3654097

Information

• Patent Grant
• 3654097

• References
• Source

• Patent Number

  3,654,097

• Date Filed

  Not available

• Date Issued

  Tuesday, April 4, 1972
  52 years ago

• CPC

  • H05K3/4611 - by laminating two or more circuit boards
  • H05K3/428 - initial plating of through-holes in substrates having a metal pattern
  • H05K3/4626 - characterised by the insulating layers or materials
  • H05K2203/068 - Features of the lamination press or of the lamination process
  • Y10T428/298 - Physical dimension
  • Y10T428/31674 - Including natural oil or gum or rosin [e.g., linoleum, etc.]

• US Classifications

  • 216 - Etching a substrate: processes
  • 174 - Electricity: conductors and insulators
  • 205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions
  • 361 - Electricity: electrical systems and devices
  • 427 - Coating processes
  • 428 - Stock material or miscellaneous articles