder Ball Protection in Packages

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

Solder Ball Protection in Packages

Biocompatible Bonding Method and Electronics Package Suitable for I...

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

CHIP INTERPOSER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING...

Multiple Die Packaging Interposer Structure and Method

Multiple Die Packaging Interposer Structure and Method

INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...