3857290

Information

• Patent Grant
• 3857290

• References
• Source

• Patent Number

  3,857,290

• Date Filed

  Not available

• Date Issued

  Tuesday, December 31, 1974
  50 years ago

• CPC

  • H05K3/3468 - Applying molten solder
  • H05K1/0268 - for electrical inspection or testing
  • G01N2013/0225 - of liquid metals or solder
  • H05K3/42 - Plated through-holes or plated via connections
  • H05K2201/09781 - Dummy conductors
  • H05K2203/046 - Means for drawing solder
  • H05K2203/162 - Testing a finished product
  • Y10T29/49004 - including measuring or testing of device or component part

• US Classifications

  • 073 - Measuring and testing
  • 029 - Metal working