Stacked arrangements of non-apertured devices

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H01L25/074

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/074Stacked arrangements of non-apertured devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device provided with a stack of two high electron mobili...
- Patent number 12,363,932
- Issue date Jul 15, 2025
- STMicroelectronics France
- Matthieu Nongaillard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,332
- Issue date Jul 15, 2025
- Mitsubishi Electric Corporation
- Ryoya Shirahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked devices and methods of fabrication
- Patent number 12,347,820
- Issue date Jul 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,342,573
- Issue date Jun 24, 2025
- Renesas Electronics Corporation
- Seiji Hirabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,341,105
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with improved inspectability of stacked semico...
- Patent number 12,334,418
- Issue date Jun 17, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power module and manufacturing method for the...
- Patent number 12,328,884
- Issue date Jun 10, 2025
- Nissan Motor Co., Ltd.
- Toshiharu Marui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising two high electron mobility transistors
- Patent number 12,302,625
- Issue date May 13, 2025
- STMicroelectronics France
- Matthieu Nongaillard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,302,634
- Issue date May 13, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming integrated electronic devices for converting and downscalin...
- Patent number 12,267,006
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ku Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor structures of integrated circuit devices including stacked...
- Patent number 12,249,603
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 12,248,869
- Issue date Mar 11, 2025
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array, integrated circuit including the same, and manufactur...
- Patent number 12,211,825
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Sheng Yun
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,176,275
- Issue date Dec 24, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional, monolithically stacked field effect transistors...
- Patent number 12,148,833
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sung Dae Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor structure with reflection layer
- Patent number 12,142,599
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Teresa J. Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding and isolation techniques for stacked transistor structures
- Patent number 12,132,079
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with heat dissipation structure and method...
- Patent number 12,131,976
- Issue date Oct 29, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package with connection lug
- Patent number 12,125,772
- Issue date Oct 22, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,094,819
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable quantum processor design
- Patent number 12,086,689
- Issue date Sep 10, 2024
- Google LLC
- Julian Shaw Kelly
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 12,062,651
- Issue date Aug 13, 2024
- Kabushiki Kaisha Toshiba
- Yasuhiro Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device assemblies and cooling devices for cooling heat-genera...
- Patent number 12,062,593
- Issue date Aug 13, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Autonomous electrical power sources
- Patent number 12,048,850
- Issue date Jul 30, 2024
- Face International Corporation
- Clark D Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including stacked gate structures with d...
- Patent number 12,051,697
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE COMPRISING TWO HIGH ELECTRON MOBILITY TRANSISTORS
- Publication number 20250241050
- Publication date Jul 24, 2025
- STMicroelectronics France
- Matthieu NONGAILLARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE PROBE PAD CONNECTION IN A STACKED SEMICONDUCTOR DEVICE
- Publication number 20250226324
- Publication date Jul 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND M...
- Publication number 20250227933
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Garam Kim
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Circuit Chip Including Arrays Of Multi-Threaded Dynamic...
- Publication number 20250218499
- Publication date Jul 3, 2025
- ATOMERA INCORPORATED
- Richard S. Roy
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250218968
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Buwon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRO...
- Publication number 20250220900
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Juseong MIN
- G11 - INFORMATION STORAGE
Information Patent Application
DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250210448
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Myoungchul Eum
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HETEROJUNCTION BIPOLAR TRANSISTOR WAFERS WITH BACKSIDE SUB-COLLECTO...
- Publication number 20250210607
- Publication date Jun 26, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Vibhor Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH STACKED STRUCTURE AND CAPACITOR ASSEMBLY LAYER
- Publication number 20250210596
- Publication date Jun 26, 2025
- Monolithic Power Systems, Inc.
- Ting Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING INTEGRATED ELECTRONIC DEVICES FOR CONVERTING AND DOWNSCALIN...
- Publication number 20250202349
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ku LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET WITH DOPED GATE DIELECTRIC
- Publication number 20250203963
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT EXTENSION FOR STACKED FIELD EFFECT TRANSISTOR
- Publication number 20250192003
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192113
- Publication date Jun 12, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yoshiyuki KUROKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE STRUCTURES WITH VARYING LAYER CHARACTERISTICS
- Publication number 20250194182
- Publication date Jun 12, 2025
- International Business Machines Corporation
- James P. Mazza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192094
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Wonil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS
- Publication number 20250183233
- Publication date Jun 5, 2025
- Mitsubishi Electric Corporation
- Kozo HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250169060
- Publication date May 22, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20250157975
- Publication date May 15, 2025
- NITTO DENKO CORPORATION
- Tsubasa OMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250151295
- Publication date May 8, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE
- Publication number 20250151294
- Publication date May 8, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250149402
- Publication date May 8, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Ting-An Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CLIP FOR VERTICALLY STACKED DIE ARRANGEMENT
- Publication number 20250096082
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Mei Yih Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE
- Publication number 20250096084
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER CONVERTER
- Publication number 20250070095
- Publication date Feb 27, 2025
- LX Semicon Co., Ltd.
- In Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING SCHOTT...
- Publication number 20240429208
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anupam Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE GATE DIELECTRICS FOR MONOLITHIC STACKED DEVICES
- Publication number 20240429277
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MEMORY ARRAY AND INTEGRATED CIRCUIT
- Publication number 20240387475
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Sheng Yun
- G11 - INFORMATION STORAGE
Information Patent Application
AUTONOMOUS ELECTRICAL POWER SOURCES
- Publication number 20240382774
- Publication date Nov 21, 2024
- FACE INTERNATIONAL CORPORATION
- Clark D. Boyd
- H01 - BASIC ELECTRIC ELEMENTS

Stacked arrangements of non-apertured devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device provided with a stack of two high electron mobili...

Semiconductor device

Stacked devices and methods of fabrication

Semiconductor device

Semiconductor device

Semiconductor module with improved inspectability of stacked semico...

Semiconductor device, power module and manufacturing method for the...

Semiconductor device having a heat dissipation structure connected...

Electronic device comprising two high electron mobility transistors

Semiconductor structure and manufacturing method thereof

Forming integrated electronic devices for converting and downscalin...

Resistor structures of integrated circuit devices including stacked...

Three dimensional circuit implementing machine trained network

Packaged electronic device with film isolated power stack

Memory array, integrated circuit including the same, and manufactur...

Semiconductor device and a method of manufacturing a semiconductor...

Semiconductor device with lead between a plurality of encapsulated...

Bonding structures and methods for forming the same

Three-dimensional, monolithically stacked field effect transistors...

Stacked transistor structure with reflection layer

Bonding and isolation techniques for stacked transistor structures

Semiconductor structure with heat dissipation structure and method...

Method of forming a semiconductor package with connection lug

Method for forming package structure

Scalable quantum processor design

Semiconductor device

Power device assemblies and cooling devices for cooling heat-genera...

Autonomous electrical power sources

Package and package-on-package structure having elliptical columns...

Integrated circuit devices including stacked gate structures with d...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE COMPRISING TWO HIGH ELECTRON MOBILITY TRANSISTORS

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

DIE-TO-DIE PROBE PAD CONNECTION IN A STACKED SEMICONDUCTOR DEVICE

NON-VOLATILE MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND M...

Integrated Circuit Chip Including Arrays Of Multi-Threaded Dynamic...

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRO...

DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

HETEROJUNCTION BIPOLAR TRANSISTOR WAFERS WITH BACKSIDE SUB-COLLECTO...

POWER MODULE WITH STACKED STRUCTURE AND CAPACITOR ASSEMBLY LAYER

FORMING INTEGRATED ELECTRONIC DEVICES FOR CONVERTING AND DOWNSCALIN...

STACKED FET WITH DOPED GATE DIELECTRIC

BACKSIDE CONTACT EXTENSION FOR STACKED FIELD EFFECT TRANSISTOR

SEMICONDUCTOR DEVICE

STACKED DEVICE STRUCTURES WITH VARYING LAYER CHARACTERISTICS

SEMICONDUCTOR PACKAGE

POWER MODULE SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR APPARATUS

MEMORY DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

STORAGE DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

INTERCONNECT CLIP FOR VERTICALLY STACKED DIE ARRANGEMENT

INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE

POWER SEMICONDUCTOR MODULE AND POWER CONVERTER

THREE-DIMENSIONAL INTEGRATED CIRCUIT WITH TOP CHIP INCLUDING SCHOTT...

MULTIPLE GATE DIELECTRICS FOR MONOLITHIC STACKED DEVICES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

METHODS OF MANUFACTURING MEMORY ARRAY AND INTEGRATED CIRCUIT

AUTONOMOUS ELECTRICAL POWER SOURCES