3240647

Information

• Patent Grant
• 3240647

• References
• Source

• Patent Number

  3,240,647

• Date Filed

  Not available

• Date Issued

  Tuesday, March 15, 1966
  58 years ago

• CPC

  • H05K3/20 - by affixing prefabricated conductor pattern
  • H05K3/041 - by using a die for cutting the conductive material
  • H05K3/281 - by means of a preformed insulating foil
  • H05K3/386 - by the use of an organic polymeric bonding layer
  • H05K2201/09881 - Coating only between conductors
  • H05K2203/0108 - Male die used for patterning, punching or transferring
  • H05K2203/0156 - Temporary polymeric carrier or foil
  • H05K2203/0531 - Decalcomania
  • H05K2203/063 - of preperforated insulating layer
  • H05K2203/1545 - Continuous processing
  • Y10T29/49124 - On flat or curved insulated base, e.g., printed circuit, etc.

• US Classifications

  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 029 - Metal working