3372733

Information

• Patent Grant
• 3372733

• References
• Source

• Patent Number

  3,372,733

• Date Filed

  Not available

• Date Issued

  Tuesday, March 12, 1968
  57 years ago

• CPC

  • H01L23/4006 - with bolts or screws
  • H01J19/74 - Cooling arrangements
  • H01L2023/405 - heatsink to package
  • H01L2023/4062 - heatsink to or through board or cabinet
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

• US Classifications

  • 165 - Heat exchange
  • 257 - Active solid-state devices