3699640

Information

• Patent Grant
• 3699640

• References
• Source

• Patent Number

  3,699,640

• Date Filed

  Not available

• Date Issued

  Tuesday, October 24, 1972
  52 years ago

• CPC

  • H01L21/67144 - Apparatus for mounting on conductive members
  • B23K20/02 - by means of a press; Diffusion bonding
  • H01L24/75 - Apparatus for connecting with bump connectors or layer connectors
  • H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L2224/75303 - of the pressing surface
  • H01L2224/75315 - Elastomer inlay
  • H01L2224/7598 - specially adapted for batch processes
  • H01L2224/75986 - Auxiliary members on the pressing surface
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/14 - Integrated circuits
  • Y10T29/49121 - Beam lead frame or beam lead device

• US Classifications

  • 228 - Metal fusion bonding
  • 029 - Metal working
  • 269 - Work holders