3558999

Information

• Patent Grant
• 3558999

• References
• Source

• Patent Number

  3,558,999

• Date Filed

  Not available

• Date Issued

  Tuesday, January 26, 1971
  54 years ago

• CPC

  • H01P1/005 - Diode mounting means
  • H01L23/051 - another lead being formed by a cover plate parallel to the base plate
  • H01L23/16 - Fillings or auxiliary members in containers or encapsulations
  • H01L23/367 - Cooling facilitated by shape of device
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

• US Classifications

  • 257 - Active solid-state devices