3689985

Information

• Patent Grant
• 3689985

• References
• Source

• Patent Number

  3,689,985

• Date Filed

  Not available

• Date Issued

  Tuesday, September 12, 1972
  52 years ago

• CPC

  • H02J7/248 - characterised by the mechanical construction
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L23/045 - the other leads having an insulating passage through the base
  • H01L23/48 - Arrangements for conducting electric current to or from the solid state body in operation
  • H01L24/73 - Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
  • H01L2224/48091 - Arched
  • H01L2224/49113 - the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body
  • H01L2224/73265 - Layer and wire connectors
  • H01L2924/12035 - Zener diode
  • H01L2924/14 - Integrated circuits
  • Y10T29/49169 - Assembling electrical component directly to terminal or elongated conductor
  • Y10T29/49895 - Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
  • Y10T29/49899 - by multiple cooperating aligning means

• US Classifications

  • 228 - Metal fusion bonding
  • 029 - Metal working
  • 257 - Active solid-state devices
  • 269 - Work holders
  • 438 - Semiconductor device manufacturing: process