Zirconium (Zr) as principal constituent

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H01L2224/4887

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/4887Zirconium (Zr) as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and wires
- Patent number 9,305,876
- Issue date Apr 5, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods and packaged semiconductor devices
- Patent number 9,263,412
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor chip having two metal layers on one face
- Patent number 8,643,176
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level processing method and structure to manufacture semicond...
- Patent number 8,431,977
- Issue date Apr 30, 2013
- Megica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method for preventing polymer cracking
- Patent number 8,344,524
- Issue date Jan 1, 2013
- Megica Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having contact elements with a specified cross se...
- Patent number 8,227,908
- Issue date Jul 24, 2012
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having improved contact interface reliability...
- Patent number 8,193,624
- Issue date Jun 5, 2012
- Amkor Technology, Inc.
- Eun Sook Sohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for fabricating the same
- Patent number 8,168,527
- Issue date May 1, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and semiconductor package
- Patent number 8,110,931
- Issue date Feb 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including embedded flip chip
- Patent number 7,768,108
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for fabricating the same
- Patent number 7,582,966
- Issue date Sep 1, 2009
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure with redistribution traces
- Patent number 7,425,767
- Issue date Sep 16, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold spot plated leadframes for semiconductor devices and method of...
- Patent number 7,148,085
- Issue date Dec 12, 2006
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum leadframes for semiconductor devices and method of fabrica...
- Patent number 6,933,177
- Issue date Aug 23, 2005
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum leadframes with two nickel layers
- Patent number 6,747,343
- Issue date Jun 8, 2004
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacture
- Patent number 6,164,523
- Issue date Dec 26, 2000
- Semiconductor Components Industries, LLC
- Joseph K. Fauty
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for obtaining metallurgical stability in integrated circuit...
- Patent number 5,455,195
- Issue date Oct 3, 1995
- Texas Instruments Incorporated
- Thomas H. Ramsey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
Packaging Methods and Packaged Semiconductor Devices
- Publication number 20140367867
- Publication date Dec 18, 2014
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20140103537
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kazuhiro KAIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip Having Two Metal Layers on One Face
- Publication number 20130027113
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
- Publication number 20130009295
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20120286293
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device and Bonding Wire
- Publication number 20120267784
- Publication date Oct 25, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...
- Publication number 20110304008
- Publication date Dec 15, 2011
- Magica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND SEMICONDUCTOR PACKAGE
- Publication number 20100007004
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20100001291
- Publication date Jan 7, 2010
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20090291554
- Publication date Nov 26, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP
- Publication number 20090230537
- Publication date Sep 17, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20080054457
- Publication date Mar 6, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH REDISTRIBUTION TRACES
- Publication number 20080012132
- Publication date Jan 17, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD FOR PREVENTING POLYMER CRACKING
- Publication number 20070212869
- Publication date Sep 13, 2007
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
- Publication number 20040188810
- Publication date Sep 30, 2004
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gold spot plated leadframes for semiconductor devices and method of...
- Publication number 20040113241
- Publication date Jun 17, 2004
- Donald C. Abbott
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Micromechanical device contact terminals free of particle generation
- Publication number 20030107137
- Publication date Jun 12, 2003
- Roger J. Stierman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
- Publication number 20030107112
- Publication date Jun 12, 2003
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT ASSEMBLY HAVING A PLATED LEADFRAME INCLUDING...
- Publication number 20030011048
- Publication date Jan 16, 2003
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS

Zirconium (Zr) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Electrode connection structure and electrode connection method

Device including a semiconductor chip and wires

Packaging methods and packaged semiconductor devices

Power semiconductor chip having two metal layers on one face

Wafer level processing method and structure to manufacture semicond...

Wire bonding method for preventing polymer cracking

Electronic device having contact elements with a specified cross se...

Semiconductor device having improved contact interface reliability...

Semiconductor chip and method for fabricating the same

Wafer and semiconductor package

Semiconductor die package including embedded flip chip

Semiconductor chip and method for fabricating the same

Chip structure with redistribution traces

Gold spot plated leadframes for semiconductor devices and method of...

Aluminum leadframes for semiconductor devices and method of fabrica...

Aluminum leadframes with two nickel layers

Electronic component and method of manufacture

Method for obtaining metallurgical stability in integrated circuit...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

Packaging Methods and Packaged Semiconductor Devices

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

Device Including a Semiconductor Chip and Wires

NITRIDE SEMICONDUCTOR DEVICE

Power Semiconductor Chip Having Two Metal Layers on One Face

Semiconductor Device Including a Contact Clip Having Protrusions an...

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

Semiconductor Device and Bonding Wire

WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...

WAFER AND SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

CHIP STRUCTURE WITH REDISTRIBUTION TRACES

WIRE BONDING METHOD FOR PREVENTING POLYMER CRACKING

Aluminum leadframes for semiconductor devices and method of fabrica...

Gold spot plated leadframes for semiconductor devices and method of...

Micromechanical device contact terminals free of particle generation

Aluminum leadframes for semiconductor devices and method of fabrica...

SEMICONDUCTOR CIRCUIT ASSEMBLY HAVING A PLATED LEADFRAME INCLUDING...