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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/01024Chromium [Cr]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and electronic module with new routing possibi...
- Patent number RE49970
- Issue date May 14, 2024
- IMBERATEK, LLC
- Antti Kivikero
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,810,881
- Issue date Nov 7, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective surface layer on under bump metallurgy for solder joining
- Patent number 11,682,640
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,545,454
- Issue date Jan 3, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 11,515,272
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 11,456,258
- Issue date Sep 27, 2022
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microspring structure for hardware trusted platform module
- Patent number 11,289,443
- Issue date Mar 29, 2022
- Palo Alto Research Center Incorporated
- Warren B. Jackson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,244,917
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,171,102
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 11,158,605
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,094,657
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,071,207
- Issue date Jul 20, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,031,310
- Issue date Jun 8, 2021
- QUALCOMM Incorporated
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,011,489
- Issue date May 18, 2021
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,004,817
- Issue date May 11, 2021
- SOCIONEXT INC.
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and electronic module with new routing possibi...
- Patent number RE48539
- Issue date Apr 27, 2021
- IMBERATEK, LLC
- Antti Kivikero
Information Patent Grant
Semiconductor device and method of using leadframe bodies to form o...
- Patent number 10,903,183
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 10,847,459
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, and semiconductor device
- Patent number 10,818,610
- Issue date Oct 27, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,763,220
- Issue date Sep 1, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 10,765,006
- Issue date Sep 1, 2020
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,651,144
- Issue date May 12, 2020
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 10,629,555
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming PIP with inner known goo...
- Patent number RE47923
- Issue date Mar 31, 2020
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240413026
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404904
- Publication date Dec 5, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...
- Publication number 20240321804
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSABLE ATTACHMENT SYSTEM
- Publication number 20240213212
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014159
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230102799
- Publication date Mar 30, 2023
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20230085696
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
- Publication number 20220165691
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210233882
- Publication date Jul 29, 2021
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, CURED FILM, METHOD FOR PRODUCING CU...
- Publication number 20210116810
- Publication date Apr 22, 2021
- TORAY INDUSTRIES, INC.
- Keika HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20210074627
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...
- Publication number 20200373272
- Publication date Nov 26, 2020
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200235064
- Publication date Jul 23, 2020
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Stretchable Form of Single Crystal Silicon for High Performance Ele...
- Publication number 20200013720
- Publication date Jan 9, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190393177
- Publication date Dec 26, 2019
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326242
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE
- Publication number 20190326226
- Publication date Oct 24, 2019
- LG CHEM, LTD.
- Hee Jung KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326243
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20190198472
- Publication date Jun 27, 2019
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20190157215
- Publication date May 23, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190157230
- Publication date May 23, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20190122979
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Metallization Stack and Methods of Formation Thereof
- Publication number 20190051624
- Publication date Feb 14, 2019
- INFINEON TECHNOLOGIES AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module
- Publication number 20180376597
- Publication date Dec 27, 2018
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module with EMI protection
- Publication number 20180352689
- Publication date Dec 6, 2018
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20180334708
- Publication date Nov 22, 2018
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...

Chromium [Cr]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die contact structure and method

Manufacturing method and electronic module with new routing possibi...

Semiconductor components having conductive vias with aligned back s...

Semiconductor device

Protective surface layer on under bump metallurgy for solder joining

Semiconductor device

Semiconductor die contact structure and method

Metal paste for joints, assembly, production method for assembly, s...

Stretchable form of single crystal silicon for high performance ele...

Microspring structure for hardware trusted platform module

Method of making a pillar structure having a non-metal sidewall pro...

Multilayer pillar for reduced stress interconnect and method of mak...

Designs and methods for conductive bumps

Multilayer pillar for reduced stress interconnect and method of mak...

Semiconductor packaging structure and method

Multilayer pillar for reduced stress interconnect and method of mak...

Electronic module

Chip package

Semiconductor device

Semiconductor device and method for manufacturing the same

Manufacturing method and electronic module with new routing possibi...

Semiconductor device and method of using leadframe bodies to form o...

Semiconductor die contact structure and method

Adhesive film for semiconductor, and semiconductor device

Semiconductor integrated circuit device

Systems and methods for electromagnetic interference shielding

Electronic module

Semiconductor device

Packaging devices and methods of manufacture thereof

Semiconductor device and method of forming PIP with inner known goo...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...

REVERSABLE ATTACHMENT SYSTEM

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor Die Contact Structure and Method

PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

SEMICONDUCTOR DEVICE

RESIN COMPOSITION, RESIN SHEET, CURED FILM, METHOD FOR PRODUCING CU...

Semiconductor Die Contact Structure and Method

High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...

SEMICONDUCTOR DEVICE

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

Stretchable Form of Single Crystal Silicon for High Performance Ele...

SEMICONDUCTOR DEVICE

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

Semiconductor Die Contact Structure and Method

Solder Metallization Stack and Methods of Formation Thereof

WIRE BONDING SYSTEMS AND RELATED METHODS

Electronic module

Electronic module with EMI protection

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...