3663874

Information

• Patent Grant
• 3663874

• References
• Source

• Patent Number

  3,663,874

• Date Filed

  Not available

• Date Issued

  Tuesday, May 16, 1972
  52 years ago

• CPC

  • H01L23/36 - Selection of materials, or shaping, to facilitate cooling or heating
  • H01L24/01 - Means for bonding being attached to, or being formed on, the surface to be connected
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L2924/12036 - PN diode
  • Y10S148/035 - Diffusion through a layer
  • Y10S148/144 - Shallow diffusion
  • Y10S148/145 - Shaped junctions

• US Classifications

  • 257 - Active solid-state devices
  • 148 - Metal treatment