3543393

Information

• Patent Grant
• 3543393

• References
• Source

• Patent Number

  3,543,393

• Date Filed

  Not available

• Date Issued

  Tuesday, December 1, 1970
  54 years ago

• CPC

  • H01L25/074 - Stacked arrangements of non-apertured devices
  • G21C5/123 - Moderators made of organic materials
  • G21D9/00 - Arrangements to provide heat for purposes other than conversion into power
  • H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/014 - Solder alloys
  • Y02E30/40 - Other aspects relating to nuclear fission
  • Y10T29/49789 - Obtaining plural product pieces from unitary workpiece

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 029 - Metal working
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 976 - Nuclear technology