Zirconium (Zr) as principal constituent

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H01L2224/4867

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4867Zirconium (Zr) as principal constituent

Industries

Patents Grantslast 30 patents

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Device including a semiconductor chip and wires
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Information Patent Grant
Packaging methods and packaged semiconductor devices
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Semiconductor device including a contact clip having protrusions an...
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Information Patent Grant
Power semiconductor chip having two metal layers on one face
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Metal pad or metal bump over pad exposed by passivation layer
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- Issue date Mar 19, 2013
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Wire bonding method for preventing polymer cracking
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Semiconductor chip and method for fabricating the same
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Information Patent Grant
Wafer and semiconductor package
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Information Patent Grant
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Information Patent Grant
Semiconductor chip and method for fabricating the same
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Information Patent Grant
Gold spot plated leadframes for semiconductor devices and method of...
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Information Patent Grant
Aluminum leadframes for semiconductor devices and method of fabrica...
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Information Patent Grant
Aluminum leadframes with two nickel layers
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Information Patent Grant
Discrete semiconductor device having polymer resin as insulator and...
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Patents Applicationslast 30 patents

Information Patent Application
Packaging Methods and Packaged Semiconductor Devices
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- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device Including a Semiconductor Chip and Wires
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- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
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- Publication date Apr 17, 2014
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip Having Two Metal Layers on One Face
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- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
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- INFINEON TECHNOLOGIES AG
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- H01 - BASIC ELECTRIC ELEMENTS
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WAFER AND SEMICONDUCTOR PACKAGE
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- Hsiao Chuan CHANG
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Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
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SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP
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SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
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WIRE BONDING METHOD FOR PREVENTING POLYMER CRACKING
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- Publication date Sep 13, 2007
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER
- Publication number 20070026631
- Publication date Feb 1, 2007
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
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- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gold spot plated leadframes for semiconductor devices and method of...
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- Donald C. Abbott
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Information Patent Application
Micromechanical device contact terminals free of particle generation
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- Publication date Jun 12, 2003
- Roger J. Stierman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
- Publication number 20030107112
- Publication date Jun 12, 2003
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT ASSEMBLY HAVING A PLATED LEADFRAME INCLUDING...
- Publication number 20030011048
- Publication date Jan 16, 2003
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS

Zirconium (Zr) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device including a semiconductor chip and wires

Packaging methods and packaged semiconductor devices

Semiconductor device including a contact clip having protrusions an...

Power semiconductor chip having two metal layers on one face

Metal pad or metal bump over pad exposed by passivation layer

Wire bonding method for preventing polymer cracking

Semiconductor chip and method for fabricating the same

Wafer and semiconductor package

Semiconductor die package including embedded flip chip

Semiconductor chip and method for fabricating the same

Gold spot plated leadframes for semiconductor devices and method of...

Aluminum leadframes for semiconductor devices and method of fabrica...

Aluminum leadframes with two nickel layers

Discrete semiconductor device having polymer resin as insulator and...

Patents Applicationslast 30 patents

Packaging Methods and Packaged Semiconductor Devices

Device Including a Semiconductor Chip and Wires

NITRIDE SEMICONDUCTOR DEVICE

Power Semiconductor Chip Having Two Metal Layers on One Face

Semiconductor Device Including a Contact Clip Having Protrusions an...

WAFER AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

WIRE BONDING METHOD FOR PREVENTING POLYMER CRACKING

METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER

Aluminum leadframes for semiconductor devices and method of fabrica...

Gold spot plated leadframes for semiconductor devices and method of...

Micromechanical device contact terminals free of particle generation

Aluminum leadframes for semiconductor devices and method of fabrica...

SEMICONDUCTOR CIRCUIT ASSEMBLY HAVING A PLATED LEADFRAME INCLUDING...