3019489

Information

• Patent Grant
• 3019489

• References
• Source

• Patent Number

  3,019,489

• Date Filed

  Not available

• Date Issued

  Tuesday, February 6, 1962
  63 years ago

• CPC

  • H05K3/103 - by bonding or embedding conductive wires or strips
  • H05K7/06 - on insulating boards
  • H05K2201/09118 - Moulded substrate
  • H05K2201/10287 - Metal wires as connectors or conductors
  • H05K2201/10651 - Component having two leads
  • H05K2201/10977 - Encapsulated connections
  • Y10S425/811 - Stencil
  • Y10T29/49162 - by using wire as conductive path

• US Classifications

  • 264 - Plastic and nonmetallic article shaping or treating: processes
  • 029 - Metal working
  • 174 - Electricity: conductors and insulators
  • 361 - Electricity: electrical systems and devices
  • 425 - Plastic article or earthenware shaping or treating: apparatus
  • 439 - Electrical connectors