Stacked arrangements of non-apertured devices

Industry

CPC
H01L25/074

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/074Stacked arrangements of non-apertured devices

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional, monolithically stacked field effect transistors...
- Patent number 12,148,833
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sung Dae Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor structure with reflection layer
- Patent number 12,142,599
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Teresa J. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding and isolation techniques for stacked transistor structures
- Patent number 12,132,079
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with heat dissipation structure and method...
- Patent number 12,131,976
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package with connection lug
- Patent number 12,125,772
- Issue date Oct 22, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,094,819
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable quantum processor design
- Patent number 12,086,689
- Issue date Sep 10, 2024
- Google LLC
- Julian Shaw Kelly
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 12,062,651
- Issue date Aug 13, 2024
- Kabushiki Kaisha Toshiba
- Yasuhiro Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device assemblies and cooling devices for cooling heat-genera...
- Patent number 12,062,593
- Issue date Aug 13, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Autonomous electrical power sources
- Patent number 12,048,850
- Issue date Jul 30, 2024
- Face International Corporation
- Clark D Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including stacked gate structures with d...
- Patent number 12,051,697
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus
- Patent number 12,033,918
- Issue date Jul 9, 2024
- LG Electronics Inc.
- Myeon Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of semiconductor devices between stacked substrates
- Patent number 12,009,351
- Issue date Jun 11, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor with extended life time flash memory and fabrication...
- Patent number 12,004,345
- Issue date Jun 4, 2024
- Hon Hai Precision Industry Co., Ltd.
- Chung-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of stacked transistors attached by solder balls
- Patent number 11,984,387
- Issue date May 14, 2024
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structurally embedded and inhospitable environment systems having a...
- Patent number 11,957,922
- Issue date Apr 16, 2024
- Face International Corporation
- Clark D Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-silicon N-type and P-type stacked transistors for integrated ci...
- Patent number 11,935,891
- Issue date Mar 19, 2024
- Intel Corporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked devices and methods of fabrication
- Patent number 11,916,054
- Issue date Feb 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with key pattern and electronic system includi...
- Patent number 11,889,688
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Chang-Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter
- Patent number 11,837,523
- Issue date Dec 5, 2023
- Tesla, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead between a plurality of encapsulated MOSFETs
- Patent number 11,830,792
- Issue date Nov 28, 2023
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module for improved heat dissipation and power...
- Patent number 11,823,996
- Issue date Nov 21, 2023
- Huawei Technologies Co., Ltd.
- Hamit Duran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional, monolithically stacked field effect transistors...
- Patent number 11,817,501
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Sung Dae Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,810,903
- Issue date Nov 7, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter with co-packaged secondary field effect transistors...
- Patent number 11,799,384
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Todd Edward Takken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 11,790,219
- Issue date Oct 17, 2023
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MEMORY ARRAY AND INTEGRATED CIRCUIT
- Publication number 20240387475
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Sheng Yun
- G11 - INFORMATION STORAGE
Information Patent Application
AUTONOMOUS ELECTRICAL POWER SOURCES
- Publication number 20240382774
- Publication date Nov 21, 2024
- FACE INTERNATIONAL CORPORATION
- Clark D. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20240379492
- Publication date Nov 14, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding and Isolation Techniques for Stacked Transistor Structures
- Publication number 20240379748
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363533
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS AND METHOD...
- Publication number 20240355878
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Seung Min SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING STACKED GATE STRUCTURES WITH D...
- Publication number 20240355824
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE THIN FILM TRANSISTOR, SEMICONDUCTOR DEVICE AND DISPLAY...
- Publication number 20240332425
- Publication date Oct 3, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Jiayu HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Incorporating Nitrogen in Dipole Engineering for Multi-Threshold Vo...
- Publication number 20240290630
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei Ying Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding and Isolation Techniques for Stacked Transistor Structures
- Publication number 20240282815
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding and Isolation Techniques for Stacked Transistor Structures
- Publication number 20240282814
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WITH EXTENDED LIFE TIME FLASH MEMORY
- Publication number 20240284667
- Publication date Aug 22, 2024
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHUNG-YI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240274585
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR
- Publication number 20240266262
- Publication date Aug 8, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED TRANSISTOR STRUCTURE WITH BARRIER LAYER BETWEEN UPPER GA...
- Publication number 20240243172
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Jaejik Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HYBRID BONDING AND METHOD FOR MANUFACT...
- Publication number 20240213195
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-De HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION
- Publication number 20240194532
- Publication date Jun 13, 2024
- Google LLC
- Zhimin Jamie Yao
- B82 - NANO-TECHNOLOGY
Information Patent Application
Gate Dielectric for Bonded Stacked Transistors
- Publication number 20240186394
- Publication date Jun 6, 2024
- International Business Machines Corporation
- RUQIANG BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE
- Publication number 20240178108
- Publication date May 30, 2024
- PIERBURG GMBH
- MIKA NUOTIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE LAYER STACK FLIP-CHIP MOUNTED TO A LEADFRAME BY USE OF A COPP...
- Publication number 20240162125
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
- Publication number 20240088120
- Publication date Mar 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-In-One Lead Frame Package
- Publication number 20240071878
- Publication date Feb 29, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LONG CHANNEL TRANSISTOR
- Publication number 20240063189
- Publication date Feb 22, 2024
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055329
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET) AND METHOD OF...
- Publication number 20240021586
- Publication date Jan 18, 2024
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DESIGN FOR III-NITRIDE DEVICES
- Publication number 20240014312
- Publication date Jan 11, 2024
- Transphorm Technology, Inc.
- Yifeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL, MONOLITHICALLY STACKED FIELD EFFECT TRANSISTORS...
- Publication number 20240014322
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Sung Dae Suk
- H01 - BASIC ELECTRIC ELEMENTS

Stacked arrangements of non-apertured devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with lead between a plurality of encapsulated...

Bonding structures and methods for forming the same

Three-dimensional, monolithically stacked field effect transistors...

Stacked transistor structure with reflection layer

Bonding and isolation techniques for stacked transistor structures

Semiconductor structure with heat dissipation structure and method...

Method of forming a semiconductor package with connection lug

Method for forming package structure

Scalable quantum processor design

Semiconductor device

Power device assemblies and cooling devices for cooling heat-genera...

Autonomous electrical power sources

Package and package-on-package structure having elliptical columns...

Integrated circuit devices including stacked gate structures with d...

Cooling apparatus

Plurality of semiconductor devices between stacked substrates

Semiconductor with extended life time flash memory and fabrication...

Plurality of stacked transistors attached by solder balls

Structurally embedded and inhospitable environment systems having a...

Non-silicon N-type and P-type stacked transistors for integrated ci...

Stacked devices and methods of fabrication

Semiconductor package with solder standoff

Semiconductor device with key pattern and electronic system includi...

Inverter

Lead between a plurality of encapsulated MOSFETs

Power semiconductor module for improved heat dissipation and power...

Three-dimensional, monolithically stacked field effect transistors...

Semiconductor structure and forming method thereof

Power converter with co-packaged secondary field effect transistors...

Three dimensional circuit implementing machine trained network

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

METHODS OF MANUFACTURING MEMORY ARRAY AND INTEGRATED CIRCUIT

AUTONOMOUS ELECTRICAL POWER SOURCES

SEMICONDUCTOR STRUCTURE WITH HEAT DISSIPATION STRUCTURE AND METHOD...

Bonding and Isolation Techniques for Stacked Transistor Structures

PACKAGE STRUCTURE

INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS AND METHOD...

INTEGRATED CIRCUIT DEVICES INCLUDING STACKED GATE STRUCTURES WITH D...

METAL OXIDE THIN FILM TRANSISTOR, SEMICONDUCTOR DEVICE AND DISPLAY...

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

Incorporating Nitrogen in Dipole Engineering for Multi-Threshold Vo...

Bonding and Isolation Techniques for Stacked Transistor Structures

Bonding and Isolation Techniques for Stacked Transistor Structures

SEMICONDUCTOR WITH EXTENDED LIFE TIME FLASH MEMORY

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING

CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR

3D-STACKED TRANSISTOR STRUCTURE WITH BARRIER LAYER BETWEEN UPPER GA...

SEMICONDUCTOR STRUCTURE WITH HYBRID BONDING AND METHOD FOR MANUFACT...

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

Gate Dielectric for Bonded Stacked Transistors

POWER SEMICONDUCTOR PACKAGE

DIODE LAYER STACK FLIP-CHIP MOUNTED TO A LEADFRAME BY USE OF A COPP...

STACKED DEVICES AND METHODS OF FABRICATION

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

Two-In-One Lead Frame Package

STACKED LONG CHANNEL TRANSISTOR

SEMICONDUCTOR DEVICE

STACKED COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET) AND METHOD OF...

INTEGRATED DESIGN FOR III-NITRIDE DEVICES

THREE-DIMENSIONAL, MONOLITHICALLY STACKED FIELD EFFECT TRANSISTORS...