another lead being formed by a cover plate parallel to the base plate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/051another lead being formed by a cover plate parallel to the base plate

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Patents Grantslast 30 patents

Information Patent Grant
Insulating substrate and power module using the same
- Patent number 12,183,654
- Issue date Dec 31, 2024
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with free-floating packaging concept
- Patent number 12,094,791
- Issue date Sep 17, 2024
- HITACHI ENERGY LTD
- Jagoda Dobrzynska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 12,002,722
- Issue date Jun 4, 2024
- HITACHI ENERGY LTD
- Zuzana Ptakova
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compartment shielding with metal frame and cap
- Patent number 11,776,861
- Issue date Oct 3, 2023
- STATS ChipPAC Pte. Ltd.
- Bokyeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon heat-dissipation package for compact electronic devices
- Patent number 11,742,255
- Issue date Aug 29, 2023
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical structure with bonded cover
- Patent number 11,685,650
- Issue date Jun 27, 2023
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogenous integration for RF, microwave and MM wave systems in p...
- Patent number 11,594,457
- Issue date Feb 28, 2023
- 3D GLASS SOLUTIONS, INC.
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stacked terminals
- Patent number 11,570,921
- Issue date Jan 31, 2023
- Tesla, Inc.
- Wenjun Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having an additional material with a comparat...
- Patent number 11,545,419
- Issue date Jan 3, 2023
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-pack semiconductor fixtures
- Patent number 11,488,927
- Issue date Nov 1, 2022
- ABB Schweiz AG
- Thomas Kendzia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer accommodation container
- Patent number 11,335,615
- Issue date May 17, 2022
- Achilles Corporation
- Masayuki Nishijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,183,485
- Issue date Nov 23, 2021
- Sumitomo Electric Industries, Ltd.
- Hirotaka Oomori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low parasitic inductance power module and double-faced heat-dissipa...
- Patent number 11,139,278
- Issue date Oct 5, 2021
- YANGZHOU GUOYANG ELECTRONIC CO., LTD.
- Ligang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,069,593
- Issue date Jul 20, 2021
- Mitsubishi Electric Corporation
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with active short circuit failure mode
- Patent number 11,056,408
- Issue date Jul 6, 2021
- ABB Power Grids Switzerland AG
- Chunlei Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor module
- Patent number 11,037,867
- Issue date Jun 15, 2021
- Robert Bosch GmbH
- Thomas Proepper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,037,907
- Issue date Jun 15, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power switching module and electronic power device integrating said...
- Patent number 10,998,831
- Issue date May 4, 2021
- INSTITUT VEDECOM
- Friedbald Kiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a three dimensional power module
- Patent number 10,930,572
- Issue date Feb 23, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Emmanuel Marcault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-resistive chip package including shielding structure
- Patent number 10,923,650
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Jae-gwon Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon heat-dissipation package for compact electronic devices
- Patent number 10,903,134
- Issue date Jan 26, 2021
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor switching device
- Patent number 10,892,245
- Issue date Jan 12, 2021
- ABB Power Grids Switzerland AG
- Tobias Wikstroem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power chip integration module, manufacturing method thereof, and do...
- Patent number 10,879,222
- Issue date Dec 29, 2020
- Hyundai Autron Co., Ltd.
- Han Sin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternator assembly having a gated diode arranged in a load path be...
- Patent number 10,879,384
- Issue date Dec 29, 2020
- Infineon Technologies AG
- Dirk Ahlers
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power semiconductor module with short circuit failure mode
- Patent number 10,872,830
- Issue date Dec 22, 2020
- ABB Schweiz AG
- Chunlei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal stabilization of inertial measurement units
- Patent number 10,845,375
- Issue date Nov 24, 2020
- AGJUNCTION LLC
- Jeremy Sinclair Sommer
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Electronic component device
- Patent number 10,818,580
- Issue date Oct 27, 2020
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,804,237
- Issue date Oct 13, 2020
- Denso Corporation
- Kazuhiko Sugiura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor power module comprising graphene
- Patent number 10,804,182
- Issue date Oct 13, 2020
- ABB Power Grids Switzerland AG
- Muhammad Nawaz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20250006566
- Publication date Jan 2, 2025
- Hitachi Astemo, Ltd.
- Nobutake TSUYUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429139
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429138
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20240395643
- Publication date Nov 28, 2024
- Sony Semiconductor Solutions Corporation
- Yoshihiro MAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ASSEMBLY FOR A CHIP PACKAGE
- Publication number 20240332098
- Publication date Oct 3, 2024
- ADVANCED MICRO DEVICES, INC.
- Suming HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213106
- Publication date Jun 27, 2024
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105645
- Publication date Mar 28, 2024
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240079363
- Publication date Mar 7, 2024
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Compartment Shielding With Metal Frame and Cap
- Publication number 20230402332
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- Bokyeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230268240
- Publication date Aug 24, 2023
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230246001
- Publication date Aug 3, 2023
- Rohm Co., Ltd.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED TERMINALS
- Publication number 20230171909
- Publication date Jun 1, 2023
- Tesla, Inc.
- Wenjun Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compartment Shielding With Metal Frame and Cap
- Publication number 20230071960
- Publication date Mar 9, 2023
- STATS ChipPAC Pte Ltd.
- Bokyeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC POWER MODULE
- Publication number 20230068223
- Publication date Mar 2, 2023
- PIERBURG GMBH
- MIKA NUOTIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230064063
- Publication date Mar 2, 2023
- Hitachi Astemo, Ltd.
- Kei SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Semiconductor Device
- Publication number 20220336300
- Publication date Oct 20, 2022
- Hitachi Energy Switzerland AG
- Zuzana Ptakova
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-PACK SEMICONDUCTOR FIXTURES
- Publication number 20220262763
- Publication date Aug 18, 2022
- ABB Schweiz AG
- Thomas Kendzia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES
- Publication number 20220254652
- Publication date Aug 11, 2022
- SIEMENS AKTIENGESELLSCHAFT
- Markus Lasch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device with Free-Floating Packaging Concept
- Publication number 20210384091
- Publication date Dec 9, 2021
- ABB Power Grids Switzerland AG
- Jagoda Dobrzynska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20210221678
- Publication date Jul 22, 2021
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicon Heat-Dissipation Package For Compact Electronic Devices
- Publication number 20210225726
- Publication date Jul 22, 2021
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogenous Integration for RF, Microwave and MM Wave Systems in P...
- Publication number 20210175136
- Publication date Jun 10, 2021
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PARASITIC INDUCTANCE POWER MODULE AND DOUBLE-FACED HEAT-DISSIPA...
- Publication number 20210151416
- Publication date May 20, 2021
- YANGZHOU GUOYANG ELECTRONIC CO.,LTD.
- Ligang NIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A THREE DIMENSIONAL POWER MODULE
- Publication number 20200343150
- Publication date Oct 29, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emmanuel MARCAULT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200294873
- Publication date Sep 17, 2020
- KABUSHIKI KAISHA TOSHIBA
- Ryohei GEJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ACCOMMODATION CONTAINER
- Publication number 20200105632
- Publication date Apr 2, 2020
- Achilles Corporation
- Masayuki Nishijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20200079646
- Publication date Mar 12, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20200058575
- Publication date Feb 20, 2020
- ROBERT BOSCH GmbH
- Thomas Proepper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SWITCHING DEVICE
- Publication number 20190363065
- Publication date Nov 28, 2019
- ABB Schweiz AG
- Tobias Wikstroem
- H01 - BASIC ELECTRIC ELEMENTS

another lead being formed by a cover plate parallel to the base plate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Insulating substrate and power module using the same

Power semiconductor device with free-floating packaging concept

Power semiconductor device

Compartment shielding with metal frame and cap

Silicon heat-dissipation package for compact electronic devices

Microelectromechanical structure with bonded cover

Heterogenous integration for RF, microwave and MM wave systems in p...

Semiconductor device with stacked terminals

Semiconductor package having an additional material with a comparat...

Press-pack semiconductor fixtures

Wafer accommodation container

Circuit package, an electronic circuit package, and methods for enc...

Semiconductor module

Low parasitic inductance power module and double-faced heat-dissipa...

Semiconductor device

Power semiconductor device with active short circuit failure mode

Semiconductor module

Semiconductor package and related methods

Power switching module and electronic power device integrating said...

Method for manufacturing a three dimensional power module

Magneto-resistive chip package including shielding structure

Silicon heat-dissipation package for compact electronic devices

Semiconductor switching device

Power chip integration module, manufacturing method thereof, and do...

Alternator assembly having a gated diode arranged in a load path be...

Power semiconductor module with short circuit failure mode

Thermal stabilization of inertial measurement units

Electronic component device

Semiconductor device

Semiconductor power module comprising graphene

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

LID ASSEMBLY FOR A CHIP PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE

MICROMECHANICAL STRUCTURE WITH BONDED COVER

Compartment Shielding With Metal Frame and Cap

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH STACKED TERMINALS

Compartment Shielding With Metal Frame and Cap

ELECTRIC POWER MODULE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Power Semiconductor Device

PRESS-PACK SEMICONDUCTOR FIXTURES

SECURING POWER SEMICONDUCTOR COMPONENTS TO CURVED SURFACES

Power Semiconductor Device with Free-Floating Packaging Concept

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

Silicon Heat-Dissipation Package For Compact Electronic Devices

Heterogenous Integration for RF, Microwave and MM Wave Systems in P...

LOW PARASITIC INDUCTANCE POWER MODULE AND DOUBLE-FACED HEAT-DISSIPA...

METHOD FOR MANUFACTURING A THREE DIMENSIONAL POWER MODULE

SEMICONDUCTOR DEVICE

WAFER ACCOMMODATION CONTAINER

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

SEMICONDUCTOR MODULE

SEMICONDUCTOR SWITCHING DEVICE