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2947079
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Information
Patent Grant
2947079
References
Source
Patent Number
2,947,079
Date Filed
Not available
Date Issued
Tuesday, August 2, 1960
64 years ago
CPC
H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
B23K3/0307 - with current flow through the workpiece
B23K2201/40 - Semiconductor devices
H01L2924/01005 - Boron [B]
H01L2924/01006 - Carbon [C]
H01L2924/01024 - Chromium [Cr]
H01L2924/0103 - Zinc [Zn]
H01L2924/01033 - Arsenic [As]
H01L2924/01049 - Indium [In]
H01L2924/01068 - Erbium [Er]
H01L2924/01082 - Lead [Pb]
H01L2924/01322 - Eutectic Alloys
H01L2924/014 - Solder alloys
Y10T29/49169 - Assembling electrical component directly to terminal or elongated conductor
US Classifications
228 - Metal fusion bonding
029 - Metal working
257 - Active solid-state devices
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