2856571

Information

• Patent Grant
• 2856571

• References
• Source

• Patent Number

  2,856,571

• Date Filed

  Not available

• Date Issued

  Tuesday, October 14, 1958
  66 years ago

• CPC

  • H01L21/67138 - Apparatus for wiring semiconductor or solid state device
  • H01L21/14 - Treatment of the complete device
  • H01L21/67126 - Apparatus for sealing, encapsulating, glassing, decapsulating or the like
  • H01L23/3135 - Double encapsulation or coating and encapsulation
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

• US Classifications

  • 257 - Active solid-state devices
  • 264 - Plastic and nonmetallic article shaping or treating: processes
  • 438 - Semiconductor device manufacturing: process