2893185

Information

• Patent Grant
• 2893185

• References
• Source

• Patent Number

  2,893,185

• Date Filed

  Not available

• Date Issued

  Tuesday, July 7, 1959
  65 years ago

• CPC

  • H01L21/67126 - Apparatus for sealing, encapsulating, glassing, decapsulating or the like
  • H01L23/041 - the container being a hollow construction having no base used as a mounting for the semiconductor body
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • H01L2924/01079 - Gold [Au]
  • Y10S53/03 - Sealing electron tubes
  • Y10T29/53213 - Assembled to wire-type conductor

• US Classifications

  • 053 - Package making
  • 029 - Metal working
  • 257 - Active solid-state devices
  • 438 - Semiconductor device manufacturing: process
  • 445 - Electric lamp or space discharge component or device manufacturing