3404213

Information

• Patent Grant
• 3404213

• References
• Source

• Patent Number

  3,404,213

• Date Filed

  Not available

• Date Issued

  Tuesday, October 1, 1968
  56 years ago

• CPC

  • H01L23/057 - the leads being parallel to the base
  • H01J5/28 - between conductive parts of vessel
  • H01J5/44 - Annular seals disposed between the ends of the vessel
  • H01L21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L23/047 - the other leads being parallel to the base
  • H01J2893/0036 - having wires, ribbons or tubes placed between two vessel walls and being perpendicular to at least one of said walls
  • H01J2893/0044 - Direct connection between two metal elements, in particular via material a connecting material
  • H01L2224/48091 - Arched
  • H01L2224/48247 - connecting the wire to a bond pad of the item
  • Y10T29/49211 - of fused material

• US Classifications

  • 174 - Electricity: conductors and insulators
  • 029 - Metal working
  • 257 - Active solid-state devices
  • 438 - Semiconductor device manufacturing: process